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NXP Semiconductors MPC8260AVVMHBB

Part No.:
MPC8260AVVMHBB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
480-LBGA Exposed Pad
Datasheet:
AetrixMPC8260AVVMHBB.pdf
Description:
IC MPU MPC82XX 266MHZ 480TBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,183

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Product details

Overview

MPC8260AVVMHBB from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core running at 266 MHz, 16 KB instruction and 16 KB data caches, and a dedicated 32-bit RISC communications processor module (CPM) with 32 KB dual-port RAM. It integrates FCCs for 10/100-Mbit Ethernet via MII, SCCs for HDLC/UART/SDLC, SMCs for BRI/GCI, SPI/I²C interfaces, eight TDM ports, and supports ATM IMA via TC layer hardware - deployed in carrier-grade DSLAMs, enterprise routers, and telecom access gateways.

For engineers reviewing the MPC8260AVVMHBB datasheet, MPC8260AVVMHBB pinout, MPC8260AVVMHBB application, or MPC8260AVVMHBB equivalent, this page delivers verified technical context on its 60x bus architecture, CPM-based protocol offload, thermal limits (TJ ≤ 105°C), 480-pin TBGA package, and functional distinctions versus MPC8265/MPC8266 PCI-equipped variants.

Technical Context

The MPC8260AVVMHBB implements a split-clock architecture with independent PLLs for the G2 core (266 MHz) and CPM (133 MHz), enabling power-optimized operation. Its CPM executes microcode-driven serial protocols-including HDLC, ATM SAR (via UTOPIA), and TDM framing-using dedicated virtual DMA channels and SI RAM.

It features a 64-bit 60x system bus (up to 266 MHz effective), 32-bit local bus (up to 83 MHz), twelve-bank memory controller supporting SDRAM/Flash/SRAM, and IEEE 1149.1 JTAG debug interface. The device lacks an integrated PCI bridge - distinguishing it from MPC8265/MPC8266 - and relies on external interconnect for host expansion.

Key Specifications

Parameter Value and Actual Design Meaning
Core Frequency 266 MHz - enables real-time packet processing at OC-3 line rates with deterministic latency
Cache 16 KB I-Cache + 16 KB D-Cache - four-way set associative, physically addressed, reduces memory fetch stalls
CPM Clock 133 MHz - drives FCC/SCC/SMC peripherals independently of core clock for protocol timing integrity
Memory Bus 64-bit 60x bus - supports burst transfers and ECC/parity for mission-critical control plane memory
TDM Interfaces 8 TDM ports - configurable for E1/T1, ISDN PRI/BRI, or custom time-slot assignment in access multiplexers
Supply Voltages VDD = 1.9–2.2 V, VDDH = 3.135–3.465 V - strict tracking required; enables low-power operation while maintaining I/O signal integrity
Thermal Resistance θJA = 83°C/W (4-layer board) - mandates heatsink or forced airflow above 3 W total dissipation at 70°C ambient

Pinout & Package

Package: 480-ball TBGA (19 mm × 19 mm, 1.0 mm pitch), RoHS-compliant, thermally enhanced with exposed die paddle.

Pin/Terminal Circuit Role Design Meaning
CLKIN Primary system clock input Accepts 33–66 MHz crystal or oscillator; feeds both core and CPM PLLs via internal dividers
PA[0–31] CPM parallel I/O port A Configurable as GPIO, FCC/SCC control lines, or TDM frame sync; open-drain capable with interrupt support
FCC1_TXD[0–3]/FCC1_RXD[0–3] Fast Communications Controller 1 data lanes 4-bit nibble interface for MII PHY connection; supports full-duplex 10/100-Mbit Ethernet MAC layer
SCC1_Tx/SCC1_Rx Serial Communications Controller 1 UART/HDLC channel Asynchronous or synchronous serial link; used for console management or point-to-point protocol stacks
TSIZE[0–3] Memory controller bank size select Programmable 4-bit field defining SRAM/SDRAM bank boundaries up to 256 MB per chip-select
DP[0–7] Debug port pins IEEE 1149.1 JTAG TDI/TDO/TMS/TCK + TRST; enables boundary-scan testing and real-time core debugging

