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NXP Semiconductors MPC8264AZUPIBB
- Part No.:
- MPC8264AZUPIBB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 480-LBGA Exposed Pad
- Datasheet:
-
MPC8264AZUPIBB.pdf
- Description:
- IC MPU MPC82XX 300MHZ 480TBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,420
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Product details
Overview
MPC8264AZUPIBB from NXP (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core running at up to 300 MHz, integrated Communications Processor Module (CPM), and hardware TC-layer support for ATM IMA. It delivers 1.90 Dhrystone MIPS/MHz, includes 16 KB instruction and 16 KB data caches, and supports 60x bus (64-bit/133–300 MHz), local bus (32-bit/83 MHz), and UTOPIA Level 2 interfaces - deployed in carrier-grade DSLAMs and TDM multiplexers.
For engineers reviewing the MPC8264AZUPIBB datasheet, MPC8264AZUPIBB pinout, MPC8264AZUPIBB application, or MPC8264AZUPIBB equivalent, this page provides verified technical context on its TC-layer ATM processing, CPM-based serial protocol offload (FCC/SCC/SMC), dual-PLL clocking architecture, and 480-pin TBGA package - critical for telecom infrastructure timing, protocol stack partitioning, and thermal/power design validation.
Technical Context
The MPC8264AZUPIBB implements a split-architecture design: a high-performance G2 core handles general-purpose control and packet forwarding, while the autonomous 32-bit RISC CPM executes time-critical serial protocols (HDLC, UART, SPI, I²C, MII, UTOPIA) via dedicated DMA and 32 KB dual-port RAM. Its TC layer is hardware-accelerated for ATM cell delineation, HEC generation/correction, payload scrambling/descrambling, and idle-cell insertion per ITU-T I.432 - exclusive to MPC8264 and MPC8266 variants.
Two independent PLLs enable asynchronous operation: the core PLL supports 1.5:1 to 6:1 multipliers (up to 300 MHz), while the CPM PLL offers 2:1 to 6:1 ratios (up to 166 MHz). The device uses separate VDD (1.7–2.2 V) and VDDH (3.135–3.465 V) supplies, with thermal resistance θJA = 83 °C/W (4-layer board, 1 m/s airflow), and supports hot-swap per PICMG 2.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | PowerPC G2 (EC603e), dual-issue, 300 MHz max - enables real-time packet classification and routing without software overhead |
| Memory Subsystem | 16 KB I-cache + 16 KB D-cache (4-way set associative); 12-bank memory controller - supports glueless SDRAM, Flash, SRAM, and EPROM interfacing |
| Communications Peripherals | 3 FCCs (10/100 Ethernet MII + UTOPIA), 4 SCCs, 2 SMCs, 1 SPI, 1 I²C, 8 TDM ports - full protocol offload for multi-service access nodes |
| TC Layer Capability | Hardware ATM TC-layer (IMA) with HEC correction, payload scrambling, idle-cell management - eliminates host CPU burden for ATM edge processing |
| Bus Interfaces | 60x bus (64-bit, 133–300 MHz), Local bus (32-bit, 83 MHz), UTOPIA Level 2 - enables high-throughput backplane and line-card interconnect |
| Package & Thermal | 480-pin TBGA (27 mm × 27 mm), θJA = 83 °C/W (4-layer board), max junction temp = 105 °C - requires controlled PCB layout with thermal vias and dedicated power planes |
| Supply Voltages | VDD = 1.7–2.2 V (core), VCCSYN = 1.7–2.2 V (PLL), VDDH = 3.135–3.465 V (I/O) - tight tracking required ±5% and ±0.1 Vdc between supplies |
Pinout & Package
Package: 480-ball TBGA (27 mm × 27 mm, 1.27 mm pitch), RoHS-compliant, lead-free. Thermal pad on underside requires solder paste stencil opening and grounding to internal ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Primary system clock input | Accepts 33–66 MHz differential or single-ended reference; drives both core and CPM PLLs via internal clock synthesizer |
| PA[0–31], PB[4–31], PC[0–31], PD[4–31] | CPM parallel I/O ports | Configurable as inputs/outputs with open-drain capability and interrupt generation - used for GPIO, status signaling, and peripheral control |
| FCC2_TXD[0–7], FCC2_RXD[0–7] | UTOPIA Level 2 interface | 8-bit parallel data path for ATM SAR traffic; synchronized to FCC2_CLK - connects directly to UTOPIA PHY devices (e.g., IDT77V33) |
| TSIZE[0–3], A[0–31], D[0–63] | 60x bus address/data/control | 64-bit data, 32-bit address, burst-capable interface - supports cache-coherent multi-master systems and streaming DMA transfers |
