NXP Semiconductors MPC8260AZUMHBB

Overview

MPC8260AZUMHBB from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core operating up to 300 MHz, 16 KB instruction and 16 KB data caches, and a dedicated 32-bit RISC communications processor module (CPM). It integrates 60x and local buses, PCI bridge (not on all variants), FCC/SCC/SMC serial controllers, TDM interfaces, and supports ATM IMA, HDLC, Ethernet MII, and UTOPIA protocols - deployed in telecom access equipment, DSLAMs, and industrial gateways.

For engineers reviewing the MPC8260AZUMHBB datasheet, MPC8260AZUMHBB pinout, MPC8260AZUMHBB application, or MPC8260AZUMHBB equivalent, this page delivers verified technical context, package mapping to 480-pin TBGA, confirmed DC/AC electrical specs (VDD = 1.7–2.2 V, VDDH = 3.135–3.465 V), thermal resistance (θJA = 83 °C/W on 4-layer board), and functional distinctions among MPC826xA family members.

Technical Context

The MPC8260AZUMHBB implements a split-clock architecture with independent PLLs for the G2 core (150–300 MHz) and CPM (up to 200 MHz), enabling power/performance optimization. Its 60x bus operates at 64-bit width with burst transfers and ECC/parity support, while the 32-bit local bus runs up to 83 MHz with eight-beat bursts.

The CPM includes three Fast Communications Controllers (FCC1–FCC3), four Serial Communications Controllers (SCC1–SCC4), two Serial Management Controllers (SMC1–SMC2), SPI, I²C, and up to eight TDM interfaces - all backed by 32 KB dual-port RAM and virtual DMA channels. TC-layer hardware for ATM IMA is present only on MPC8264/MPC8266, not on MPC8260AZUMHBB.

Key Specifications

Pinout & Package

Package: 480-ball thin quad flat no-lead (TBGA), 19 mm × 19 mm, 1.27 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil design per JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8260AZUMHBB, MPC8272AZUQHB adds cryptographic acceleration but removes PCI support, while MPC8313EVRAGDB abandons the CPM entirely for higher CPU performance and modern peripherals - neither is pin-compatible, and both require PCB redesign and firmware rearchitecture.

Availability

MPC8260AZUMHBB is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and embedded gateway applications requiring stable component supply across extended product lifecycles.

Supply support for MPC8260AZUMHBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors, headquartered in Eindhoven, Netherlands, develops secure, high-performance semiconductors for automotive, industrial, and communication markets - with roots in Freescale's PowerQUICC lineage.

The MPC8260AZUMHBB belongs to the PowerQUICC™ II family, designed specifically for cost-sensitive, high-channel-count communications equipment requiring integrated protocol acceleration and deterministic real-time response.

FAQ

What is the maximum operating frequency of the MPC8260AZUMHBB core?

The MPC8260AZUMHBB features a PowerPC G2 (EC603e) core rated for operation up to 300 MHz. This frequency is achievable under specified conditions: VDD = 1.9–2.2 V, ambient temperature ≤70 °C, and proper thermal management (θJA ≤83 °C/W). At 300 MHz, the device delivers approximately 1.90 Dhrystone MIPS/MHz, validated per Freescale's hardware specifications document MPC8260AEC Rev. 2.0.

Does the MPC8260AZUMHBB include an integrated PCI bridge?

No, the MPC8260AZUMHBB does not include an integrated PCI bridge. According to Freescale's MPC8260AEC Rev. 2.0 documentation, the 60x-to-PCI bridge is exclusive to the MPC8265 and MPC8266 variants within the MPC826xA family. The MPC8260AZUMHBB retains full 60x bus functionality but requires an external PCI interface chip for PCI connectivity.

What package type and thermal characteristics apply to the MPC8260AZUMHBB?

The MPC8260AZUMHBB is packaged in a 480-ball TBGA (19 mm × 19 mm, 1.27 mm pitch). Its thermal resistance is θJA = 83 °C/W under 4-layer board and 1 m/s airflow conditions, per Table 4 of MPC8260AEC Rev. 2.0. This value assumes proper thermal via placement beneath the thermal pad and adherence to Freescale's layout guidelines for power and ground planes.

Which serial communication protocols are supported natively by the MPC8260AZUMHBB CPM?

The MPC8260AZUMHBB CPM natively supports Ethernet (10/100 Mbps MII), HDLC/SDLC (up to T3), ATM UTOPIA Level 1/2 (155 Mbps), UART, SPI, I²C, and TDM interfaces (up to eight channels). These are implemented through its three FCCs, four SCCs, two SMCs, and SI interface - all documented in Sections 4 and 5 of MPC8260AEC Rev. 2.0.

Is the MPC8260AZUMHBB pin-compatible with other MPC826xA family members like MPC8272 or MPC8313?

No, the MPC8260AZUMHBB is not pin-compatible with MPC8272 or MPC8313 devices. MPC8272 uses the same 480-TBGA footprint but has different signal assignments on DP, PA, and PC banks; MPC8313 uses a 620-pin PBGA package with entirely distinct pinout and memory interface. Direct replacement requires PCB redesign and firmware adaptation in all cases.