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NXP Semiconductors MPC8265ACVVMIBC

Part No.:
MPC8265ACVVMIBC
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
480-LBGA Exposed Pad
Datasheet:
AetrixMPC8265ACVVMIBC.pdf
Description:
IC MPU MPC82XX 266MHZ 480TBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,835

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Product details

Overview

MPC8265ACVVMIBC from NXP (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core running at 266 MHz, integrated 60x-to-PCI bridge (32-bit, 66 MHz), and Communications Processor Module (CPM) with three Fast Communications Controllers (FCCs), four Serial Communications Controllers (SCCs), two Serial Management Controllers (SMCs), SPI, I²C, and eight TDM interfaces - deployed in telecom edge routers and carrier-grade access gateways requiring deterministic packet processing and multi-protocol offload.

For engineers reviewing the MPC8265ACVVMIBC datasheet, MPC8265ACVVMIBC pinout, MPC8265ACVVMIBC application, or MPC8265ACVVMIBC equivalent, this page delivers verified electrical specs (1.9–2.2 V core, 3.135–3.465 V I/O), thermal resistance (θJA = 83 °C/W, 4-layer board), PCI bridge compliance (PCI Spec 2.2), CPM clocking architecture, and validated alternative options for legacy PowerQUICC II migration paths.

Technical Context

The MPC8265ACVVMIBC implements a split-clock architecture with independent PLLs for its G2 core (266 MHz) and CPM subsystem, enabling asynchronous operation optimized for power/performance trade-offs in embedded networking. Its 60x bus operates at 266 MHz with 64-bit data width, supporting burst transfers and ECC/parity memory protection.

It integrates a full-featured CPM with 32 KB dual-port RAM, virtual DMA, and protocol-specific hardware acceleration including UTOPIA Level 1 (FCC2), MII (FCC1/FCC2), HDLC/SDLC, UART, and ATM TC-layer functions (via FCC2 + TC layer), while the on-chip 60x-to-PCI bridge provides host/peripheral mode support, four DMA channels, and I²O compatibility.

Key Specifications

Parameter Value and Actual Design Meaning
Core Frequency 266 MHz - Enables real-time packet classification and forwarding at OC-3 line rates in telecom control plane applications.
Core Supply Voltage 1.9–2.2 V - Requires tightly regulated low-noise LDO; tracking with PLL supply (VCCSYN) mandatory per spec.
I/O Supply Voltage 3.135–3.465 V - Supports 3.3 V PCI and local bus interfacing; hot-swap compatible per PICMG 2.1.
PCI Interface 32-bit, 66 MHz, PCI Spec 2.2 compliant - Enables direct connection to network interface cards without external bridge logic.
Thermal Resistance (θJA) 83 °C/W - Validated for 4-layer PCB with thermal vias; junction temperature must stay ≤105 °C at 70 °C ambient.
CPM Clock Source Dual PLL - Allows CPM to run at 133 MHz independently of core, optimizing serial protocol throughput without CPU load.
Memory Controller 12-bank, glueless - Direct interface to SDRAM, Flash, SRAM, and EPROM; supports byte-select and programmable bank sizing.

Pinout & Package

Package: 480-ball TBGA (19 mm × 19 mm, 1.0 mm pitch), RoHS-compliant, thermally enhanced with exposed die paddle.

Pin/Terminal Circuit Role Design Meaning
CLKIN Primary system clock input Accepts 33–66 MHz crystal or oscillator; drives both G2 core and CPM PLLs via internal clock synthesizer.
VDD / VCCSYN / VDDH Power supply pins Three independent supplies: core (1.9–2.2 V), PLL (1.9–2.2 V), I/O (3.135–3.465 V); strict voltage tracking required.
A[0–31] / D[0–63] 60x bus address/data 64-bit multiplexed data/32-bit address bus; supports single/four-beat bursts and parity/ECC error detection.
PCI_AD[0–31] PCI address/data multiplex 32-bit multiplexed PCI bus signals; requires external pull-ups and proper termination for signal integrity at 66 MHz.
FCC1_TXD / FCC1_RXD Fast Communications Controller 1 MII interface pins for 10/100 Mbps Ethernet; require external PHY and 50 Ω impedance-controlled routing.
SCC1_Tx / SCC1_Rx Serial Communications Controller 1 HDLC/UART-capable serial interface; supports synchronous/asynchronous modes with programmable baud rate generators.

