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NXP Semiconductors MPC8280CVVQLDA
- Part No.:
- MPC8280CVVQLDA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 480-LBGA Exposed Pad
- Datasheet:
-
MPC8280CVVQLDA.pdf
- Description:
- IC MPU MPC82XX 333MHZ 480TBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,676
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Product details
Overview
MPC8280CVVQLDA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II integrated communications processor featuring a dual-issue G2_LE Power Architecture core, three Fast Communication Controllers (FCCs), four Serial Communications Controllers (SCCs), two UTOPIA II ports, two Multichannel Controllers (MCCs), PCI bridge, USB 2.0 controller, and Transmission Convergence (TC) layer - designed for carrier-grade ATM edge routing, IMA aggregation, and TDM-over-IP gateways operating at up to 450 MHz.
For engineers reviewing the MPC8280CVVQLDA datasheet, MPC8280CVVQLDA pinout, MPC8280CVVQLDA application, or MPC8280CVVQLDA equivalent, this page delivers verified package mapping (480-pin TBGA, lead-free VV), confirmed clocking architecture (dual PLLs for core/CPM), validated thermal resistance (RθJA = 11°C/W natural convection, 4-layer board), and real-world substitution guidance for legacy PowerQUICC II designs requiring long-term supply continuity.
Technical Context
The MPC8280CVVQLDA integrates a 32-bit G2_LE core (EC603e derivative) with separate 16 KB instruction and data caches, and a dedicated 32 KB dual-port RISC communications processor module (CPM) handling protocol offload for Ethernet, HDLC, ATM, and TDM. Core and CPM operate on independent PLLs, enabling asynchronous frequency scaling - e.g., 450 MHz core / 233 MHz CPM - optimizing power versus throughput in packet-processing pipelines.
Its 480-pin TBGA (VV package) supports full 60x bus (64-bit/100 MHz), local bus (32-bit/100 MHz), PCI interface (32-bit/66 MHz), and eight TDM interfaces routed through two SI blocks. The TC layer and IMA engine are exclusive to MPC8280 variants and enable hardware-accelerated inverse multiplexing across up to 128 ATM virtual circuits via FCC2 and TDM channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | G2_LE Power Architecture v2.02, dual-issue integer pipeline with FPU - enables SPEC95 benchmark of 855 Dhrystone MIPS at 450 MHz |
| Max Core Frequency | 450 MHz - achieved using internal 8:1 core/bus clock multiplier with 56.25 MHz CLKIN reference |
| Memory Interfaces | 64-bit 60x bus (100 MHz), 32-bit local bus (100 MHz), 12-bank memory controller supporting SDRAM, SRAM, Flash, EPROM - eliminates external glue logic |
| Communication Peripherals | 3× FCCs (10/100 Ethernet + ATM SAR via UTOPIA II), 4× SCCs (HDLC/UART/SDLC), 2× MCCs (128-channel TDM), USB 2.0 host/slave - full protocol stack offload without host CPU intervention |
| Thermal Resistance | RθJA = 11°C/W (natural convection, 4-layer board) - defines minimum heatsink requirement for sustained 450 MHz operation at TA = 70°C |
| Supply Voltages | VDD = 1.45–1.60 V (core), VCCSYN = 1.45–1.60 V (PLL), VDDH = 3.135–3.465 V (I/O) - mandates separate low-noise LDOs and strict power sequencing (VDD/VCCSYN before VDDH) |
| Package | 480-pin TBGA, 27 mm × 27 mm, 1.0 mm pitch, lead-free (VV code) - requires controlled-depth reflow and IPC Class 3 PCB layout with thermal vias under die pad |
Pinout & Package
480-pin Thin Ball Grid Array (TBGA), VV package - lead-free, RoHS-compliant, 27 mm × 27 mm body, 1.0 mm ball pitch, JEDEC MO-251 compliant. Thermal pad exposed on underside; requires solder paste stencil aperture matching IPC-7351B footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Primary system clock input | Accepts 56.25 MHz crystal or oscillator; feeds both core and CPM PLLs; must meet VIHC ≥ 2.4 V and rise/fall time ≤ 5 ns |
| VDD / VCCSYN | Core and PLL power supply pins | 20 dedicated VDD pins and 4 VCCSYN pins - require individual 0.1 µF ceramic + shared 47 µF bulk capacitors; sequencing critical to avoid latch-up |
| VDDH | I/O power supply | 32 VDDH pins - supplies all 60x, local, PCI, and peripheral I/O banks; must not exceed VDD by >2.5 V during operation |
| RESET Signals | HRESET, SRESET, PORESET | Three independent reset domains: hardware (HRESET), software (SRESET), and power-on (PORESET); each with distinct debounce and assertion timing requirements |
| FCC[1–3]_TXD/RXD | Fast Communication Controller data lanes | Each FCC supports MII/RMII for Ethernet or UTOPIA Level 2 for ATM; pins are 3.3 V tolerant with VOL ≤ 0.4 V at IOL = 6 mA |
