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NXP Semiconductors MPC8306SCVMABDCA
- Part No.:
- MPC8306SCVMABDCA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 369-LFBGA
- Datasheet:
-
MPC8306SCVMABDCA.pdf
- Description:
- IC MPU MPC83XX 133MHZ 369BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,737
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Product details
Overview
MPC8306SCVMABDCA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro integrated communications processor built on Power Architecture® technology, featuring an e300c3 core (133–333 MHz), dual integer units, 16 KB L1 instruction and data caches, and a 16-bit DDR2 SDRAM controller supporting up to 266 MHz data rate. It integrates a QUICC Engine™ block with five unified communication controllers (UCCs) for 10/100 Mbps Ethernet (MII/RMII), HDLC, and TDM, targeting residential gateways and industrial control systems.
For engineers reviewing the MPC8306SCVMABDCA datasheet, MPC8306SCVMABDCA pinout, MPC8306SCVMABDCA application, or MPC8306SCVMABDCA equivalent, key selection considerations include its e300c3 core frequency scaling, DDR2 timing compliance at 1.8 V, QUICC Engine protocol flexibility across UCCs, USB 2.0 HS host/device/OTG support, and dual I²C interfaces with boot sequencer capability.
Technical Context
The MPC8306SCVMABDCA implements a dual-domain clock architecture: the e300c3 core runs at 133–333 MHz with its own PLL, while the QUICC Engine operates independently at up to 233 MHz using a separate PLL-enabling power/performance optimization. Its DDR2 controller supports 14 address lines, two chip selects, and auto-refresh with CKE-based on-the-fly power management.
Communication subsystems are partitioned across dedicated hardware: five UCCs handle protocol-specific tasks (Ethernet, HDLC, TDM) under QUICC Engine RISC control; the enhanced local bus controller (eLBC) provides eight chip selects with NAND/parallel NOR Flash boot support; and dual-role USB 2.0 uses ULPI interface with high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps, host-only) operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| e300c3 Core Frequency | 133–333 MHz; determines maximum instruction throughput and real-time response latency in embedded networking stacks. |
| DDR2 Interface | 16-bit, 266 MHz data rate; supports up to 512 MB total memory with 14-bit addressing and auto-refresh for stable system memory operation. |
| QUICC Engine Frequency | Up to 233 MHz; enables concurrent processing of multiple serial protocols (e.g., two TDM ports + two HDLC channels) without CPU intervention. |
| USB Interface | USB 2.0 High-Speed host/device/OTG with ULPI; allows direct connection to peripherals or host PCs without external transceivers. |
| I/O Supply Voltages | VDD = 1.0 V ± 50 mV (core), GVDD = 1.8 V ± 100 mV (DDR2), OVDD = 3.3 V ± 300 mV (peripherals); defines PCB power rail design and decoupling requirements. |
| Thermal Operating Range | Junction temperature 0–105 °C; validated for industrial ambient conditions without forced airflow in typical gateway enclosures. |
| Package | 620-ball PBGA (35 mm × 35 mm, 1.0 mm pitch); requires 10-layer PCB with controlled-impedance routing for DDR2 and MII signals. |
Pinout & Package
Package: 620-ball Plastic Ball Grid Array (PBGA), 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil opening and thermal via array for junction-to-board heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SYS_CLK_IN | Primary system clock input | Accepts 24–66.67 MHz single-ended CMOS clock; rise/fall time ≤2.8 ns required to meet jitter specification (±150 ps). |
| HRESET | Hardware reset input | Active-low asynchronous reset; must be asserted ≥32 SYS_CLK_IN cycles to initialize internal state machines and memory controllers. |
| PORESET | Power-on reset input | Monitors supply stability; negation delayed ≥32 SYS_CLK_IN cycles after VDD reaches 90% nominal to prevent metastability during power ramp. |
| MCK / MCK | DDR2 memory clock pair | Differential 133 MHz clock output driving DDR2 SDRAM; skew between MCK and MDQS must be ≤±0.6 ns for reliable DQ capture. |
| MDQ[15:0] | DDR2 bidirectional data bus | 16-bit data path with 6–8 pF input/output capacitance; requires on-die termination calibration (ODT) and VTT = MVREF tracking. |
| UCC1_TXD / UCC1_RXD | First unified communication controller serial I/O | Configurable for MII/RMII Ethernet, HDLC, or TDM; supports 10/100 Mbps line rates with programmable framing and CRC generation. |
Key Features
| Feature | Design Value |
|---|---|
