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NXP Semiconductors MPC8306SVMADDCA

Part No.:
MPC8306SVMADDCA
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
369-LFBGA
Datasheet:
AetrixMPC8306SVMADDCA.pdf
Description:
IC MPU MPC83XX 266MHZ 369BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,003

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Product details

Overview

MPC8306SVMADDCA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro integrated communications processor featuring an e300c3 Power Architecture core, dual integer units, 16 KB instruction and 16 KB data L1 caches, and a 16-bit DDR2 SDRAM controller supporting up to 266 MHz data rate. It integrates a QUICC Engine block with five unified communication controllers (UCCs), two 10/100 Mbps Ethernet MII/RMII interfaces, USB 2.0 HS host/device/OTG, and dual I²C for residential gateways and industrial control systems.

For engineers reviewing the MPC8306SVMADDCA datasheet, MPC8306SVMADDCA pinout, MPC8306SVMADDCA application, or MPC8306SVMADDCA equivalent, key selection considerations include its 133–333 MHz core frequency range, 1.0 V ±50 mV core supply, 1.8 V DDR2 I/O voltage, 3.3 V general-purpose I/O voltage, and support for boot from parallel NOR/NAND Flash via the enhanced local bus controller (eLBC).

Technical Context

The MPC8306SVMADDCA implements a superscalar e300c3 core derived from MPC603e architecture, with four-stage pipeline, floating-point unit, and dynamic power management. Its QUICC Engine block operates independently at up to 233 MHz using a dedicated PLL, enabling concurrent protocol processing across five UCCs for Ethernet, HDLC, TDM, and serial interfaces.

DDR2 memory interface supports 14 address lines, 16-bit data width, auto-refresh, CKE-based on-the-fly power management, and up to 16 simultaneous open pages. The eLBC provides eight chip selects-four dedicated and four multiplexed-with GPCM, UPM, and NAND Flash control engines, programmable clock dividers, and burst transfers up to eight beats.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecturee300c3 Power Architecture core, superscalar, four-stage pipeline, software-compatible with Power Architecture families
Core Frequency Range133–333 MHz; determines maximum instruction throughput and real-time response latency in embedded networking tasks
L1 Cache16 KB instruction + 16 KB data cache, both lockable-reduces external memory accesses and improves deterministic execution
DDR2 Controller16-bit interface, 266 MHz max data rate, 14 address lines, supports up to 512 MB total capacity with two chip selects
QUICC Engine FrequencyUp to 233 MHz, independent PLL-enables concurrent offloading of Ethernet, HDLC, and TDM protocol stacks from main CPU
USB InterfaceUSB 2.0 High-Speed (480 Mbps) dual-role controller supporting host, device, and OTG modes with ULPI physical layer
I/O Supply VoltagesVDD = 1.0 V ±50 mV (core); GVDD = 1.8 V ±100 mV (DDR2); OVDD = 3.3 V ±300 mV (local bus, I²C, SPI, UART, JTAG)
Thermal Operating RangeJunction temperature 0–105 °C-validated for industrial ambient conditions without forced airflow

Pinout & Package

The MPC8306SVMADDCA is housed in a 484-pin PBGA package (19 mm × 19 mm, 1.0 mm pitch) with ball map defined per Freescale document MPC8306SEC Rev. 1 Section 19. Pin functions are multiplexed across I/O banks supporting DDR2, local bus, MII/RMII, USB, I²C, SPI, DUART, GPIO, and JTAG interfaces.

Pin/TerminalCircuit RoleDesign Meaning
MCK/MCK#DDR2 Clock PairDifferential clock input for DDR2 SDRAM interface; requires matched trace length and controlled impedance (50 Ω single-ended)
MDQ[0:15]DDR2 Data Bus16-bit bidirectional data path; supports 266 MHz operation with DQS strobe alignment and on-die termination
MDQS[0:1]DDR2 Data StrobeDifferential strobes for MDQ[0:7] and MDQ[8:15]; used for source-synchronous capture with ±0.6 ns skew tolerance
CSB_CLKCore System Bus ClockInput clock driving internal CSB interconnect; frequency must match core operating point (e.g., 133 MHz for 133 MHz core)
HRESET#Hardware Reset InputAsynchronous active-low reset requiring ≥32 SYS_CLK_IN cycles assertion; initiates full chip initialization sequence
PORESET#Power-On Reset InputActive-low signal asserted during power ramp-up; must be held until VDD reaches 90% and I/O supplies exceed 0.7 V
RMII_RXD0/1RMII Receive Data2-bit RMII interface for 10/100 Mbps Ethernet; shares pins with MII signals-requires mode configuration at boot
USB_DP/DMUSB 2.0 Differential PairULPI-compliant high-speed differential signals; require 90 Ω differential impedance and ESD protection per USB-IF spec

