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NXP Semiconductors MPC8260AZUPJDB

Part No.:
MPC8260AZUPJDB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
480-LBGA Exposed Pad
Datasheet:
AetrixMPC8260AZUPJDB.pdf
Description:
IC MPU MPC82XX 300MHZ 480TBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,609

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Product details

Overview

MPC8260AZUPJDB from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core operating up to 300 MHz, a dedicated 32-bit communications processor module (CPM), and integrated 60x/PCI/local bus interfaces. It supports 10/100-Mbit Ethernet via MII, ATM over UTOPIA, HDLC at T3 rates, and up to eight TDM channels - deployed in carrier-grade DSLAMs, enterprise routers, and telecom access gateways.

For engineers reviewing the MPC8260AZUPJDB datasheet, MPC8260AZUPJDB pinout, MPC8260AZUPJDB application, or MPC8260AZUPJDB equivalent, key selection criteria include its 480-pin TBGA package, dual PLL architecture enabling independent G2 core and CPM clocking, 32-Kbyte dual-port RAM for CPM–core data exchange, IEEE 1149.1 JTAG debug support, and compliance with PCI Specification Rev. 2.2 (MPC8265/8266 variants).

Technical Context

The MPC8260AZUPJDB implements a split-architecture design: a high-performance PowerPC G2 integer core with 16-Kbyte I/D caches and MMU coexists with a RISC-based CPM handling protocol offload for serial, TDM, and packetized traffic. Its memory controller supports glueless interfacing to SDRAM, SRAM, Flash, and EPROM across 12 programmable banks.

AC timing is defined for 66 MHz and 83 MHz system clocks with 50-pF load; DC operation requires VDD = 1.7–2.24 V (core), VCCSYN = 1.7–2.24 V (PLL), and VDDH = 3.135–3.465 V (I/O). Thermal resistance θJA is 83 °C/W on a four-layer board with natural convection.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture EC603e dual-issue PowerPC core with 16-Kbyte I-cache and 16-Kbyte D-cache, supporting 150–300 MHz operation and full MMU compliance.
CPM Resources 32-Kbyte dual-port RAM, three FCCs (MII/UTOPIA/HDLC), four SCCs, two SMCs, SPI/I²C, eight TDM ports, and 128-channel MCC support.
Bus Interfaces 64-bit 60x bus (up to 266 MHz), 32-bit local bus (up to 83 MHz), and PCI bridge (Rev. 2.2, 32-bit/66 MHz) - only on MPC8265/8266 variants.
Supply Voltages VDD = 1.7–2.24 V (core), VCCSYN = 1.7–2.24 V (PLL), VDDH = 3.135–3.465 V (I/O); all supplies must track within ±5% and ±0.1 Vdc.
Package & Thermal 480-ball TBGA (19 mm × 19 mm), θJA = 83 °C/W (four-layer board, natural convection), max junction temperature = 105 °C.
Power Dissipation PINT = 2.4 W nominal (VDD = 2.0 V, CPU = 300 MHz, CPM = 200 MHz, 66.66 MHz bus), excluding I/O power.
Debug & Test IEEE Std. 1149.1 JTAG TAP, COP test interface, real-time clock register, hardware watchdog timer, and periodic interrupt timer.

Pinout & Package

Package: 480-ball thin quad flat no-lead (TBGA), 19 mm × 19 mm, 1.0 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
CLKIN System clock input Accepts single-ended 1.5–100 MHz reference clock; drives internal PLLs for G2 core and CPM frequency synthesis.
PA[0–31] CPM parallel I/O port A Configurable as general-purpose I/O or dedicated CPM signal lines (e.g., FCC/SCC control, TDM framing); default state is input.
D[0–63] 60x data bus 64-bit bidirectional data path for 60x bus transactions; supports 8/16/32/64-bit transfers with parity/ECC capability.
A[0–31] 60x address bus 32-bit address bus for 60x master/slave operations; includes byte-select signals for narrow-width accesses.
PCI_AD[0–31] PCI address/data multiplexed bus 32-bit multiplexed address/data bus for PCI host/peripheral mode; active only on MPC8265/8266 variants.
TDO/TDI/TMS/TCK JTAG boundary-scan interface IEEE 1149.1-compliant test access port for silicon validation, debug, and in-circuit programming.

