NXP Semiconductors MPC8275ZQMIBA

Overview

MPC8275ZQMIBA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II integrated communications processor featuring a dual-issue G2_LE Power Architecture core, 3 Fast Communication Controllers (FCCs), 4 Serial Communications Controllers (SCCs), and 3× 10/100-Mbps Ethernet MACs. It operates at up to 450 MHz with separate PLLs for core and CPM, and targets network edge routers, industrial gateways, and telecom access equipment.

For engineers reviewing the MPC8275ZQMIBA datasheet, MPC8275ZQMIBA pinout, MPC8275ZQMIBA application, or MPC8275ZQMIBA equivalent, key selection considerations include its 516-pin PBGA package, UTOPIA II support (on selected variants), TDM interface capability (4 channels), PCI bridge compliance (Rev 2.2), and dual-voltage operation (1.45–1.60 V core / 3.135–3.465 V I/O).

Technical Context

The MPC8275ZQMIBA implements a 32-bit G2_LE core derived from the EC603e microprocessor, supporting frequencies from 166 MHz to 450 MHz with 16 KB instruction and 16 KB data caches-both four-way set associative and physically addressed. Its Communications Processor Module (CPM) integrates a 32-bit RISC coprocessor with 32 KB dual-port RAM/ROM, enabling offload of protocol processing including HDLC, UART, and Ethernet MAC functions.

It features a 64-bit 60x bus (up to 100 MHz) and a 32-bit local bus (up to 100 MHz), both with programmable burst transfers and parity/ECC support. The on-chip 60x-to-PCI bridge complies with PCI Specification Rev 2.2, supports 32-bit/66 MHz operation, and provides DMA, address remapping, and hot-swap readiness per PICMG 2.1.

Key Specifications

Pinout & Package

Package: 516-ball plastic ball grid array (PBGA), lead-free, ZQ variant (as indicated by suffix "ZQ" in MPC8275ZQMIBA). Dimensions: 27 mm × 27 mm, 1.27 mm ball pitch, JEDEC MO-205 standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8275ZQMIBA, MPC8280VRMIBA extends telecom functionality with TC/IMA but increases cost and power; MPC8315EVRAGDB offers modern security and memory features but requires PCB redesign and software porting due to architectural divergence.

Availability

MPC8275ZQMIBA is available at Aetrix Electronics and suitable for industrial gateways, telecom access nodes, and enterprise branch routers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MPC8275ZQMIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, formed from the acquisition of Freescale Semiconductor in 2015.

The MPC8275ZQMIBA belongs to the PowerQUICC II family - designed specifically for cost-sensitive, high-reliability communications infrastructure where integrated protocol acceleration and deterministic real-time performance are critical.

FAQ

What is the maximum operating frequency of the MPC8275ZQMIBA core?

The MPC8275ZQMIBA supports a maximum core frequency of 450 MHz, achieved using internal PLL multiplication ratios up to 8:1 relative to the CLKIN reference. This rating is validated under recommended operating conditions (VDD = 1.45–1.60 V, TA = 0–70°C) and requires adequate thermal management - junction temperature must remain ≤105°C per datasheet limits.

Does the MPC8275ZQMIBA support UTOPIA II interface?

Yes, the MPC8275ZQMIBA supports UTOPIA II - specifically in the ZQ package variant (as confirmed by MPC8280EC Rev. 2, Table 2 and Figure 1 notes). It provides two UTOPIA II ports capable of 155 Mbps full-duplex ATM SAR operation, intended for interfacing with ADSL or SONET PHY devices.

What package type does MPC8275ZQMIBA use, and what are its mechanical dimensions?

MPC8275ZQMIBA uses a 516-ball plastic ball grid array (PBGA) package with lead spheres (ZQ designation), measuring 27 mm × 27 mm with 1.27 mm ball pitch. It conforms to JEDEC MO-205 standard and requires thermal vias to inner ground planes for thermal reliability above 1.5 W power dissipation.

Can the MPC8275ZQMIBA operate in slave mode with an external master processor?

Yes, the MPC8275ZQMIBA supports slave mode operation: its CPU core can be disabled via reset configuration, allowing the device to function solely as a peripheral controlled by an external master over the 60x or local bus. This mode leverages the on-chip memory controller and CPM peripherals while bypassing G2_LE execution.

What are the supported memory interface types for the MPC8275ZQMIBA?

The MPC8275ZQMIBA supports glueless interfacing to SRAM, page-mode SDRAM, DRAM, EPROM, and Flash memory via its 12-bank memory controller. It includes dedicated SDRAM logic, programmable bank sizes, byte write enables, and parity generation - but does not support DDR or LPDDR technologies, which were introduced in later PowerQUICC generations.