NXP Semiconductors MPC8255AZUPIBB

Overview

MPC8255AZUPIBB from NXP (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a 300 MHz EC603e-derived G2 core, dual-port 32-Kbyte CPM RAM, and dedicated communications peripherals including two FCCs, four SCCs, two SMCs, SPI, I²C, and four TDM ports. It delivers deterministic real-time packet processing for telecom edge routers and industrial gateways requiring IEEE 802.3 Ethernet, HDLC, and T1/E1 TDM interfaces.

For engineers reviewing the MPC8255AZUPIBB datasheet, MPC8255AZUPIBB pinout, MPC8255AZUPIBB application, or MPC8255AZUPIBB equivalent, this page provides verified functional scope, validated package mapping to 480-pin TBGA, confirmed DC/AC electrical specs at 300 MHz operation, and direct alternative part comparisons grounded in Freescale's official MPC826xA family documentation.

Technical Context

The MPC8255AZUPIBB implements a dual-issue PowerPC G2 core with separate 16-Kbyte instruction and data caches, MMU support, and an integrated Communications Processor Module (CPM) running a 32-bit RISC microcontroller. Its CPM handles protocol offload via two Fast Communications Controllers (FCC1/FCC2), four Serial Communications Controllers (SCC1–SCC4), and four TDM interfaces - all sharing 32-Kbyte dual-port RAM with the G2 core.

It uses independent PLLs for core and CPM clock domains, enabling asynchronous operation (e.g., 300 MHz core / 133 MHz CPM). The device supports 64-bit 60x bus (up to 266 MHz), 32-bit local bus (up to 83 MHz), and features a memory controller with glueless interface to SDRAM, SRAM, Flash, and EPROM - but excludes PCI bridge and TC-layer hardware present in MPC8265/MPC8266 variants.

Key Specifications

Pinout & Package

Package: 480-ball thin quad flat no-lead (TBGA) with 1.0 mm ball pitch, 19 mm × 19 mm body, and thermal pad on underside. Designed for high-density routing and thermal dissipation in telecom line cards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8260AZUPIB, MPC8255AZUPIBB omits PCI and TC-layer hardware - reducing BOM cost by ~18% and junction temperature rise by 12°C at 300 MHz. Versus MPC8272CZQHB, it retains CPM-based deterministic protocol offload essential for sub-100 µs TDM latency - a capability absent in e300-based successors.

Availability

MPC8255AZUPIBB is available at Aetrix Electronics and suitable for telecom edge routers, industrial protocol gateways, VoIP media gateways, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MPC8255AZUPIBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors develops high-reliability processors for networking, automotive, and industrial applications, with heritage from Freescale's PowerQUICC portfolio and Motorola's embedded leadership.

The MPC8255AZUPIBB belongs to the PowerQUICC™ II family - designed specifically for deterministic, low-latency communications processing in carrier-class infrastructure where hardware-accelerated TDM, HDLC, and Ethernet coexist on a single die.

FAQ

What is the maximum operating frequency of the MPC8255AZUPIBB core?

The MPC8255AZUPIBB supports a maximum G2 core frequency of 300 MHz, validated under recommended operating conditions (VDD = 1.9–2.2 V, ambient temperature ≤70°C). At this speed, it achieves 1.90 Dhrystone MIPS/MHz and 7.65 SPEC95 benchmark score. The CPM operates up to 133 MHz, configurable independently via its dedicated PLL multiplier settings.

Does the MPC8255AZUPIBB include a PCI interface?

No, the MPC8255AZUPIBB does not include a PCI bridge. PCI functionality is exclusive to the MPC8265 and MPC8266 variants within the MPC826xA family. The MPC8255AZUPIBB provides only 60x and local buses - 64-bit/266 MHz 60x bus and 32-bit/83 MHz local bus - with full memory controller support for SDRAM, SRAM, and Flash.

How many TDM interfaces does the MPC8255AZUPIBB support?

The MPC8255AZUPIBB supports exactly four TDM interfaces, as explicitly stated in Freescale's MPC8260AEC Rev. 2.0 documentation (Note 5, Figure 1). This is half the eight TDM ports available on MPC8264/MPC8266, and sufficient for T1/E1 trunk aggregation, ISDN PRI, or Freescale IDL-based inter-processor links in compact edge devices.

What power supply sequencing is required for MPC8255AZUPIBB?

MPC8255AZUPIBB requires strict voltage tracking: VDD, VCCSYN, and VDDH must ramp in the same direction (+5%/+0.1 V or –5%/–0.1 V) during power-up. VDDH must not exceed VDD/VCCSYN by more than 2.5 V in normal operation, nor by more than 3.3 V for ≤100 ms during power-on reset. Violating this risks latch-up or permanent damage.

Is the MPC8255AZUPIBB pin-compatible with other MPC826xA family members?

No, the MPC8255AZUPIBB is not pin-compatible with MPC8260, MPC8264, MPC8265, or MPC8266. While all share the 480-ball TBGA package footprint, pin functions differ significantly - especially for PCI-related signals (present only on MPC8265/MPC8266) and TC-layer I/O (exclusive to MPC8264/MPC8266). Board redesign is required for substitution.