NXP Semiconductors MPC8275CVRMIBA

Overview

MPC8275CVRMIBA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II integrated communications processor featuring a dual-issue G2_LE Power Architecture core, three Fast Communication Controllers (FCCs), four Serial Communications Controllers (SCCs), PCI bridge, USB 2.0 controller, and integrated memory controller - all in a 516-pin PBGA package. It operates at up to 450 MHz core frequency with 16 KB I-cache and 16 KB D-cache, and targets telecom edge routers, industrial gateways, and legacy TDM-based access equipment.

For engineers reviewing the MPC8275CVRMIBA datasheet, MPC8275CVRMIBA pinout, MPC8275CVRMIBA application, or MPC8275CVRMIBA equivalent, key selection criteria include FCC/SCC protocol support (Ethernet/HDLC/UART/UTOPIA), dual PLL architecture enabling independent core/CPM clocking, 32-bit local bus timing, thermal resistance (RθJB = 11°C/W), and compatibility with VR-package-specific features including one multichannel controller (MCC) and four TDM ports.

Technical Context

The MPC8275CVRMIBA implements a split-architecture SoC with a high-performance G2_LE integer core and an autonomous Communications Processor Module (CPM) executing microcode for protocol offload. Core and CPM operate on separate PLLs - enabling independent clock scaling (e.g., 450 MHz core / 250 MHz CPM) - and share 64 KB of dual-port RAM for inter-processor messaging and DMA coordination.

Its communication subsystem supports three FCCs (10/100-Mbps Ethernet via MII/RMII, ATM over UTOPIA II), four SCCs (HDLC/SDLC/UART/BISYNC), two SMCs (GCI/TDM management), SPI/I²C interfaces, and eight TDM channels grouped into one SI block. The VR-package variant lacks UTOPIA II ports and TC layer hardware present in MPC8280, confirming its role as a cost-optimized, TDM-focused communications processor.

Key Specifications

Pinout & Package

Package: 516-ball PBGA (VR package, lead-free), 27 mm × 27 mm, 1.0 mm ball pitch, JEDEC MO-251 compliant. Thermal pad on underside requires solder connection to internal ground plane for optimal heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8275CVRMIBA, MPC8272CZQMIBA offers reduced peripheral count for lower-cost TDM edge nodes, while MPC8379EMARDB replaces CPM-based protocol offload with Linux-driven peripherals and security - making it unsuitable for legacy microcode-dependent deployments.

Availability

MPC8275CVRMIBA is available at Aetrix Electronics and suitable for telecom infrastructure, industrial gateways, and legacy TDM equipment requiring stable component supply, long-lifecycle support, and qualified obsolescence management.

Supply support for MPC8275CVRMIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communications markets, with deep heritage in Power Architecture technology acquired from Freescale.

The MPC8275CVRMIBA belongs to the PowerQUICC II family - designed specifically for carrier-grade and enterprise-edge communications equipment requiring deterministic real-time protocol processing, multi-interface integration, and long-term industrial reliability.

FAQ

What is the maximum operating frequency of the MPC8275CVRMIBA core?

The MPC8275CVRMIBA supports a maximum core frequency of 450 MHz, achievable using the internal 8:1 core/bus clock multiplier with a 56.25 MHz CLKIN reference. This requires VDD = 1.45–1.60 V, ambient temperature ≤70°C, and junction temperature maintained ≤105°C via proper thermal design per the 11°C/W RθJB specification.

Does the MPC8275CVRMIBA support UTOPIA II interfaces?

No, the MPC8275CVRMIBA does not support UTOPIA II interfaces. According to the MPC8280EC Rev. 2 documentation, UTOPIA II ports are exclusive to MPC8280 and MPC8275ZQ variants - the VR-package MPC8275CVRMIBA omits this feature, limiting its ATM SAR capability to FCC-based implementations without UTOPIA physical layer support.

How many TDM ports does the MPC8275CVRMIBA support?

The MPC8275CVRMIBA supports four TDM ports (TDM2[A–D]) via a single Serial Interface (SI) block. This is confirmed in Section 1.1 Features of the MPC8280EC document, which states that MPC8270 and VR/ZQ packages have "only 1 SI block and 4 TDM ports", distinguishing it from the MPC8280's dual-SI, eight-TDM configuration.

What is the purpose of the CPM in the MPC8275CVRMIBA?

The Communications Processor Module (CPM) in the MPC8275CVRMIBA is a dedicated 32-bit RISC microcontroller that executes protocol microcode independently of the G2_LE core. It handles time-critical serial communications - including HDLC, UART, BISYNC, and TDM framing - freeing the main CPU for application tasks and ensuring deterministic latency for telecom protocols.

Is the MPC8275CVRMIBA pin-compatible with the MPC8280?

No, the MPC8275CVRMIBA is not pin-compatible with the MPC8280. Although both use 516-ball PBGA packages, the MPC8280 uses the VR package code for MPC8275VR devices but implements different pin functions - particularly for UTOPIA II, TC layer, and second MCC signals - which are absent or repurposed in the MPC8275CVRMIBA silicon.