Key Features

Feature Design Value
Dual PLL architecture Independent G2 core and CPM clock domains enable power/performance optimization - e.g., CPM runs at 200 MHz while core idles at 150 MHz.
Hardware TC layer (IMA) Integrated ATM cell processing (HEC generation/delineation, payload scrambling/descrambling, idle-cell insertion/filtering) on MPC8264/8266 variants.
Glueless memory controller Twelve-bank controller with programmable bank size, byte write enables, and dedicated SDRAM logic eliminates external address latches and buffers.
Multi-protocol serial engine Three FCCs support simultaneous 10/100-Mbit Ethernet (MII), ATM SAR (UTOPIA Level 2), and HDLC at T3 line rates without software overhead.
Eight TDM interface support Hardware-routed TDM paths with SI RAM, bit/byte resolution, and independent Tx/Rx routing enable ISDN PRI/BRI, T1/E1, and xDSL line card implementations.

Applications

DSLAM Line Card Enterprise Router Control Plane

Use Scenario: Aggregating multiple ADSL2+ subscriber lines in central office DSLAM chassis with ATM backhaul.

IC Role / Device Role / Timing Role: MPC8260AZUPJDB serves as line card controller, executing ATM segmentation/reassembly (SAR), TDM-to-ATM mapping, and QoS scheduling via its TC layer and FCCs.

Use Value: Offloads ATM protocol processing from host CPU, reduces latency by 12 µs per cell, and supports >1000 concurrent PVCs per line card using embedded dual-port RAM.

Use Scenario: Managing routing table updates, CLI, SNMP, and security policy enforcement in Layer 3 enterprise routers.

IC Role / Device Role / Timing Role: MPC8260AZUPJDB operates as control-plane processor, running Linux on the G2 core while delegating packet forwarding to external ASICs via PCI or local bus.

Use Value: Enables deterministic interrupt latency (<500 ns) for routing protocol timers and supports hot-swappable line cards via JTAG and PCIe-compatible reset sequencing.

Telecom Access Gateway Industrial Protocol Converter

Use Scenario: Bridging T1/E1 voice circuits to VoIP SIP trunks in remote telecom access nodes.

IC Role / Device Role / Timing Role: MPC8260AZUPJDB functions as media gateway controller, using SCCs for HDLC framing, SMCs for BRI signaling, and TDM ports for PCM highway termination.

Use Value: Integrates 8 TDM ports and 4 SCCs on-die, eliminating external HDLC controllers and reducing BOM cost by $4.20 per unit versus discrete solution.

Use Scenario: Translating Modbus RTU over RS-485 to EtherNet/IP in factory automation gateways.

IC Role / Device Role / Timing Role: MPC8260AZUPJDB acts as protocol translation engine, with SMCs handling serial management and G2 core executing real-time conversion firmware.

Use Value: Achieves sub-10 ms end-to-end latency for motion control commands using deterministic IDMA channels and hardware UART FIFOs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC8272ZQHBB Higher core speed (400 MHz), added USB 2.0 OTG, no PCI bridge; uses 516-pin PBGA package. Targets newer VoIP gateways requiring USB peripheral support and higher throughput; lacks PCI legacy compatibility. Select when USB host capability and >300 MHz core performance are required, and PCB redesign for larger package is acceptable.
MPC8313EVRAGDB PowerPC e300 core (333 MHz), integrated DDR controller, SEC crypto engine, no CPM; 484-pin PBGA. Suited for secure edge routers needing AES/SHA acceleration but lacking legacy TDM/HDLC offload requirements. Choose for security-centric designs where cryptographic acceleration outweighs need for CPM-based protocol engines.

Compared with MPC8260AZUPJDB, MPC8272ZQHBB offers higher compute headroom and USB connectivity but sacrifices PCI compatibility and increases footprint; MPC8313EVRAGDB replaces CPM with crypto acceleration and DDR support, making it unsuitable for TDM-heavy telecom applications but optimal for secure IoT gateways.

Availability

MPC8260AZUPJDB is available at Aetrix Electronics and suitable for carrier-grade DSLAMs, enterprise routing platforms, and telecom access gateways requiring stable component supply, long-lifecycle support, and traceable sourcing for industrial deployment.

Supply support for MPC8260AZUPJDB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communications markets, with roots in Freescale's PowerQUICC lineage.

The MPC8260AZUPJDB belongs to the PowerQUICC™ II family - designed specifically for embedded communications infrastructure requiring hardware-accelerated protocol processing, multi-interface integration, and deterministic real-time response in telecom and networking equipment.

FAQ

What is the maximum operating frequency of the MPC8260AZUPJDB core?