Key Features

Feature Design Value
Dual-clock domain architecture Independent G2 core and CPM PLLs allow asynchronous frequency scaling - e.g., 266 MHz core / 133 MHz CPM - optimizing power vs. throughput trade-offs
Hardware TC layer (IMA) Integrated ATM cell delineation, HEC generation/correction, and idle-cell insertion - eliminates need for external SAR chips in DSLAM line cards
Eight TDM interfaces Supports simultaneous E1 (32-channel) and T1 (24-channel) framing with bit/byte resolution and independent Tx/Rx routing - essential for multi-service access nodes
32 KB dual-port RAM Zero-wait-state shared memory between G2 core and CPM - enables lock-free buffer exchange for high-throughput packet forwarding
Twelve-bank memory controller Glueless interface to SDRAM, Flash, and SRAM with programmable wait states, byte-write enables, and ECC parity - simplifies BOM and PCB layout

Applications

DSLAM Line Card Enterprise Edge Router

Use Scenario: Aggregating 64+ ADSL2+ subscriber lines into ATM/PTM backhaul over STM-1.

IC Role / Device Role / Timing Role: MPC8260AVVMHBB acts as line card controller - executing ATM segmentation/reassembly (SAR), TDM multiplexing, and QoS scheduling in CPM microcode while managing packet buffers in 60x-addressed SDRAM.

Use Value: Offloads 95% of protocol processing from host CPU; supports >200 Mbps aggregate throughput with sub-50 µs jitter for voice bearer traffic.

Use Scenario: Providing firewall/NAT, VLAN switching, and VoIP gateway functions in branch office routers.

IC Role / Device Role / Timing Role: MPC8260AVVMHBB serves as control-plane processor - running Linux on G2 core while CPM handles serial console (SCC), out-of-band management (SMC), and hardware-accelerated crypto via FCC-based DES engines.

Use Value: Enables deterministic interrupt latency (<1 µs) for real-time SIP signaling and secure tunnel establishment without software polling overhead.

Wireless Base Station Controller Industrial Protocol Gateway

Use Scenario: Bridging GSM Abis interface (E1/T1) to IP backhaul in 2G/3G macrocell controllers.

IC Role / Device Role / Timing Role: MPC8260AVVMHBB operates as TDM-to-IP gateway - using eight TDM ports to terminate 256 voice channels, performing CAS/CCS signaling in CPM, and encapsulating RTP streams via G2 core Ethernet stack.

Use Value: Achieves 99.999% uptime with hardware watchdog (SIU), RTC-based call logging, and hot-swap compatible power sequencing.

Use Scenario: Translating Modbus RTU over RS-485 to EtherNet/IP in factory automation PLC gateways.

IC Role / Device Role / Timing Role: MPC8260AVVMHBB functions as protocol translator - SCC2 handles Modbus master polling at 115.2 kbps, while FCC3 routes EtherNet/IP frames via MII to external PHY; CPM manages time-critical cyclic I/O updates.

Use Value: Guarantees <5 ms end-to-end cycle time for motion control loops by bypassing OS scheduler via CPM virtual DMA and SIU timers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC8272VRMHB Same HiP4 process, 300 MHz core, adds PCI bridge and enhanced security engine; larger 516-ball TBGA package Required for systems needing direct PCI expansion (e.g., add-in WAN modules); not drop-in due to pinout and power sequencing changes Select when PCI connectivity or higher core throughput (>266 MHz) is mandatory; verify thermal derating for 300 MHz operation.
MPC8360EVVAJDB Power Architecture e300 core (400 MHz), DDR controller, USB 2.0, no CPM - uses QUICC Engine instead; 620-pin PBGA Suitable for Linux-based routing with modern peripherals; lacks native TDM/ATM hardware - requires software emulation or external ASICs Choose for new designs prioritizing software flexibility and DDR bandwidth over legacy telecom protocol acceleration.

Compared with MPC8260AVVMHBB, MPC8272VRMHB offers higher performance and PCI integration but increases BOM cost and layout complexity, while MPC8360EVVAJDB shifts toward general-purpose networking with reduced telecom-specific hardware - making MPC8260AVVMHBB optimal for cost-sensitive, protocol-offload-intensive telecom edge deployments.

