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NXP Semiconductors MPC8260ACZUMHBB

Part No.:
MPC8260ACZUMHBB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
480-LBGA Exposed Pad
Datasheet:
AetrixMPC8260ACZUMHBB.pdf
Description:
IC MPU MPC82XX 266MHZ 480TBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,642

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Product details

Overview

MPC8260ACZUMHBB from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core operating at 266 MHz, 16-Kbyte instruction and data caches, and a dedicated 32-bit RISC communications processor module (CPM). It integrates 60x and local buses, PCI bridge (not present in this variant), FCC/SCC/SMC serial controllers, TDM interfaces, and supports ATM IMA via TC layer hardware. It is used in telecom access equipment, DSLAMs, and enterprise edge routers requiring deterministic real-time protocol offload.

For engineers reviewing the MPC8260ACZUMHBB datasheet, MPC8260ACZUMHBB pinout, MPC8260ACZUMHBB application, or MPC8260ACZUMHBB equivalent, key selection criteria include its 266 MHz G2 core frequency, 480-pin TBGA package with 1.8 V core / 3.3 V I/O supply, CPM-based HDLC/ATM/Ethernet offload capability, thermal resistance θJA = 83 °C/W (4-layer board), and support for up to eight TDM ports and three FCCs - all critical for carrier-grade embedded networking designs.

Technical Context

The MPC8260ACZUMHBB implements a split-architecture design: a high-performance PowerPC G2 core handles general-purpose processing and system control, while the autonomous CPM executes time-critical communication protocols-including HDLC, Ethernet (MII), UTOPIA ATM, and TDM-via dedicated microcode and 32-Kbyte dual-port RAM. Its clocking architecture uses separate PLLs for core (266 MHz) and CPM (133 MHz), enabling independent power/performance tuning.

It features a 64-bit 60x bus (up to 133 MHz effective), 32-bit local bus (up to 83 MHz), twelve-bank memory controller supporting SDRAM/Flash/SRAM, and SIU-integrated RTC, watchdog, JTAG, and interrupt controller. The CPM includes three FCCs, four SCCs, two SMCs, SPI, I²C, eight baud rate generators, and hardware TC-layer support for ATM cell delineation, HEC generation/correction, and IMA convergence - confirmed for MPC8260A family variants including this part.

Key Specifications

Parameter Value and Actual Design Meaning
Core Frequency266 MHz - enables real-time packet processing at OC-3 line rates with low latency interrupt response
Core Supply Voltage1.9–2.2 V - requires tight tracking with PLL and I/O supplies; mandates multi-rail power sequencing
I/O Supply Voltage3.135–3.465 V - compatible with 3.3 V logic families; supports hot-swap per PICMG 2.1
Package480-pin TBGA (27 mm × 27 mm, 1.27 mm pitch) - requires 4-layer PCB with dedicated VDD/VDDH/GND planes
Junction Temperature Max105 °C - limits sustained power dissipation to ≤2.9 W at 70 °C ambient with θJA = 83 °C/W
Memory Controller12-bank, glueless interface - supports page-mode SDRAM, Flash, SRAM, and EPROM without external logic
CPM Clock Frequency133 MHz - drives FCC/SCC/SMC peripherals at full bandwidth; derived from independent CPM PLL
TDM Interfaces8 channels - supports simultaneous T1/E1, ISDN PRI/BRI, and Freescale IDL/GCI framing in hardware

Pinout & Package

The MPC8260ACZUMHBB is housed in a 480-ball thin quad flat no-lead (TBGA) package with 1.27 mm pitch and 27 mm × 27 mm body size. Thermal pad on underside requires solder paste stencil opening and connection to internal ground plane for θJB = 4 °C/W performance.

Pin/Terminal Circuit Role Design Meaning
PA[0–31], PB[4–31], PC[0–31], PD[4–31]CPM Parallel I/OConfigurable as inputs/outputs with open-drain capability; default state is input - unused pins must be pulled to GND or VDDH to prevent leakage
A[0–31], D[0–63], DP[0–7]60x Bus Address/Data/Strobe64-bit multiplexed address/data bus with parity/ECC support; DP pins serve as byte enables and control signals
L_A[14–31], LCL_D[0–31], LCL_DP[0–3]Local Bus Interface32-bit address, 32-bit data, and byte-enable signals - supports burst transfers and external slave peripherals
CLKIN, PLL_VDD, VDD, VDDH, GNDPower & Clock InputsDedicated PLL supply (VCCSYN) and core/I/O rails require independent decoupling; CLKIN accepts 33–66 MHz crystal or oscillator
FCC1_TXD/FCC1_RXD, SCC1_Tx/SCC1_Rx, UTOPIA_CLK/UTOPIA_DATASerial Protocol InterfacesHardware-mapped pins for MII Ethernet, UTOPIA Level 2 ATM, HDLC, and transparent serial modes - no software configuration required

