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NXP Semiconductors MPC8265AZUPIBC

Part No.:
MPC8265AZUPIBC
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
480-LBGA Exposed Pad
Datasheet:
AetrixMPC8265AZUPIBC.pdf
Description:
IC MPU MPC82XX 300MHZ 480TBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:147

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Product details

Overview

MPC8265AZUPIBC from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core running up to 300 MHz, integrated 60x-to-PCI bridge (32-bit, 66 MHz), and a full-featured Communications Processor Module (CPM) with FCCs, SCCs, SMCs, SPI, I²C, and TDM support. It targets telecom edge routers, DSLAMs, and industrial gateways requiring deterministic real-time packet processing.

For engineers reviewing the MPC8265AZUPIBC datasheet, MPC8265AZUPIBC pinout, MPC8265AZUPIBC application, or MPC8265AZUPIBC equivalent, key selection criteria include PCI bridge compliance (Rev 2.2), CPM clock domain independence, 480-pin TBGA package thermal resistance (θJA = 83°C/W on 4-layer board), and support for ATM IMA via TC layer in compatible variants.

Technical Context

The MPC8265AZUPIBC implements a split-architecture design: a high-performance G2 core (PowerPC architecture-compliant MMU, 16 KB I/D caches, FPU) operates independently from the RISC-based CPM via 32 KB dual-port RAM and dedicated DMA channels. Core and CPM use separate PLLs, enabling asynchronous clocking (e.g., 266 MHz core / 133 MHz CPM).

Its 60x bus (64-bit, up to 200 MHz) interfaces with external memory and peripherals, while the integrated 60x-to-PCI bridge supports host/peripheral modes, four DMA channels, and PCI-to-60x address remapping. The CPM provides protocol offload for Ethernet (MII), ATM (UTOPIA), HDLC, UART, and TDM (up to eight interfaces), with hardware-accelerated TC-layer functions for ATM cell delineation, HEC generation/correction, and payload scrambling/descrambling.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureEC603e dual-issue PowerPC core with FPU, 16 KB I-cache + 16 KB D-cache, MMU compliant with PowerPC architecture
Max Core Frequency300 MHz - enables >1.9 Dhrystone MIPS/MHz performance for real-time packet classification and routing
PCI Interface32-bit, 66 MHz, PCI Spec Rev 2.2 compliant bridge with host/peripheral capability and 4 DMA channels
CPM Clock IndependenceDedicated CPM PLL allows independent CPM frequency scaling (e.g., 133–200 MHz) without affecting core operation
Memory Bus64-bit 60x bus (up to 200 MHz) + 32-bit local bus (up to 83 MHz) with glueless support for SDRAM, SRAM, Flash, EPROM
Package Thermal ResistanceθJA = 83°C/W (4-layer board, 1 m/s airflow) - defines minimum heatsink requirement for 70°C ambient at PD >3 W
I/O Supply VoltageVDDH = 3.135–3.465 V - mandates strict 3.3 V rail regulation and bypassing per JEDEC layout guidelines

Pinout & Package

480-ball TBGA (19 mm × 19 mm, 1.0 mm pitch) with thermal pad. Ball map includes dedicated 60x bus (D[0–63], A[0–31]), PCI signals (AD[0–31], C/BE[0–3]), CPM I/O (PA[0–31], PC[0–31]), and power/ground distribution across all four quadrants.

Pin/TerminalCircuit RoleDesign Meaning
D[0–63]60x Data Bus64-bit bidirectional data path for CPU-to-memory and CPU-to-peripheral transfers; requires matched trace lengths ≤6 inches
A[0–31]60x Address Bus32-bit address bus supporting 4 GB linear addressing; driven on rising CLKIN edge per AC timing spec sp32
AD[0–31]PCI Address/Data MultiplexedTime-multiplexed 32-bit address/data bus; requires PCI-compliant termination and setup/hold per spec sp12/sp13
C/BE[0–3]#PCI Command/Byte EnableActive-low byte enable signals controlling data strobing during PCI read/write cycles
PA[0–31]CPM Parallel I/OConfigurable CPM pins defaulting to input; must be pulled or configured to prevent DC leakage per Table 3 note
VDDHI/O Power Supply3.3 V supply for all I/O buffers; must track VDD/VCCSYN within ±5% and ±0.1 Vdc per Table 2 note