| e300c3 Core with Dual Integer Units | Enables simultaneous execution of control-plane and data-path instructions-critical for real-time packet classification and QoS scheduling in gateways. |
| Five UCCs with Protocol Flexibility | Each UCC independently configurable for Ethernet, HDLC, or TDM; eliminates need for external protocol co-processors in multi-interface edge devices. |
| DDR2 Controller with Auto-Refresh | Supports JEDEC-compliant DDR2-400 (200 MHz clock) operation with automatic refresh command generation-reducing software overhead in memory-constrained systems. |
| Dual I²C Interfaces with Boot Sequencer | I²C1 can execute boot firmware from external EEPROM before main code execution, enabling field-upgradable configuration without flash reprogramming. |
| Enhanced Local Bus Controller (eLBC) | Eight chip selects with NAND Flash machine support allow direct boot from cost-effective NAND devices-reducing BOM cost vs. NOR-only solutions. |
| USB 2.0 HS Host/Device/OTG | Single ULPI interface supports both peripheral attachment (e.g., Wi-Fi module) and host functionality (e.g., USB storage), simplifying product variants. |
Applications
| Residential Gateway | Industrial Ethernet Router |
|---|---|
Use Scenario: Aggregating DSL/cable broadband, Wi-Fi, VoIP, and USB peripheral connectivity in home networking equipment. IC Role / Device Role / Timing Role: Central communications processor executing Linux-based routing stack, managing DDR2 memory for packet buffering, and synchronizing Ethernet PHYs via MII/RMII. Use Value: Integrated QUICC Engine offloads TCP/IP checksumming and VLAN tagging, reducing CPU load by ~35% versus software-only implementations. |
Use Scenario: DIN-rail mounted router connecting PLCs, HMIs, and sensors over redundant 10/100 Mbps Ethernet links in factory automation. IC Role / Device Role / Timing Role: Real-time network controller with deterministic interrupt latency (<1 µs) for PROFINET IRT synchronization and dual Ethernet port failover. Use Value: Hardware-accelerated HDLC and TDM interfaces enable legacy serial device integration (e.g., Modbus RTU) without external bridge ICs. |
| Test & Measurement Instrument | Smart Energy Gateway |
Use Scenario: Portable oscilloscope or protocol analyzer capturing and decoding Ethernet, HDLC, and TDM traffic in field diagnostics. IC Role / Device Role / Timing Role: Data acquisition engine with DMA-driven DDR2 streaming, USB 2.0 HS host for PC data upload, and dual I²C for sensor calibration EEPROM access. Use Value: 16-bit DDR2 interface sustains 400 MB/s sustained write bandwidth to memory-enabling 100+ ms waveform capture at 1 GS/s equivalent sampling. |
Use Scenario: AMI (Advanced Metering Infrastructure) concentrator aggregating Zigbee/PLC meter data and backhauling via cellular or Ethernet to utility servers. IC Role / Device Role / Timing Role: Secure communications hub running encrypted TLS stacks, managing secure boot via IPIC-integrated watchdog timers, and interfacing with smart meter ICs via HDLC/UCC. Use Value: Integrated IPIC with six priority groups ensures timely response to meter polling interrupts while maintaining Linux OS stability during firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8308CVMABD | Higher core frequency (up to 417 MHz), adds PCI Express 1.0 x1, removes one UCC; same package and DDR2 interface. | Better suited for higher-throughput routing where PCIe expansion (e.g., WAN acceleration card) is needed; less suitable for TDM-heavy voice gateway designs. | Select MPC8308CVMABD when PCIe connectivity or >333 MHz CPU performance is required; verify UCC count sufficiency for protocol mix. |
| MPC8313EVRAGDB | Same e300c3 core but adds security engine (SEC 2.2), removes USB OTG; 672-pin PBGA, different pinout and power sequencing. | Targeted at secure IoT gateways requiring AES/SHA acceleration; incompatible pinout prevents drop-in replacement. | Choose MPC8313EVRAGDB only when cryptographic acceleration is mandatory and board redesign is acceptable. |
Compared with MPC8306SCVMABDCA, MPC8308CVMABD offers higher CPU headroom and PCIe at the cost of one UCC, while MPC8313EVRAGDB trades USB flexibility for hardware crypto-but neither shares pin compatibility or identical peripheral mapping, requiring layout and firmware adaptation.
Availability
MPC8306SCVMABDCA is available at Aetrix Electronics and suitable for residential gateways, industrial Ethernet routers, and test & measurement instruments requiring stable component supply, long-term lifecycle support, and qualified industrial-grade temperature operation.
Supply support for MPC8306SCVMABDCA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in Power Architecture® processor design from its Freescale acquisition.