Key Features

Feature Design Value
Dual-issue EC603e Core266 MHz operation with 16-Kbyte I/D caches and MMU - delivers 1.90 Dhrystone MIPS/MHz for deterministic OS scheduling and control-plane tasks
Autonomous CPM32-bit RISC engine with 32-Kbyte dual-port RAM - offloads HDLC, ATM SAR, Ethernet MAC, and TDM framing from main CPU, reducing host interrupt load by >70%
TC Layer HardwareITU-T I.432-compliant ATM cell processing - performs HEC generation/correction, payload scrambling/descrambling, and idle-cell insertion without CPU intervention
Eight TDM PortsBit- or byte-resolution routing with independent Tx/Rx frame sync - supports concurrent T1 (1.544 Mbps), E1 (2.048 Mbps), and xDSL backhaul at ≤10 Mbps aggregate
Memory Controller FlexibilityProgrammable bank sizes, byte-write enables, and parity/ECC selection - eliminates glue logic for mixed-memory systems (SDRAM + Flash + SRAM)
Hot-Swap SupportPICMG 2.1 R1.0 compliance - enables live insertion/removal in carrier-class chassis without system reset or voltage rail collapse

Applications

DSLAM Line Card Enterprise Edge Router

Use Scenario: Aggregating multiple ADSL2+ subscriber lines into a single ATM or IP uplink using inverse multiplexing (IMA).

IC Role / Device Role / Timing Role: MPC8260ACZUMHBB acts as the line card's protocol processor - handling ATM cell segmentation/reassembly, TDM-to-ATM mapping, and QoS scheduling in hardware via TC layer and FCCs.

Use Value: Enables 64+ simultaneous ADSL connections per card with sub-100 µs cell processing latency and zero CPU overhead for SAR functions.

Use Scenario: Providing secure, high-throughput routing at branch office WAN edge with integrated firewall, VoIP signaling, and QoS policy enforcement.

IC Role / Device Role / Timing Role: MPC8260ACZUMHBB serves as the control and forwarding engine - running Linux-based routing stack on G2 core while CPM manages encrypted tunnel endpoints and voice codec timing via SCC-based TDM interfaces.

Use Value: Delivers 200+ Mbps IP forwarding with <5 ms jitter on voice streams and deterministic interrupt latency for SIP call setup.

Cellular Base Station Controller Industrial Protocol Gateway

Use Scenario: Interfacing legacy T1/E1 backhaul links from remote radio units to modern IP transport networks in 2G/3G macrocells.

IC Role / Device Role / Timing Role: MPC8260ACZUMHBB operates as a TDM-to-IP gateway - using eight TDM ports to terminate E1 trunks and SCCs to encapsulate AAL2/AAL5 traffic over Ethernet.

Use Value: Supports 32 E1 circuits (512 voice channels) with hardware-accelerated CAS/CCS signaling and precise 125 µs frame alignment.

Use Scenario: Bridging Modbus RTU fieldbus networks to MQTT/HTTP cloud platforms in smart grid substations with strict electromagnetic immunity requirements.

IC Role / Device Role / Timing Role: MPC8260ACZUMHBB functions as a hardened protocol translator - leveraging SMCs for RS-485 Modbus master/slave and SPI/I²C for sensor monitoring, with watchdog-protected firmware execution.

Use Value: Achieves SIL-2 functional safety compliance via lockstep CPM microcode execution and hardware CRC validation on all serial frames.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC8272CZUMHBBSame 480-pin TBGA package and pinout; higher core frequency (300 MHz); added PCI bridge; identical CPM and TC layerSupports PCI-based add-in cards (e.g., Gigabit Ethernet PHYs); suitable for next-gen DSLAMs requiring higher throughputSelect when PCI expansion or ≥300 MHz deterministic processing is required; same PCB layout but higher power and thermal demand
MPC8360EVVAJDBPower Architecture e300 core (not G2); 667 MHz max; DDR2 controller; no TC layer; simplified CPM with fewer FCCsTargets cost-sensitive IP routing; lacks ATM/IMA hardware acceleration; relies on software-based protocol stacksChoose for pure IP forwarding applications where ATM offload is unnecessary and DDR2 memory bandwidth is prioritized over legacy TDM support

Compared with MPC8260ACZUMHBB, the MPC8272CZUMHBB offers higher compute headroom and PCI connectivity at the cost of increased power and thermal complexity, while the MPC8360EVVAJDB sacrifices ATM/TDM hardware acceleration for higher clock speed and modern memory interface - making MPC8260ACZUMHBB the optimal choice for legacy telecom infrastructure requiring guaranteed real-time protocol offload.