Key Features

FeatureDesign Value
Dual-clock domain architectureIndependent G2 core and CPM PLLs enable power/performance tuning - e.g., idle CPM while core processes control plane tasks
Hardware TC-layer accelerationOffloads ATM cell delineation, HEC correction, and payload scrambling/descrambling from CPU, reducing latency by >40% vs. software-only
Integrated 60x-to-PCI bridgeEliminates external bridge IC, reduces BOM count and PCB area; supports streaming DMA for high-throughput host interface
32 KB dual-port RAMZero-wait-state shared memory between G2 core and CPM enables lock-free inter-processor communication for real-time protocol stacks
Eight TDM interfacesSupports simultaneous E1/T1, ISDN PRI/BRI, and custom TDM serial links - critical for multi-service access gateways

Applications

DSLAM Line CardIndustrial Protocol Gateway

Use Scenario: Aggregating ADSL2+ subscriber traffic onto ATM backhaul using UTOPIA Level 2 interface.

IC Role / Device Role / Timing Role: MPC8265AZUPIBC acts as line card controller, executing ATM segmentation/reassembly (SAR) in CPM microcode while G2 core handles QoS policy enforcement and SNMP management.

Use Value: Hardware TC-layer reduces SAR latency to <5 µs per cell, enabling sub-10 ms end-to-end jitter for VoIP services.

Use Scenario: Bridging Modbus RTU fieldbus to EtherNet/IP in factory automation PLC backplanes.

IC Role / Device Role / Timing Role: MPC8265AZUPIBC serves as protocol translation engine: SCCs handle RS-485 Modbus framing, while PCI interface connects to EtherNet/IP MAC controller.

Use Value: Dual-bus architecture isolates fieldbus timing (local bus) from industrial Ethernet timing (PCI), preventing jitter cross-coupling.

Telecom Edge RouterSecure Remote Terminal Unit (RTU)

Use Scenario: Processing encrypted IPsec tunnels and firewall rules at 100 Mbps line rate in carrier-grade access routers.

IC Role / Device Role / Timing Role: G2 core executes Linux-based routing stack and crypto acceleration; CPM offloads packet classification via FCC-based pattern matching engines.

Use Value: 300 MHz core + CPM parallel processing achieves 120 Kpps forwarding rate with <50 µs interrupt latency for control-plane events.

Use Scenario: Monitoring SCADA telemetry over legacy T1/E1 circuits while reporting via LTE modem over PCI interface.

IC Role / Device Role / Timing Role: MPC8265AZUPIBC functions as secure RTU controller: TDM ports interface to legacy teleprotection relays, PCI connects to cellular modem, and watchdog timer ensures fail-safe reset on firmware hang.

Use Value: Integrated SIU real-time clock and hardware watchdog meet IEC 62443-3-3 requirements for secure device lifecycle management.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC8272AZUPIBHigher core frequency (400 MHz), added security engine (SEC), no PCI bridge; 516-pin PBGALacks PCI interface but adds cryptographic acceleration - suitable for secure VPN concentrators without host bus requirementsSelect MPC8272AZUPIB when crypto offload outweighs need for PCI connectivity; verify PCB redesign for larger package and different pinout.
MPC8360EVRAGDBPowerPC e300 core (417 MHz), integrated DDR controller, SEC, no CPM; 620-pin PBGAReplaces CPM with enhanced QUICC Engine for modern packet processing; lacks TDM/UTOPIA but adds Gigabit Ethernet MACsChoose MPC8360EVRAGDB for greenfield designs targeting Ethernet-centric protocols; avoid if legacy TDM/ATM support is mandatory.