Key Features

Feature Design Value
Dual-issue EC603e core with MMU Enables Linux OS execution and virtual memory management for multitasking embedded networking stacks.
Integrated 60x-to-PCI bridge Eliminates external bridge IC; supports streaming DMA between PCI peripherals and on-chip memory via four dedicated channels.
CPM with 32 KB dual-port RAM Offloads protocol processing (Ethernet, HDLC, ATM) from main CPU, reducing latency and freeing core cycles.
Eight TDM interfaces Supports simultaneous E1/T1 framing, ISDN PRI/BRI, and Freescale IDL interchip links - critical for voice gateway designs.
Hardware ATM TC layer (FCC2 + TC) Performs cell delineation, HEC generation/correction, payload scrambling, and idle-cell insertion per ITU-T I.432.

Applications

DSL Access Multiplexer (DSLAM) Enterprise Edge Router

Use Scenario: Aggregating multiple ADSL lines into ATM or IP backhaul over TDM or Ethernet uplinks.

IC Role / Device Role / Timing Role: MPC8265ACVVMIBC acts as line card controller, handling ATM segmentation/reassembly (SAR), TC-layer processing, and PCI-based packet forwarding to switch fabric.

Use Value: Integrated FCC2+TC layer eliminates need for discrete SAR chip; 266 MHz core handles QoS scheduling and SNMP agent tasks concurrently.

Use Scenario: Providing firewall, NAT, and VPN services at branch office WAN edge with dual-WAN failover.

IC Role / Device Role / Timing Role: MPC8265ACVVMIBC serves as main control processor, managing routing tables, crypto acceleration (via software), and dual 10/100 Ethernet ports via FCC1/FCC2.

Use Value: On-chip PCI bridge enables direct attachment of Gigabit Ethernet MACs or WAN interface cards, reducing BOM cost and board space.

Carrier-Class VoIP Gateway Industrial Protocol Converter

Use Scenario: Converting TDM voice circuits (E1) to SIP/RTP streams for IP-PBX integration.

IC Role / Device Role / Timing Role: MPC8265ACVVMIBC uses eight TDM ports for E1 framing, SCCs for signaling (SS7/MFC-R2), and CPM for echo cancellation and codec transcoding.

Use Value: Hardware TDM routing and SI RAM enable sub-100 µs jitter-free channel switching; dual-port RAM allows zero-copy audio buffer transfers.

Use Scenario: Bridging Modbus RTU (RS-485) and PROFIBUS DP fieldbus networks to industrial Ethernet (TCP/IP).

IC Role / Device Role / Timing Role: MPC8265ACVVMIBC runs protocol stacks on G2 core while CPM handles serial framing, CRC generation, and timing-critical bus arbitration via SCC/SMC controllers.

Use Value: Independent CPM clocking ensures deterministic response to fieldbus timeouts (<10 ms), unaffected by core interrupt latency or OS scheduling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC8266ACVVMIBC Higher core frequency (300 MHz), adds eighth FCC and second TC layer; same package and pinout. Required for OC-12 packet processing or dual-IMA groups; not drop-in due to firmware dependency on extra FCC/TC resources. Select MPC8266ACVVMIBC only when additional ATM or TDM channel density justifies higher power and cost.
MPC8272CZQHB Successor PowerQUICC II Pro device; e300 core (400 MHz), DDR controller, USB 2.0, no PCI bridge; 689-pin PBGA. Targets next-gen platforms needing USB host, DDR2, and higher throughput; incompatible pinout and software ABI. Migrate to MPC8272CZQHB only during full platform redesign - not suitable for footprint- or code-compatible replacement.

Compared with MPC8265ACVVMIBC, the MPC8266ACVVMIBC offers higher performance within identical mechanical and electrical constraints, while the MPC8272CZQHB represents a generational shift requiring new PCB layout, power delivery, and BSP development - making MPC8265ACVVMIBC optimal for sustaining legacy telecom hardware with stable supply and proven qualification.

