NXP Semiconductors MPC8265ACZUMHBC

Overview

MPC8265ACZUMHBC from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core, 16-Kbyte instruction and data caches, and a dedicated Communications Processor Module (CPM) with FCC, SCC, SMC, SPI, I²C, and TDM interfaces. It supports 300 MHz CPU operation, 66 MHz PCI bus, and 83 MHz local bus - deployed in carrier-grade DSLAMs, enterprise routers, and multi-service access platforms.

For engineers reviewing the MPC8265ACZUMHBC datasheet, MPC8265ACZUMHBC pinout, MPC8265ACZUMHBC application, or MPC8265ACZUMHBC equivalent, key selection criteria include its integrated 60x-to-PCI bridge, dual PLL architecture enabling independent G2 core/CPM clocking, 32-bit local bus with SDRAM support, and hardware-accelerated ATM TC-layer functionality for IMA applications.

Technical Context

The MPC8265ACZUMHBC implements a 32-bit PowerPC G2 core with MMU, FPU, and 64-bit 60x bus interface, paired with a separate 32-bit RISC CPM running at up to 200 MHz. Its dual PLL system allows asynchronous core (300 MHz) and CPM (200 MHz) operation, optimizing power/performance trade-offs in real-time communications workloads.

It integrates a full-featured 60x-to-PCI bridge compliant with PCI Specification Rev. 2.2 (32-bit, 66 MHz, 3.3 V), four DMA channels, and configuration registers auto-loaded from EPROM. The CPM includes 32 KB dual-port RAM, eight baud rate generators, and hardware TC-layer support for ATM cell processing - specifically enabled on MPC8265 and MPC8266 variants per documentation.

Key Specifications

Pinout & Package

Package: 480-pin Thin Ball Grid Array (TBGA), 27 mm × 27 mm body, 1.27 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8265ACZUMHBC, MPC8266ACZUMHBC adds TC-layer scalability for dense ATM deployments, while MPC8272CZUMHBC trades PCI integration for higher CPU performance - making MPC8265ACZUMHBC optimal for balanced I/O-rich communications systems requiring PCI expansion.

Availability

MPC8265ACZUMHBC is available at Aetrix Electronics and suitable for DSLAM line cards, enterprise router control planes, and multi-service access platforms requiring stable component supply, long-lifecycle support, and industrial temperature grade (-40°C to +105°C junction).

Supply support for MPC8265ACZUMHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communications markets, with heritage from Freescale's PowerQUICC portfolio.

The MPC8265ACZUMHBC belongs to the PowerQUICC™ II family - designed specifically for carrier-class communications infrastructure demanding integrated processing, deterministic I/O, and hardware-accelerated protocol offload.

FAQ

What is the maximum operating frequency of the MPC8265ACZUMHBC CPU core?

The MPC8265ACZUMHBC CPU core operates at up to 300 MHz, as confirmed in the MPC8260A Hardware Specifications document (Rev. 2.0, p.3). This frequency is achievable under recommended conditions: VDD = 1.9–2.2 V, ambient temperature ≤70°C, and proper thermal management. The MPC8265ACZUMHBC uses an EC603e microprocessor core with dual-issue integer execution and integrated FPU.

Does the MPC8265ACZUMHBC include a PCI interface, and what version does it support?

Yes, the MPC8265ACZUMHBC includes an on-chip 60x-to-PCI bridge compliant with PCI Specification Revision 2.2, supporting 32-bit data width and 66 MHz operation at 3.3 V (MPC8260AEC Rev. 2.0, p.6). It provides host/peripheral capability, four DMA channels, and automatic configuration register loading from EPROM - distinguishing it from MPC8260/MPC8255 variants which lack this bridge.

What communications peripherals are integrated into the MPC8265ACZUMHBC CPM?

The MPC8265ACZUMHBC CPM integrates three Fast Communications Controllers (FCCs), four Serial Communications Controllers (SCCs), two Serial Management Controllers (SMCs), one SPI, one I²C, eight TDM ports, and eight baud rate generators (MPC8260AEC Rev. 2.0, pp.4–5). These enable concurrent 10/100 Ethernet, HDLC, UART, ATM UTOPIA, and TDM interface operation without external protocol controllers.

What package type and thermal characteristics apply to the MPC8265ACZUMHBC?

The MPC8265ACZUMHBC uses a 480-pin TBGA package (27 mm × 27 mm, 1.27 mm pitch) with θJA = 83 °C/W under 1 m/s airflow on a 4-layer PCB (MPC8260AEC Rev. 2.0, p.12). Junction temperature must not exceed 105°C; thermal design must accommodate up to 3.1 W internal power dissipation at 300 MHz operation (Table 5, p.13).

How does the MPC8265ACZUMHBC handle clocking for the CPU core and CPM subsystems?

The MPC8265ACZUMHBC employs two independent PLLs: one for the G2 core (supporting 1.5:1 to 6:1 multiplication) and one for the CPM (2:1 to 6:1), allowing asynchronous operation - e.g., 300 MHz core / 200 MHz CPM (MPC8260AEC Rev. 2.0, p.3). This separation enables dynamic power scaling and eliminates clock domain crossing bottlenecks between control and communications processing.