Compared with MPC8265AZUPIBC, MPC8272AZUPIB trades PCI connectivity for crypto acceleration and higher clock speed, while MPC8360EVRAGDB abandons CPM-based legacy protocol support entirely in favor of QUICC Engine-based packet processing - making MPC8265AZUPIBC uniquely suited for brownfield telecom infrastructure upgrades requiring UTOPIA, TDM, and PCI host interfacing.

Availability

MPC8265AZUPIBC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial gateways, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MPC8265AZUPIBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's embedded processing heritage.

The MPC8265AZUPIBC belongs to the PowerQUICC™ II family, designed specifically for cost-sensitive, high-reliability communications equipment requiring integrated protocol offload, deterministic real-time response, and long-term industrial temperature support.

FAQ

What is the maximum operating junction temperature for the MPC8265AZUPIBC?

The MPC8265AZUPIBC has a maximum junction temperature (Tj) of 105°C under recommended operating conditions. This limit assumes proper thermal management - including a 4-layer PCB with ground/power planes and θJA ≤83°C/W - especially when total power dissipation exceeds 3 W at 70°C ambient.

Does the MPC8265AZUPIBC support hot-swap operation?

Yes, the MPC8265AZUPIBC supports hot-swap operation per PICMG 2.1 R1.0 (August 1998). Its I/O supply (VDDH) tolerates transient overvoltage up to 3.6 V during insertion, and its power sequencing logic prevents latch-up when VDDH ramps before VDD/VCCSYN within specified tracking windows.

How many TDM interfaces does the MPC8265AZUPIBC support, and what standards are covered?

The MPC8265AZUPIBC supports up to eight TDM interfaces, covering T1, E1, T3/E3, ISDN basic rate (BRI), ISDN primary rate (PRI), pulse code modulation highway, Freescale IDL, and general circuit interface (GCI). Each interface operates with bit or byte resolution and independent transmit/receive routing.

Is the MPC8265AZUPIBC pin-compatible with other devices in the MPC826xA family?

No, the MPC8265AZUPIBC is not fully pin-compatible with all MPC826xA devices. While it shares the 480-ball TBGA package with MPC8260/MPC8264, pin functions differ significantly - especially for PCI signals (present only on MPC8265/MPC8266) and TC-layer I/O (exclusive to MPC8264/MPC8266). Board-level reuse requires signal-by-signal validation.

What debug interfaces are available on the MPC8265AZUPIBC?

The MPC8265AZUPIBC includes IEEE Std. 1149.1™ JTAG test access port for boundary scan and core debugging, plus dedicated CPU_BR, CPU_BG, and CPU_DBG signals for real-time trace and breakpoint control. These interfaces enable full visibility into both G2 core execution and CPM microcode operation.

MPC8265AZUPIBC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
480-LBGA Exposed Pad
Series:
MPC82xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100Mbps (3)
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
480-TBGA (37.5x37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART

MPC8265AZUPIBC FAQ

1.How can I place an order for MPC8265AZUPIBC through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8265AZUPIBC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8265AZUPIBC reliable?

The price and inventory of MPC8265AZUPIBC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8265AZUPIBC is usually 5 days.

3.What payment methods are accepted for MPC8265AZUPIBC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8265AZUPIBC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8265AZUPIBC?

MPC8265AZUPIBC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8265AZUPIBC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8265AZUPIBC?

For technical support, including MPC8265AZUPIBC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8265AZUPIBC requirements.

6.How does Aetrix verify that MPC8265AZUPIBC is sourced from the original manufacturer or authorized distributors?

All MPC8265AZUPIBC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8265AZUPIBC meets industry standards.

7.What is the process for return or replacement of MPC8265AZUPIBC?

All MPC8265AZUPIBC units undergo pre-shipment inspection (PSI). If there is an issue with MPC8265AZUPIBC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8265AZUPIBC part is unused and in its original packaging.

Return procedure for MPC8265AZUPIBC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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