NXP Semiconductors MPC8265AZUPJDC

Overview

MPC8265AZUPJDC from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core running at 300 MHz, integrated 60x-to-PCI bridge (32-bit, 66 MHz), and Communications Processor Module (CPM) with FCCs, SCCs, SMCs, SPI, I²C, and TDM support - deployed in carrier-grade DSLAMs, enterprise routers, and telecom access gateways.

For engineers reviewing the MPC8265AZUPJDC datasheet, MPC8265AZUPJDC pinout, MPC8265AZUPJDC application, or MPC8265AZUPJDC equivalent, this page delivers verified electrical specs (VDD = 1.9–2.24 V, VDDH = 3.135–3.465 V), thermal data (θJA = 83 °C/W on 4-layer board), PCI bridge compliance (PCI Spec 2.2), CPM protocol coverage (10/100 Ethernet, HDLC, ATM UTOPIA), and validated alternative part selection guidance.

Technical Context

The MPC8265AZUPJDC implements a split-clock architecture with independent PLLs for its G2 core (up to 300 MHz) and CPM (up to 200 MHz), enabling power/performance optimization. Its 60x bus operates at 64-bit width with burst transfers and ECC/parity support, while the local bus provides 32-bit glueless interfacing to SDRAM, Flash, and peripherals.

It integrates a full-featured CPM with three Fast Communications Controllers (FCC1–FCC3), four Serial Communications Controllers (SCC1–SCC4), two Serial Management Controllers (SMC1–SMC2), eight TDM interfaces, and an on-chip 32-Kbyte dual-port RAM - all programmable via microcode for protocol offload including ATM AAL5, HDLC, and IEEE 802.3 MII.

Key Specifications

Pinout & Package

480-pin Thin Ball Grid Array (TBGA) package with 27 mm × 27 mm body, 1.27 mm ball pitch, and standard JEDEC MO-245AC mechanical outline. Thermal pad on underside requires solder paste stencil aperture per IPC-7351B.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8266AZUPJDC, the MPC8265AZUPJDC omits the TC layer but retains identical PCI bridge, FCC count, and TDM channel count - making it optimal for non-ATM applications. Versus MPC8272AZUPJDC, it trades higher clock speed and DDR2 for proven PCI compatibility and lower power at 300 MHz.

Availability

MPC8265AZUPJDC is available at Aetrix Electronics and suitable for carrier infrastructure, industrial networking, and telecom access equipment requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for MPC8265AZUPJDC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communication markets, with deep heritage in Power Architecture® and communications processors.

The MPC8265AZUPJDC belongs to the PowerQUICC™ II family - designed specifically for cost-sensitive, high-reliability communications infrastructure where integrated protocol offload, PCI expansion, and deterministic real-time performance are critical.

FAQ

What is the maximum operating junction temperature for the MPC8265AZUPJDC?

The MPC8265AZUPJDC has a maximum rated junction temperature (T_j) of 105 °C under normal operation. This limit applies when ambient temperature (T_A) ranges from 0 °C to 70 °C. For extended temperature variants, the same 105 °C T_j max holds, but T_A extends to –40 °C. Thermal design must ensure θ_JA ≤ 83 °C/W (4-layer board) to avoid exceeding this limit at full load.

Does the MPC8265AZUPJDC support DDR SDRAM memory interfaces?

No, the MPC8265AZUPJDC does not support DDR SDRAM. Its memory controller is designed for SDR SDRAM (page-mode), SRAM, DRAM, EPROM, and Flash. DDR support was introduced in later PowerQUICC generations such as MPC83xx and QorIQ families. The MPC8265AZUPJDC's twelve-bank controller provides glueless interface to single-data-rate memories only.

Can the MPC8265AZUPJDC operate without external PCI devices connected?

Yes, the MPC8265AZUPJDC can operate in standalone mode with PCI disabled. Its PCI bridge is configurable as host or peripheral, and the device boots and runs fully functional using only its 60x and local buses. PCI-related pins default to high-impedance when PCI is not initialized, and no external termination or pull-ups are required unless the interface is actively used.

What clock sources does the MPC8265AZUPJDC require for full functionality?

The MPC8265AZUPJDC requires one primary clock input (CLKIN, 33–66 MHz) to drive both core and CPM PLLs. Additional optional clocks include up to 20 dedicated input pins for baud rate generators, FCC/SCC/SMC timing, and TDM frame sync - but these are only needed when those peripherals are active. The SIU's internal clock synthesizer derives all internal clocks from CLKIN.

Is the MPC8265AZUPJDC pin-compatible with the MPC8260 series?

The MPC8265AZUPJDC shares the same 480-pin TBGA package and pinout as other MPC826xA family members (MPC8260, MPC8264, MPC8266), including identical power, ground, 60x bus, local bus, and JTAG signal placement. However, PCI-related pins (PCI_AD[0–31], PCI_CBE#, PCI_FRAME#, etc.) are unique to MPC8265AZUPJDC and MPC8266AZUPJDC - they are no-connect on MPC8260/MPC8264.