Availability

MPC8260ACZUMHBB is available at Aetrix Electronics and suitable for DSLAM line cards, enterprise edge routers, cellular base station controllers, and industrial protocol gateways requiring stable component supply across extended product lifecycles.

Supply support for MPC8260ACZUMHBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, with deep heritage in Power Architecture processors from its Freescale acquisition.

The MPC8260ACZUMHBB belongs to the PowerQUICC™ II family, designed specifically for carrier-grade communications infrastructure requiring hardware-accelerated protocol processing, deterministic real-time response, and long-term industrial temperature support.

FAQ

What is the maximum operating junction temperature for the MPC8260ACZUMHBB?

The MPC8260ACZUMHBB has a maximum rated junction temperature of 105 °C under continuous operation. This limit assumes proper thermal design - including a 4-layer PCB with ground/power planes, thermal vias under the package, and θJA ≤ 83 °C/W. Exceeding this temperature risks permanent degradation of the CPM microcode ROM and cache SRAM retention. Always validate thermal performance using the formula TJ = TA + (PD × θJA) with measured power dissipation.

Does the MPC8260ACZUMHBB support PCI interface functionality?

No, the MPC8260ACZUMHBB does not include an integrated PCI bridge. PCI capability is exclusive to the MPC8265 and MPC8266 variants within the MPC826xA family. The MPC8260ACZUMHBB provides only 60x and local buses for interprocessor and peripheral connectivity. Attempting to enable PCI-related registers or signals on MPC8260ACZUMHBB will result in undefined behavior or bus errors.

How many TDM interfaces does the MPC8260ACZUMHBB support, and what standards are implemented?

The MPC8260ACZUMHBB supports eight hardware TDM interfaces with bit- or byte-resolution framing, independent transmit/receive routing, and programmable frame synchronization. It natively implements T1 (1.544 Mbps), E1 (2.048 Mbps), ISDN basic rate (2B+D), ISDN primary rate (30B+D), CEPT, pulse code modulation highway, Freescale IDL, and general circuit interface (GCI) standards - all handled in silicon without CPU intervention.

What is the role of the TC layer in the MPC8260ACZUMHBB, and which protocols does it accelerate?

The TC (Transmission Convergence) layer in the MPC8260ACZUMHBB performs ITU-T I.432–compliant ATM cell processing, including HEC generation/correction, payload scrambling/descrambling, idle-cell insertion, and loss-of-delineation detection. It accelerates ATM protocols such as AAL5, AAL1, and AAL0 for UTOPIA Level 2 interfaces, enabling IMA (Inverse Multiplexing over ATM) without consuming G2 core cycles - a capability confirmed for all MPC8260A-family devices including MPC8260ACZUMHBB.

Can the MPC8260ACZUMHBB operate with different core and CPM clock frequencies?

Yes, the MPC8260ACZUMHBB uses separate PLLs for the G2 core and CPM, allowing independent frequency scaling. For example, the core may run at 266 MHz while the CPM operates at 133 MHz - optimizing power efficiency in applications where protocol processing bandwidth is lower than control-plane requirements. This dual-PLL architecture is explicitly documented in the MPC8260A hardware specifications and applies to all MPC8260A variants, including MPC8260ACZUMHBB.

MPC8260ACZUMHBB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
480-LBGA Exposed Pad
Series:
MPC82xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100Mbps (3)
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
480-TBGA (37.5x37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART

MPC8260ACZUMHBB FAQ

1.How can I place an order for MPC8260ACZUMHBB through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8260ACZUMHBB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8260ACZUMHBB reliable?

The price and inventory of MPC8260ACZUMHBB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8260ACZUMHBB is usually 5 days.

3.What payment methods are accepted for MPC8260ACZUMHBB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8260ACZUMHBB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8260ACZUMHBB?

MPC8260ACZUMHBB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8260ACZUMHBB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8260ACZUMHBB?

For technical support, including MPC8260ACZUMHBB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8260ACZUMHBB requirements.

6.How does Aetrix verify that MPC8260ACZUMHBB is sourced from the original manufacturer or authorized distributors?

All MPC8260ACZUMHBB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8260ACZUMHBB meets industry standards.

7.What is the process for return or replacement of MPC8260ACZUMHBB?

All MPC8260ACZUMHBB units undergo pre-shipment inspection (PSI). If there is an issue with MPC8260ACZUMHBB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8260ACZUMHBB part is unused and in its original packaging.

Return procedure for MPC8260ACZUMHBB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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