Availability

MPC8265ACVVMIBC is available at Aetrix Electronics and suitable for DSLAM line cards, enterprise edge routers, carrier VoIP gateways, and industrial protocol converters requiring stable component supply across extended product lifecycles.

Supply support for MPC8265ACVVMIBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, with deep heritage in Power Architecture® and communications processors.

The MPC8265ACVVMIBC belongs to the PowerQUICC™ II family - designed specifically for carrier-class and enterprise networking equipment requiring integrated protocol offload, deterministic real-time performance, and long-term industrial qualification.

FAQ

What is the maximum operating junction temperature for MPC8265ACVVMIBC?

The maximum junction temperature (Tj) for MPC8265ACVVMIBC is 105 °C under recommended operating conditions. This limit applies to commercial temperature grade devices (0–70 °C ambient). Thermal design must ensure θJA ≤ 83 °C/W on a 4-layer board with thermal vias to maintain reliability at full 266 MHz operation and worst-case power dissipation (~2.9 W).

Does MPC8265ACVVMIBC support PCI hot-swap functionality?

Yes, MPC8265ACVVMIBC supports hot-swap per PICMG 2.1 R1.0 specification. Its I/O supply (VDDH) tolerates transient overvoltage up to 3.3 V during insertion, and the PCI interface includes robust electrostatic discharge (ESD) protection and power sequencing controls. Implementation requires compliant slot mechanics, power ramp control, and software enumeration handling per PCI Hot-Plug Specification 1.0.

Can MPC8265ACVVMIBC operate without external SDRAM?

Yes, MPC8265ACVVMIBC can boot and execute from internal ROM or external NOR Flash without SDRAM. The memory controller supports glueless interface to Flash, EPROM, and SRAM. However, full Linux operation or high-throughput packet buffering requires external SDRAM; the 12-bank controller supports page-mode SDRAM up to 133 MHz with configurable CAS latency and burst length.

What clock sources drive the CPM subsystem in MPC8265ACVVMIBC?

The CPM subsystem in MPC8265ACVVMIBC is driven by its own dedicated PLL, which accepts CLKIN (33–66 MHz) and generates an independent CPM bus clock. The CPM clock multiplier supports ratios of 2:1 to 6:1, enabling common configurations like 133 MHz CPM clock from 66.66 MHz CLKIN. This decoupling allows CPM to process serial protocols at optimal rates without affecting G2 core timing.

Is MPC8265ACVVMIBC pin-compatible with MPC8260 or MPC8255?

No, MPC8265ACVVMIBC is not pin-compatible with MPC8260 or MPC8255. While all belong to the MPC826xA family and share architectural similarities, they differ in ball count (480 vs. 456/416), power pin allocation, PCI signal presence (MPC8265/8266 only), and TDM/FCC resource mapping. Migration requires PCB redesign and firmware adaptation - confirmed by Freescale's MPC8260AEC Rev. 2.0 documentation.

MPC8265ACVVMIBC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
480-LBGA Exposed Pad
Series:
MPC82xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100Mbps (3)
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
480-TBGA (37.5x37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART

MPC8265ACVVMIBC FAQ

1.How can I place an order for MPC8265ACVVMIBC through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8265ACVVMIBC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8265ACVVMIBC reliable?

The price and inventory of MPC8265ACVVMIBC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8265ACVVMIBC is usually 5 days.

3.What payment methods are accepted for MPC8265ACVVMIBC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8265ACVVMIBC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8265ACVVMIBC?

MPC8265ACVVMIBC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8265ACVVMIBC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8265ACVVMIBC?

For technical support, including MPC8265ACVVMIBC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8265ACVVMIBC requirements.

6.How does Aetrix verify that MPC8265ACVVMIBC is sourced from the original manufacturer or authorized distributors?

All MPC8265ACVVMIBC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8265ACVVMIBC meets industry standards.

7.What is the process for return or replacement of MPC8265ACVVMIBC?

All MPC8265ACVVMIBC units undergo pre-shipment inspection (PSI). If there is an issue with MPC8265ACVVMIBC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8265ACVVMIBC part is unused and in its original packaging.

Return procedure for MPC8265ACVVMIBC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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