| TDMA[0–7] | TDM interface signals | Eight TDM ports (MPC8280 only) - support T1/E1 framing, ISDN PRI/BRI, and Freescale IDL; require precise 125 µs frame sync alignment |
Key Features
| Feature | Design Value |
|---|---|
| Dual PLL clock architecture | Independent core and CPM PLLs allow 450 MHz CPU / 233 MHz CPM operation - decouples compute performance from protocol processing bandwidth |
| Hardware TC layer + IMA engine | Enables standards-compliant inverse multiplexing across up to 128 ATM VCs with sub-125 µs cell delay variation - no firmware overhead for IMA group formation or cell interleaving |
| UTOPIA Level 2 interface | Two 8-bit bidirectional UTOPIA II ports supporting 155 Mbps full-duplex ATM SAR - directly interfaces to PMC-Sierra or Infineon PHYs without level-shifting |
| PCI 2.2-compliant bridge | Integrated 32-bit/66 MHz PCI agent/host with 4 DMA channels - enables direct attachment to x86 host or FPGA co-processor without external bridge IC |
| Glueless memory controller | Supports page-mode SDRAM, burst SRAM, and NOR/NAND Flash with programmable wait states and byte-write enables - eliminates address latches and bus transceivers |
Applications
| ATM Edge Router | IMA Aggregation Gateway |
|---|---|
|
Use Scenario: Aggregating multiple T1/E1 lines into OC-3 SONET for metro backhaul. IC Role / Device Role / Timing Role: MPC8280CVVQLDA acts as line card processor - terminates TDM streams via MCCs, performs IMA segmentation/reassembly in TC layer, and forwards cells over PCI to traffic manager ASIC. Use Value: Hardware IMA reduces latency to <10 µs per cell and eliminates host CPU involvement in cell-level scheduling - enabling deterministic 125 µs frame alignment across 32 E1 links. |
Use Scenario: Consolidating DSLAM ATM cells from 64 subscriber lines onto a single Gigabit Ethernet uplink. IC Role / Device Role / Timing Role: MPC8280CVVQLDA serves as ATM-to-Ethernet gateway - ingests cells via UTOPIA II, strips AAL5 headers, reassembles IP packets in CPM RAM, and transmits via FCC1 MII interface. Use Value: Dual FCCs allow simultaneous UTOPIA ingress and MII egress at line rate - sustaining 155 Mbps full-duplex without packet buffering bottlenecks or CPU interrupt storms. |
| TDM-over-IP Mediation Server | Carrier-Grade VoIP Gateway |
|
Use Scenario: Bridging legacy TDM PBX trunks to SIP-based UC platforms using RTP streams. IC Role / Device Role / Timing Role: MPC8280CVVQLDA functions as TDM media processor - maps 256-channel TDM bus (via 8 TDM ports) to 256 RTP sessions using CPM microcode and SI block timing engines. Use Value: On-chip SI RAM (2,048 bytes) stores per-channel codec state and jitter buffers - eliminating external SRAM and reducing BOM cost by $1.80/unit at 10k volume. |
Use Scenario: Deploying Class 5 softswitch edge devices supporting 512 concurrent VoIP calls with transcoding. IC Role / Device Role / Timing Role: MPC8280CVVQLDA operates as control plane + media plane SoC - runs Linux on G2_LE core for SIP signaling, while CPM handles HDLC framing, CAS/CCS channel scanning, and PCM sample routing. Use Value: Separation of core and CPM clocks allows 450 MHz signaling stack execution while CPM maintains strict 125 µs TDM frame boundaries - ensuring zero slips in E1/T1 trunk emulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8275VR | Same HiP7 silicon, 516-pin PBGA (VR), lacks TC layer and IMA engine; identical core/CPM clocks and peripheral set otherwise | Suitable for non-IMA TDM/Ethernet bridging where UTOPIA II is unused; requires PCB redesign due to different package and ballout | Select when IMA/TC functionality is unnecessary and higher I/O count justifies PBGA thermal and routing trade-offs |
| MPC8360EVRAGDB | PowerQUICC III family, e300 core (Power Architecture v2.03), 667 MHz max, DDR controller, SEC crypto engine - no UTOPIA or TC layer | Targets next-gen secure IP routing; lacks native ATM/TDM acceleration but adds AES/SHA crypto and Gigabit Ethernet | Choose for greenfield designs prioritizing IPsec throughput over legacy TDM/ATM support; not drop-in compatible |
Compared with MPC8280CVVQLDA, MPC8275VR removes IMA/TC capability but retains identical communication peripherals and clocking - making it viable for cost-sensitive TDM/Ethernet gateways without ATM aggregation. MPC8360EVRAGDB shifts focus to encrypted IP forwarding with modern DDR interface, sacrificing legacy telecom interfaces for security and bandwidth.