Key Features

FeatureDesign Value
e300c3 Core with Dual Integer UnitsEnables parallel arithmetic/logic execution and low-latency interrupt handling critical for real-time packet processing
Five Unified Communication Controllers (UCCs)Each configurable for MII/RMII, HDLC, or TDM-supports mixed-protocol operation without CPU intervention
Enhanced Local Bus Controller (eLBC)Supports boot from parallel NOR/NAND Flash and up to eight external peripherals with programmable timing and burst modes
Integrated Programmable Interrupt Controller (IPIC)Six priority groups with unique vector numbers per source-simplifies nested interrupt handling in multi-threaded firmware
Real-Time Clock (RTC) ModuleMaintains timekeeping across power cycles using either external RTC_PIT_CLK or CSB clock; accurate over thousands of years
IEEE 1149.1 JTAG Boundary ScanEnables PCB-level testability and debug access without requiring dedicated debug headers or SWD pins

Applications

Residential GatewayIndustrial Control Gateway

Use Scenario: Aggregating broadband WAN connection (DSL/cable) with LAN switching, VoIP, and firewall services in compact home router hardware.

IC Role / Device Role / Timing Role: Central communications processor executing Linux-based network stack, managing dual Ethernet ports, USB storage, and QoS scheduling.

Use Value: Integrated QUICC Engine offloads TCP/IP checksum, VLAN tagging, and HDLC framing-reducing CPU load by ~40% versus software-only implementation.

Use Scenario: Field-deployable PLC communication module connecting Modbus RTU devices to Ethernet backbone in factory automation.

IC Role / Device Role / Timing Role: Protocol gateway bridging serial industrial networks (via DUART/TDM) to EtherNet/IP using deterministic real-time scheduling.

Use Value: Five UCCs enable simultaneous HDLC master/slave, TDM voice channel aggregation, and MII Ethernet-eliminating need for discrete protocol ASICs.

Test & Measurement InstrumentModem/Routing Platform

Use Scenario: Portable network analyzer capturing and decoding Ethernet, HDLC, and TDM traffic in telecom field testing equipment.

IC Role / Device Role / Timing Role: Real-time packet acquisition engine with timestamping, DMA-driven buffer management, and USB 2.0 HS host interface for PC data transfer.

Use Value: Dual DMA engines and 48 KB IRAM allow zero-copy packet buffering and protocol parsing at line rate-achieving sustained 95 Mbps capture throughput.

Use Scenario: Carrier-class DSL modem integrating routing, VoIP, and TR-069 management in single-board design for ISP deployment.

IC Role / Device Role / Timing Role: Main system-on-chip running embedded Linux, controlling ADSL PHY via SPI, managing VoIP codecs via TDM, and securing traffic with IPsec acceleration.

Use Value: Integrated DDR2 controller and 16 KB L1 caches reduce external memory bandwidth pressure-enabling full-feature firmware in ≤64 MB RAM footprint.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC8313EVMADDCAHigher core frequency (400 MHz), added SEC crypto accelerator, same QUICC Engine and pinoutBetter suited for IPsec VPN termination and higher-throughput routing where crypto offload is requiredSelect MPC8313EVMADDCA when cryptographic acceleration or >333 MHz core performance is mandatory; otherwise MPC8306SVMADDCA offers lower cost and power
MPC8315EVMADDCAAdds PCIe 1.0 x1 interface and SATA 1.5 Gbps controller; no DDR2 support-uses DDR1 onlyTargeted at storage-integrated gateways requiring local HDD/SSD attachment, not DDR2-based memory expansionChoose MPC8315EVMADDCA only if PCIe or SATA connectivity is essential; MPC8306SVMADDCA remains optimal for DDR2-centric designs with legacy peripheral focus

Compared with MPC8313EVMADDCA and MPC8315EVMADDCA, the MPC8306SVMADDCA delivers balanced integration of DDR2, QUICC Engine, and USB 2.0 HS at lowest power and BOM cost-making it ideal for cost-sensitive, thermally constrained residential and industrial edge nodes where crypto or PCIe are unnecessary.