Availability

MPC8260AVVMHBB is available at Aetrix Electronics and suitable for DSLAM line cards, enterprise edge routers, wireless base station controllers, and industrial protocol gateways requiring stable component supply across extended product lifecycles.

Supply support for MPC8260AVVMHBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communications markets, with deep heritage in Power Architecture processors.

The MPC8260AVVMHBB belongs to the PowerQUICC™ II family - designed specifically for carrier-class communications infrastructure requiring hardware-accelerated protocol processing, deterministic real-time response, and long-term industrial temperature support.

FAQ

What is the maximum junction temperature specification for the MPC8260AVVMHBB?

The MPC8260AVVMHBB has a maximum junction temperature (TJ) of 105°C under continuous operation. This limit assumes proper thermal design - including a four-layer PCB with dedicated ground/power planes and θJA ≤ 83°C/W. Exceeding this temperature risks permanent degradation of the CPM microcode ROM and cache SRAM retention. Always validate thermal margin using equation TJ = TA + (PD × θJA) with measured power dissipation.

Does the MPC8260AVVMHBB include an integrated PCI bridge?

No, the MPC8260AVVMHBB does not include an integrated PCI bridge. Unlike the MPC8265 and MPC8266 variants, this part omits the 60x-to-PCI bridge block entirely. System-level PCI connectivity must be implemented externally using a companion bridge IC or FPGA. Pin resources reserved for PCI signals (e.g., L_A[14–31], LCL_D[0–31]) are unconnected in the MPC8260AVVMHBB silicon.

How many TDM interfaces does the MPC8260AVVMHBB support, and what standards are covered?

The MPC8260AVVMHBB supports eight TDM interfaces, each configurable for E1 (2.048 Mbps), T1 (1.544 Mbps), ISDN PRI (23B+D), ISDN BRI (2B+D), or custom time-slot assignments. Hardware support includes bit/byte resolution, independent transmit/receive routing, frame synchronization, and compatibility with Freescale IDL and GCI protocols - enabling direct interfacing with line interface units (LIUs) in access multiplexers.

What is the role of the CPM in the MPC8260AVVMHBB architecture?

The Communications Processor Module (CPM) in the MPC8260AVVMHBB is a dedicated 32-bit RISC microcontroller with 32 KB dual-port RAM, executing microcode to offload serial protocol processing from the G2 core. It manages FCCs (Ethernet/ATM), SCCs (HDLC/UART), SMCs (BRI), SPI/I²C, and TDM interfaces - handling framing, CRC, HDLC flag detection, and ATM cell delineation without CPU intervention, thereby preserving G2 core cycles for application-layer tasks.

Can the MPC8260AVVMHBB operate in slave mode with an external master processor?

Yes, the MPC8260AVVMHBB supports slave-mode operation: the G2 core can be disabled via reset configuration, allowing an external master processor to control the 60x bus and access on-chip peripherals (memory controller, CPM registers, SIU) directly. This mode is used in multi-processor systems where MPC8260AVVMHBB serves exclusively as a communications coprocessor - for example, paired with a PowerPC 74xx host in high-end routers.

MPC8260AVVMHBB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
480-LBGA Exposed Pad
Series:
MPC82xx
Packaging:
Bulk
Product Status:
Obsolete
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100Mbps (3)
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
480-TBGA (37.5x37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART

MPC8260AVVMHBB FAQ

1.How can I place an order for MPC8260AVVMHBB through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8260AVVMHBB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8260AVVMHBB reliable?

The price and inventory of MPC8260AVVMHBB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8260AVVMHBB is usually 5 days.

3.What payment methods are accepted for MPC8260AVVMHBB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8260AVVMHBB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8260AVVMHBB?

MPC8260AVVMHBB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8260AVVMHBB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8260AVVMHBB?

For technical support, including MPC8260AVVMHBB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8260AVVMHBB requirements.

6.How does Aetrix verify that MPC8260AVVMHBB is sourced from the original manufacturer or authorized distributors?

All MPC8260AVVMHBB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8260AVVMHBB meets industry standards.

7.What is the process for return or replacement of MPC8260AVVMHBB?

All MPC8260AVVMHBB units undergo pre-shipment inspection (PSI). If there is an issue with MPC8260AVVMHBB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8260AVVMHBB part is unused and in its original packaging.

Return procedure for MPC8260AVVMHBB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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