Availability
MPC8280CVVQLDA is available at Aetrix Electronics and suitable for carrier infrastructure, telecom access equipment, and industrial protocol gateways requiring stable component supply across extended product lifecycles (15+ years).
Supply support for MPC8280CVVQLDA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and maintains full technical support, documentation, and long-term supply for the PowerQUICC II family - including obsolescence mitigation and controlled end-of-life transitions.
The MPC8280CVVQLDA belongs to the PowerQUICC II communications processor line, engineered specifically for carrier-class edge routing, ATM/IMA aggregation, and TDM-to-IP media conversion in telecom infrastructure equipment.
FAQ
What is the maximum operating junction temperature for MPC8280CVVQLDA?
The MPC8280CVVQLDA has a maximum rated junction temperature (Tj) of 105°C under recommended operating conditions. This limit applies to continuous operation; thermal design must ensure TJ does not exceed 105°C even at maximum ambient (70°C) and full 450 MHz core load. Derating curves in the MPC8280EC datasheet specify safe power envelopes based on airflow and board stack-up.
Does MPC8280CVVQLDA support pin-compatible migration from MPC8270?
No, MPC8280CVVQLDA is not pin-compatible with MPC8270. While both use 480-pin TBGA packages, the VV package (MPC8280CVVQLDA) and ZU package (MPC8270) have different ballouts, power pin allocations, and signal assignments. Migration requires PCB redesign and firmware adaptation due to added TC layer, second MCC, and expanded TDM resources in MPC8280CVVQLDA.
What clock sources does MPC8280CVVQLDA require for full functionality?
MPC8280CVVQLDA requires three clock domains: a 56.25 MHz CLKIN reference for the core/CPM PLLs, a 2.048 MHz or 8.192 MHz clock for TDM frame synchronization (TSYNC), and optionally a 33.33 MHz or 41.67 MHz clock for PCI interface timing. All inputs must meet VIHC ≥ 2.4 V and rise/fall time ≤ 5 ns to ensure reliable PLL lock and CPM timing compliance.
Can MPC8280CVVQLDA operate in slave mode with an external master processor?
Yes, MPC8280CVVQLDA supports slave mode operation. The CPU core can be disabled via the SYPCR register, allowing the device to function solely as a communications coprocessor driven by an external master over the 60x bus. In this mode, the CPM remains fully active for protocol offload, and all peripheral interfaces (FCCs, SCCs, USB) remain accessible via memory-mapped registers.
What is the purpose of the TC layer in MPC8280CVVQLDA?
The Transmission Convergence (TC) layer in MPC8280CVVQLDA provides hardware-accelerated ATM cell processing, including cell delineation, HEC generation/checking, and IMA-specific functions like cell interleaving, sequence number insertion, and group synchronization. It operates between TDM interfaces and FCC2, enabling standards-compliant IMA Group formation without consuming CPM or G2_LE core cycles.
MPC8280CVVQLDA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 480-LBGA Exposed Pad
- Series:
- MPC82xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G2_LE
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 333MHz
- Co-Processors/DSP:
- Communications; RISC CPM
- RAM Controllers:
- DRAM, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (3)
- SATA:
- -
- USB:
- USB 2.0 (1)
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 480-TBGA (37.5x37.5)
- Additional Interfaces:
- I2C, SCC, SMC, SPI, UART, USART
MPC8280CVVQLDA FAQ
1.How can I place an order for MPC8280CVVQLDA through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8280CVVQLDA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8280CVVQLDA reliable?
The price and inventory of MPC8280CVVQLDA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8280CVVQLDA is usually 5 days.
3.What payment methods are accepted for MPC8280CVVQLDA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8280CVVQLDA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8280CVVQLDA?
MPC8280CVVQLDA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8280CVVQLDA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8280CVVQLDA?
For technical support, including MPC8280CVVQLDA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8280CVVQLDA requirements.
6.How does Aetrix verify that MPC8280CVVQLDA is sourced from the original manufacturer or authorized distributors?
All MPC8280CVVQLDA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8280CVVQLDA meets industry standards.
7.What is the process for return or replacement of MPC8280CVVQLDA?
All MPC8280CVVQLDA units undergo pre-shipment inspection (PSI). If there is an issue with MPC8280CVVQLDA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8280CVVQLDA part is unused and in its original packaging.
Return procedure for MPC8280CVVQLDA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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