The MPC8260AZUPJDB features an EC603e-based G2 core rated for operation up to 300 MHz. This maximum frequency is achievable under specified conditions: VDD = 1.9–2.24 V, ambient temperature ≤ 70 °C, and proper thermal management ensuring junction temperature does not exceed 105 °C. The actual sustained frequency depends on voltage scaling, cooling, and bus loading - for example, at 200 MHz operation, VDD may be reduced to 1.7–1.92 V to lower power dissipation. MPC8260AZUPJDB supports internal clock multipliers (up to 6:1) to derive core frequency from lower-speed CLKIN inputs.

Does the MPC8260AZUPJDB include a PCI interface?

No, the MPC8260AZUPJDB does not integrate a PCI bridge. The PCI interface is exclusive to the MPC8265 and MPC8266 variants within the MPC826xA family. MPC8260AZUPJDB retains full compatibility with the 60x and local buses, supporting high-speed interconnect to external PCI controllers or bridges via its 64-bit 60x bus. Engineers designing systems requiring native PCI must select MPC8265ZUPJDB or MPC8266ZUPJDB instead. MPC8260AZUPJDB remains ideal for applications prioritizing CPM offload and TDM integration over PCI expansion.

What package type and pin count does the MPC8260AZUPJDB use?

The MPC8260AZUPJDB is packaged in a 480-ball thin ball grid array (TBGA) with 19 mm × 19 mm body size and 1.0 mm ball pitch. This RoHS-compliant package supports fine-pitch routing and efficient thermal dissipation, with θJA = 83 °C/W on a four-layer PCB. Pin assignments follow the standardized MPC826xA pinout documented in Freescale's MPC8260AEC Rev. 2.0 datasheet - including dedicated banks for 60x bus, local bus, CPM I/O (PA–PD), JTAG, and power/ground. MPC8260AZUPJDB shares identical mechanical and thermal characteristics with other 480-TBGA MPC826xA variants.

How does the CPM in the MPC8260AZUPJDB handle ATM traffic?

The MPC8260AZUPJDB's CPM supports ATM via its Fast Communications Controllers (FCCs) and optional Transfer Convergence (TC) layer - though the TC layer is only present on MPC8264 and MPC8266 variants, not MPC8260AZUPJDB. For ATM, MPC8260AZUPJDB relies on FCC2 in UTOPIA Level 2 mode to interface with external SAR chips, handling cell delineation, HEC calculation, and rate adaptation in firmware. It does not perform hardware ATM TC-layer functions like payload scrambling or idle-cell insertion - those require MPC8264ZUPJDB or MPC8266ZUPJDB. MPC8260AZUPJDB remains fully capable of ATM endpoint applications when paired with compliant external PHY/SAR devices.

What debug interfaces are supported by the MPC8260AZUPJDB?

The MPC8260AZUPJDB provides IEEE Std. 1149.1-compliant JTAG (TCK/TMS/TDI/TDO) for boundary-scan testing, flash programming, and real-time debugging, plus a Common On-Chip Processor (COP) test interface for low-level silicon validation. It also integrates a hardware watchdog timer, periodic interrupt timer, and real-time clock register accessible via the SIU - enabling robust system monitoring and recovery. These interfaces are fully operational across all voltage and temperature ranges specified in the MPC8260AEC datasheet. MPC8260AZUPJDB does not support Nexus or SWD; JTAG remains the primary debug and test vector for this device.

MPC8260AZUPJDB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
480-LBGA Exposed Pad
Series:
MPC82xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100Mbps (3)
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
480-TBGA (37.5x37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART

MPC8260AZUPJDB FAQ

1.How can I place an order for MPC8260AZUPJDB through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8260AZUPJDB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8260AZUPJDB reliable?

The price and inventory of MPC8260AZUPJDB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8260AZUPJDB is usually 5 days.

3.What payment methods are accepted for MPC8260AZUPJDB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8260AZUPJDB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8260AZUPJDB?

MPC8260AZUPJDB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8260AZUPJDB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8260AZUPJDB?

For technical support, including MPC8260AZUPJDB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8260AZUPJDB requirements.

6.How does Aetrix verify that MPC8260AZUPJDB is sourced from the original manufacturer or authorized distributors?

All MPC8260AZUPJDB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8260AZUPJDB meets industry standards.

7.What is the process for return or replacement of MPC8260AZUPJDB?

All MPC8260AZUPJDB units undergo pre-shipment inspection (PSI). If there is an issue with MPC8260AZUPJDB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8260AZUPJDB part is unused and in its original packaging.

Return procedure for MPC8260AZUPJDB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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