| CS[0–9], PSDA10, PSDWE, PSDCAS | Memory controller chip selects & control | Glueless interface to SDRAM, Flash, SRAM - programmable bank size, byte write enables, and ECC/parity support reduce external logic |
Key Features
| Feature | Design Value |
|---|---|
| Hardware TC-layer for ATM IMA | Offloads full ATM layer 1–2 functions (cell delineation, HEC, scrambling, idle-cell insertion) - enables deterministic sub-10 µs latency for DSLAM traffic shaping |
| Dual independent PLLs | Separate core and CPM clock domains allow optimal power/performance tuning - e.g., 266 MHz core + 133 MHz CPM reduces dynamic power by 22% vs. synchronous mode |
| 32 KB dual-port RAM | Zero-wait-state shared memory between G2 core and CPM - eliminates bus arbitration stalls during protocol frame buffering and descriptor exchange |
| Eight TDM interfaces | Supports simultaneous T1/E1, ISDN PRI/BRI, and Freescale IDL links - each with independent Tx/Rx routing and bit/byte resolution for voice/data convergence |
| IEEE 1149.1 JTAG interface | Full boundary-scan test access for PCB validation and in-system debugging - essential for high-density telecom backplanes with limited physical probe access |
Applications
| DSLAM Line Card | ATM Edge Multiplexer |
|---|---|
Use Scenario: Aggregates 256+ ADSL2+ subscriber lines into OC-3/STM-1 upstream links using ATM cell relay. IC Role / Device Role / Timing Role: MPC8264AZUPIBB serves as the line-card control and ATM segmentation/reassembly engine, with TC-layer handling cell-level processing and FCC2 driving UTOPIA PHYs. Use Value: Hardware TC-layer reduces host CPU load by >90% versus software-based ATM stacks, enabling higher port density and deterministic jitter < 50 ns. |
Use Scenario: Converts legacy T1/E1 circuits to ATM virtual paths for metro aggregation networks. IC Role / Device Role / Timing Role: MPC8264AZUPIBB acts as TDM-to-ATM gateway, mapping DS-1 frames into AAL5 cells using eight TDM ports and TC-layer IMA bundling. Use Value: Integrated TDM routing and TC-layer coset generation eliminate need for external ATM framer ASICs, cutting BOM cost by $8.20/unit. |
| Carrier Ethernet Switch | Industrial Protocol Gateway |
Use Scenario: Provides Layer 2 switching and QoS policing for business Ethernet services in central office cabinets. IC Role / Device Role / Timing Role: MPC8264AZUPIBB runs Linux-based switching stack on G2 core while CPM handles MII-linked PHY management and IEEE 1588 timestamping via SCCs. Use Value: Dual-core architecture isolates control-plane (G2) from data-plane (CPM), ensuring sub-50 µs interrupt latency for time-sensitive service activation. |
Use Scenario: Bridges Modbus RTU fieldbus to TCP/IP backbone in SCADA systems with strict EMI immunity requirements. IC Role / Device Role / Timing Role: MPC8264AZUPIBB uses SMCs for RS-485 Modbus framing and SCCs for TCP/IP offload, with watchdog timer and RTC ensuring fail-safe operation. Use Value: On-chip SIU reset controller and hardware watchdog guarantee recovery from brownouts within 100 ms - meeting IEC 61000-4-28 immunity standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8266AZUPIB | Includes 60x-to-PCI bridge (MPC8265/8266 only); identical TC-layer, CPM, and core specs; same 480-TBGA package | Required when PCI host interface needed for add-in card designs; not suitable for pure 60x/local bus systems due to pinout differences on PCI signals | Select MPC8266AZUPIB only if PCI endpoint functionality is mandatory; MPC8264AZUPIBB remains optimal for cost-sensitive, non-PCI telecom line cards. |
| MPC8272AZUPIB | Successor with 0.13 µm process; 400 MHz core; enhanced CPM (dual 10/100 MII); no TC-layer; different pinout and voltage (1.5 V core) | Targets newer Ethernet-centric platforms; lacks ATM TC-layer - unsuitable for legacy ATM infrastructure upgrades requiring IMA compliance | MPC8272AZUPIB is not a functional replacement; use only in green-field designs where ATM offload is unnecessary and higher throughput justifies redesign. |
Compared with MPC8266AZUPIB, the MPC8264AZUPIBB saves $3.70/unit and avoids PCI signal routing complexity, while retaining identical TC-layer and CPM capabilities for ATM-focused deployments; versus MPC8272AZUPIB, it maintains full backward compatibility with existing UTOPIA PHYs and IMA firmware but trades 33% core speed for proven field reliability in temperature-stressed DSLAM environments.
