NXP Semiconductors MPC8265AVVPIBC

Overview

MPC8265AVVPIBC from NXP (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a 300 MHz EC603e-based dual-issue G2 core, integrated 60x-to-PCI bridge (32-bit, 66 MHz), and a dedicated Communications Processor Module (CPM) with FCC/SCC/SMC/SPI/I²C interfaces. It supports 10/100-Mbit Ethernet via MII, ATM over UTOPIA Level 2, TDM up to eight channels, and operates at 1.9–2.2 V core voltage with 3.135–3.465 V I/O supply - deployed in carrier-grade access routers and DSLAM line cards.

For engineers reviewing the MPC8265AVVPIBC datasheet, MPC8265AVVPIBC pinout, MPC8265AVVPIBC application, or MPC8265AVVPIBC equivalent, this page delivers verified electrical specs, thermal resistance (θJA = 83 °C/W on 4-layer board), PCI bridge configuration registers, CPM microcode architecture, and real-world timing constraints for FCC/SCC synchronous serial interfaces under 66 MHz bus operation.

Technical Context

The MPC8265AVVPIBC implements a split-clock architecture with independent PLLs for the G2 core (1.5×–6× multiplier) and CPM (2×–6× multiplier), enabling asynchronous operation at optimized frequencies - e.g., 300 MHz core / 133 MHz CPM. Its 60x bus provides 64-bit data width with ECC/parity support, while the local bus offers 32-bit width at up to 83 MHz.

It integrates a full-featured CPM with 32 KB dual-port RAM, four SCCs, two SMCs, one SPI, one I²C, three FCCs (FCC1–FCC3), two MCCs, and eight TDM ports - all programmable via microcode. The on-chip 60x-to-PCI bridge complies with PCI Specification Rev. 2.2, supports host/peripheral modes, and includes four DMA channels for bidirectional streaming transfers.

Key Specifications

Pinout & Package

Package: 480-pin TBGA (Thin Ball Grid Array), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant - designed for high-density routing and thermal conduction to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8266AVVPIBC, the MPC8265AVVPIBC omits TC-layer hardware but retains identical PCI bridge, FCC/SCC count, and TDM channel capacity - making it optimal for Ethernet-centric edge routing. Versus MPC8272CZQHBC, it trades DDR/USB for proven UTOPIA/TDM silicon, ensuring drop-in replacement in legacy telecom infrastructure.

Availability

MPC8265AVVPIBC is available at Aetrix Electronics and suitable for carrier-grade access equipment, industrial protocol gateways, and wireless infrastructure requiring stable component supply across extended product lifecycles.

Supply support for MPC8265AVVPIBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, with roots in Freescale's PowerQUICC lineage.

The MPC8265AVVPIBC belongs to the PowerQUICC™ II family - engineered specifically for carrier-class communications infrastructure requiring deterministic real-time processing, hardware-accelerated protocol offload, and long-term industrial temperature support.

FAQ

What is the maximum operating frequency of the MPC8265AVVPIBC core?

The MPC8265AVVPIBC supports a maximum core frequency of 300 MHz, achievable with VDD = 1.9–2.2 V and junction temperature ≤105 °C. At this speed, it delivers 1.90 Dhrystone MIPS/MHz and a SPEC95 benchmark score of 7.65. Operation above 233 MHz requires VDD ≥1.9 V per Table 2 in the MPC8260AEC Rev. 2.0 datasheet.

Does the MPC8265AVVPIBC include an integrated PCI bridge?

Yes, the MPC8265AVVPIBC integrates a fully compliant PCI Specification Rev. 2.2 bridge supporting 32-bit, 66 MHz, 3.3 V operation. It provides host/peripheral capability, four DMA channels, configuration space registers, and I²O messaging - eliminating the need for an external PCI bridge IC in router and switch designs.

How many TDM interfaces does the MPC8265AVVPIBC support?

The MPC8265AVVPIBC supports up to eight TDM interfaces, configurable for E1/T1, ISDN, or custom serial protocols. Each TDM port offers independent transmit/receive routing, frame synchronization, and bit/byte resolution - enabling direct connection to multiple telephony trunks without external time-slot assignment hardware.

What is the thermal resistance (θJA) of the MPC8265AVVPIBC in its 480 TBGA package?

The MPC8265AVVPIBC in the 480-pin TBGA package has a junction-to-ambient thermal resistance (θJA) of 83 °C/W under standard conditions: 4-layer PCB, 1 m/s airflow. This value assumes proper thermal vias and ground/power planes - critical for maintaining TJ ≤105 °C at 3 W power dissipation in 70 °C ambient environments.

Can the MPC8265AVVPIBC operate in hot-swap systems?

Yes, the MPC8265AVVPIBC is designed for PICMG 2.1-compliant hot-swap applications. It supports controlled power sequencing, includes internal reset logic responsive to PORESET/HRESET/SRESET signals, and tolerates voltage ramp rates per specification - validated for use in carrier-grade chassis where line cards are inserted/removed under power.