NXP Semiconductors MPC8264ACZUMIBB

Overview

MPC8264ACZUMIBB from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core, 16-Kbyte instruction and data caches, and a dedicated Communications Processor Module (CPM) with FCC, SCC, SMC, SPI, I²C, TDM, and TC-layer support for ATM/IMA applications. It operates at up to 300 MHz core frequency and supports 60x bus (64-bit, up to 266 MHz) and local bus (32-bit, up to 83 MHz), targeting telecom edge routers, DSLAMs, and TDM-based access gateways.

For engineers reviewing the MPC8264ACZUMIBB datasheet, MPC8264ACZUMIBB pinout, MPC8264ACZUMIBB application, or MPC8264ACZUMIBB equivalent, key selection considerations include its TC-layer hardware acceleration for ATM cell processing, dual PLL architecture enabling independent core/CPM clocking, 480-pin TBGA package thermal performance, and compatibility with PowerQUICC II MPC826xA family software and toolchains.

Technical Context

The MPC8264ACZUMIBB implements a 32-bit PowerPC G2 core with MMU, FPU, and separate 16-Kbyte I/D caches, paired with a RISC-based CPM running from 32-Kbyte dual-port RAM. Its CPM integrates three Fast Communications Controllers (FCC1–FCC3), four Serial Communications Controllers (SCC1–SCC4), two Serial Management Controllers (SMC1–SMC2), and eight TDM interfaces - all supported by eight baud rate generators and programmable timers.

This device includes dedicated TC-layer hardware (exclusive to MPC8264 and MPC8266 variants) for ATM layer-1/2 functions per ITU-T I.432, including HEC generation/detection, payload scrambling/descrambling, coset handling, idle-cell insertion/filtering, and cell-rate control in both internal and external rate modes - all synchronized to FCC2 via UTOPIA Level 2 interface.

Key Specifications

Pinout & Package

Package: 480-pin Thin Ball Grid Array (TBGA), 27 mm × 27 mm, 1.27 mm ball pitch, RoHS-compliant, lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8266ACZUMIBB, MPC8264ACZUMIBB omits the PCI bridge to reduce pin count, power, and layout complexity - making it optimal for space-constrained, fanless TDM systems. Against MPC8272CZQMIBB, it retains hardware TC-layer support essential for low-latency ATM cell processing in legacy telecom deployments.

Availability

MPC8264ACZUMIBB is available at Aetrix Electronics and suitable for DSLAM line cards, VoIP gateways, cellular base station controllers, and industrial TDM multiplexers requiring stable component supply across extended product lifecycles.

Supply support for MPC8264ACZUMIBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full technical support, documentation, and long-term supply for the PowerQUICC II portfolio.

The MPC8264ACZUMIBB belongs to the PowerQUICC™ II communications processor family, designed specifically for carrier-grade and enterprise-edge networking equipment requiring integrated protocol acceleration, deterministic real-time response, and multi-standard TDM/ATM/Ethernet convergence.

FAQ

What is the maximum operating frequency of the MPC8264ACZUMIBB core?

The MPC8264ACZUMIBB supports a maximum core frequency of 300 MHz, achievable using the internal 6:1 PLL multiplier with a 50 MHz CLKIN source. This requires VDD = 1.9–2.2 V and junction temperature ≤105 °C. At 300 MHz, the device delivers 1.90 Dhrystone MIPS/MHz and 7.65 SPEC95 benchmark score, as verified in Freescale's MPC8260AEC Rev. 2.0 specification.

Does the MPC8264ACZUMIBB include hardware support for ATM cell processing?

Yes, the MPC8264ACZUMIBB includes dedicated TC-layer hardware compliant with ITU-T I.432 for ATM layer-1/2 functions. This includes HEC generation/detection, payload scrambling/descrambling, coset handling, idle-cell insertion/filtering, and cell delineation - all executed in hardware without CPU intervention. This capability is exclusive to MPC8264 and MPC8266 variants within the MPC826xA family.

What package type and thermal characteristics apply to the MPC8264ACZUMIBB?

The MPC8264ACZUMIBB uses a 480-pin TBGA package (27 mm × 27 mm, 1.27 mm pitch). Its thermal resistance is θJA = 83 °C/W under 1 m/s airflow on a 4-layer PCB - significantly lower than the 101 °C/W value for natural convection. This enables reliable operation at 300 MHz core frequency with ambient temperatures up to 70 °C without forced cooling.

How does the MPC8264ACZUMIBB handle clock domain isolation between the G2 core and CPM?

The MPC8264ACZUMIBB employs two independent PLLs - one for the G2 core and one for the CPM - allowing fully asynchronous operation. The core PLL supports 1.5:1 to 6:1 multipliers; the CPM PLL supports 2:1 to 6:1. This permits configurations like 266 MHz core + 133 MHz CPM, optimizing power efficiency and thermal distribution while maintaining deterministic CPM timing for TDM and FCC operations.

Which communication peripherals are integrated into the MPC8264ACZUMIBB CPM?

The MPC8264ACZUMIBB CPM integrates three Fast Communications Controllers (FCC1–FCC3), four Serial Communications Controllers (SCC1–SCC4), two Serial Management Controllers (SMC1–SMC2), one SPI, one I²C, eight TDM interfaces, and eight baud rate generators. FCC2 connects directly to the TC layer for ATM processing, while SCCs support HDLC, UART, and BISYNC - enabling simultaneous multi-protocol operation without external controllers.