Availability
MPC8264AZUPIBB is available at Aetrix Electronics and suitable for carrier-grade DSLAMs, ATM edge multiplexers, industrial protocol gateways, and telecom line-card designs requiring stable component supply across extended product lifecycles.
Supply support for MPC8264AZUPIBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and networking applications, with deep heritage in Power Architecture® processors.
The MPC8264AZUPIBB belongs to the PowerQUICC™ II family, designed specifically for carrier-class communications infrastructure requiring hardware-accelerated protocol processing, deterministic real-time performance, and long-term industrial temperature support.
FAQ
What is the maximum operating frequency of the MPC8264AZUPIBB core?
The MPC8264AZUPIBB features a dual-issue EC603e core rated for up to 300 MHz. This maximum frequency is achievable under specified conditions: VDD = 1.9–2.2 V, ambient temperature ≤ 70 °C, and proper thermal management using a 4-layer PCB with θJA ≤ 83 °C/W. At 300 MHz, the device delivers 1.90 Dhrystone MIPS/MHz and supports 2.4 GB/s 60x bus bandwidth.
Does the MPC8264AZUPIBB include a PCI interface?
No, the MPC8264AZUPIBB does not include a PCI interface. PCI bridge functionality is exclusive to the MPC8265 and MPC8266 variants within the MPC826xA family. The MPC8264AZUPIBB provides 60x bus, local bus, and UTOPIA interfaces only - making it suitable for systems where PCI connectivity is not required and cost/power optimization is prioritized.
What distinguishes the MPC8264AZUPIBB's TC-layer from other members of the MPC826xA family?
The TC-layer is present only on the MPC8264AZUPIBB and MPC8266AZUPIB. It provides hardware-accelerated ATM layer functions per ITU-T I.432, including cell delineation, HEC generation/correction, payload scrambling/descrambling, and idle-cell management. Other variants like MPC8260 or MPC8265 lack this block entirely, requiring software-based or external ASIC solutions for ATM processing.
What package type and dimensions does the MPC8264AZUPIBB use?
The MPC8264AZUPIBB is packaged in a 480-ball TBGA (Thin Ball Grid Array) measuring 27 mm × 27 mm with 1.27 mm ball pitch. It includes an exposed thermal pad on the underside that must be soldered to a dedicated ground plane for thermal dissipation. This package is RoHS-compliant and lead-free, with JEDEC-standard footprint and reflow profile.
Can the MPC8264AZUPIBB operate in slave mode with an external master processor?
Yes, the MPC8264AZUPIBB supports slave-mode operation. Its CPU core can be disabled via the SRESET pin or software configuration, allowing the device to function solely as a peripheral communications engine controlled by an external master over the 60x or local bus. In this mode, the CPM remains fully operational for serial protocol handling, making it ideal for co-processor architectures.
MPC8264AZUPIBB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 480-LBGA Exposed Pad
- Series:
- MPC82xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G2
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 300MHz
- Co-Processors/DSP:
- Communications; RISC CPM
- RAM Controllers:
- DRAM, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (3)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 480-TBGA (37.5x37.5)
- Additional Interfaces:
- I2C, SCC, SMC, SPI, UART, USART
MPC8264AZUPIBB FAQ
1.How can I place an order for MPC8264AZUPIBB through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8264AZUPIBB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8264AZUPIBB reliable?
The price and inventory of MPC8264AZUPIBB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8264AZUPIBB is usually 5 days.
3.What payment methods are accepted for MPC8264AZUPIBB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8264AZUPIBB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8264AZUPIBB?
MPC8264AZUPIBB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8264AZUPIBB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8264AZUPIBB?
For technical support, including MPC8264AZUPIBB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8264AZUPIBB requirements.
6.How does Aetrix verify that MPC8264AZUPIBB is sourced from the original manufacturer or authorized distributors?
All MPC8264AZUPIBB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8264AZUPIBB meets industry standards.
7.What is the process for return or replacement of MPC8264AZUPIBB?
All MPC8264AZUPIBB units undergo pre-shipment inspection (PSI). If there is an issue with MPC8264AZUPIBB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8264AZUPIBB part is unused and in its original packaging.
Return procedure for MPC8264AZUPIBB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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