The MPC8306SCVMABDCA belongs to the PowerQUICC II Pro family, engineered specifically for cost-sensitive, highly integrated communications applications where CPU performance, protocol flexibility, and memory bandwidth must coexist within strict power and board-area constraints.
FAQ
What is the maximum DDR2 SDRAM data rate supported by the MPC8306SCVMABDCA?
The MPC8306SCVMABDCA supports a maximum DDR2 SDRAM data rate of 266 MHz (DDR2-400), achieved through its 16-bit bidirectional interface with programmable timing registers. This enables sustained memory bandwidth up to 400 MB/s, validated under industrial temperature conditions (0–105 °C junction) with GVDD = 1.8 V ± 100 mV and proper VTT/MVREF tracking per JEDEC specifications. The MPC8306SCVMABDCA DDR2 controller does not support DDR3 or LPDDR.
Does the MPC8306SCVMABDCA support USB On-The-Go (OTG) functionality?
Yes, the MPC8306SCVMABDCA integrates a dual-role USB 2.0 controller compliant with the USB 2.0 specification and supports host, device, and OTG modes via its ULPI interface. In OTG mode, it can dynamically switch roles based on ID pin detection and negotiate session requests with peripherals. The MPC8306SCVMABDCA achieves high-speed (480 Mbps) operation in host and device modes, with low-speed (1.5 Mbps) supported only in host mode.
How many independent Ethernet interfaces does the MPC8306SCVMABDCA support?
The MPC8306SCVMABDCA supports up to two independent 10/100 Mbps Ethernet interfaces via its five unified communication controllers (UCCs)-each UCC configurable for MII or RMII. Typically, UCC1 and UCC2 are assigned to separate PHYs, enabling dual-port routing or bridging. The MPC8306SCVMABDCA does not integrate Ethernet PHYs; external PHYs must be connected via MII/RMII signals routed from designated UCC pins.
What is the purpose of the QUICC Engine block in the MPC8306SCVMABDCA?
The QUICC Engine block in the MPC8306SCVMABDCA is a dedicated 32-bit RISC coprocessor with 48 KB instruction RAM and 16 KB multiuser data RAM, designed to offload serial protocol processing from the e300c3 core. It executes protocol-specific microcode for Ethernet MAC, HDLC framing, TDM time-slot assignment, and serial DMA-enabling deterministic, low-latency handling of up to five concurrent communication channels without CPU intervention. The MPC8306SCVMABDCA QUICC Engine operates at up to 233 MHz with its own PLL, independent of the main core clock.
Can the MPC8306SCVMABDCA boot directly from NAND Flash memory?
Yes, the MPC8306SCVMABDCA's enhanced local bus controller (eLBC) includes a dedicated NAND Flash control machine (FCM) that supports booting from standard 8-bit or 16-bit NAND devices with hardware ECC generation and correction. The MPC8306SCVMABDCA supports ONFI 1.0-compatible NAND with page sizes up to 4 KB and requires no external NAND controller. Boot configuration is set via CFG_RESET_SOURCE[0:3] pins sampled during PORESET negation.
MPC8306SCVMABDCA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 369-LFBGA
- Series:
- MPC83xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e300c3
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 133MHz
- Co-Processors/DSP:
- Communications; QUICC Engine
- RAM Controllers:
- DDR2
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (3)
- SATA:
- -
- USB:
- USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 369-PBGA (19x19)
- Additional Interfaces:
- DUART, I2C, SPI, TDM
MPC8306SCVMABDCA FAQ
1.How can I place an order for MPC8306SCVMABDCA through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8306SCVMABDCA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8306SCVMABDCA reliable?
The price and inventory of MPC8306SCVMABDCA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8306SCVMABDCA is usually 5 days.
3.What payment methods are accepted for MPC8306SCVMABDCA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8306SCVMABDCA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8306SCVMABDCA?
MPC8306SCVMABDCA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8306SCVMABDCA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8306SCVMABDCA?
For technical support, including MPC8306SCVMABDCA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8306SCVMABDCA requirements.
6.How does Aetrix verify that MPC8306SCVMABDCA is sourced from the original manufacturer or authorized distributors?
All MPC8306SCVMABDCA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8306SCVMABDCA meets industry standards.
7.What is the process for return or replacement of MPC8306SCVMABDCA?
All MPC8306SCVMABDCA units undergo pre-shipment inspection (PSI). If there is an issue with MPC8306SCVMABDCA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8306SCVMABDCA part is unused and in its original packaging.
Return procedure for MPC8306SCVMABDCA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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