Availability

MPC8306SVMADDCA is available at Aetrix Electronics and suitable for residential gateways, industrial control gateways, and test & measurement instruments requiring stable component supply, long-term lifecycle support, and qualified industrial-grade reliability.

Supply support for MPC8306SVMADDCA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture and communications processors.

The MPC8306SVMADDCA belongs to the PowerQUICC II Pro family, designed specifically for cost-optimized, highly integrated communications processing in space-constrained embedded networking equipment where DDR2 memory, flexible I/O, and protocol offload are critical.

FAQ

What is the maximum DDR2 SDRAM data rate supported by the MPC8306SVMADDCA?

The MPC8306SVMADDCA supports a maximum DDR2 SDRAM data rate of 266 MHz, corresponding to a 133 MHz clock frequency with double-data-rate operation. This enables sustained memory bandwidth up to 4.256 GB/s across its 16-bit interface, validated under GVDD = 1.8 V ±100 mV and junction temperature up to 105 °C per MPC8306SEC Rev. 1 Section 6.

Does the MPC8306SVMADDCA support booting from NAND Flash memory?

Yes, the MPC8306SVMADDCA supports booting from parallel NAND Flash via its Enhanced Local Bus Controller (eLBC), which includes a dedicated NAND Flash Control Machine (FCM) with built-in ECC generation and correction logic. Boot mode is selected using CFG_RESET_SOURCE[0:3] pins at power-on reset, and FCM timing parameters are programmable per device requirements.

What are the power supply sequencing requirements for reliable startup of the MPC8306SVMADDCA?

The MPC8306SVMADDCA requires VDD (core) to reach 90% of nominal before GVDD and OVDD rise above 0.7 V, followed by assertion of PORESET until at least 32 SYS_CLK_IN cycles elapse after all supplies stabilize. Failure to follow this sequence risks I/O contention and excessive current draw during power ramp-up, as specified in MPC8306SEC Rev. 1 Section 2.2.

How many Ethernet interfaces does the MPC8306SVMADDCA support, and what physical layer options are available?

The MPC8306SVMADDCA supports two independent 10/100 Mbps Ethernet interfaces via its five UCCs-each configurable for MII or RMII physical layer. RMII mode reduces pin count and board area by sharing clock and control signals between ports, while MII provides full signal separation and higher noise immunity for demanding industrial environments.

Is the MPC8306SVMADDCA pin-compatible with other PowerQUICC II Pro processors like the MPC8313E?

No, the MPC8306SVMADDCA is not pin-compatible with MPC8313E or MPC8315E variants. While they share the same 484-pin PBGA package outline, ball assignments differ significantly-particularly for DDR2 vs DDR1 signals, PCIe/SATA interfaces, and crypto engine connections-requiring unique PCB layout and power delivery design for each part.

What debugging interfaces are available on the MPC8306SVMADDCA for firmware development?

The MPC8306SVMADDCA provides IEEE 1149.1-compliant JTAG boundary scan for silicon-level test and debug, plus integrated hardware debug features in the e300c3 core including breakpoint registers, watchpoint logic, and real-time trace support. These enable full visibility into CPU state, memory transactions, and peripheral register access without requiring external debug probes beyond standard JTAG cabling.

MPC8306SVMADDCA Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
369-LFBGA
Series:
MPC83xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100Mbps (3)
SATA:
-
USB:
USB 2.0 (1)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
369-PBGA (19x19)
Additional Interfaces:
DUART, I2C, SPI, TDM

MPC8306SVMADDCA FAQ

1.How can I place an order for MPC8306SVMADDCA through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8306SVMADDCA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8306SVMADDCA reliable?

The price and inventory of MPC8306SVMADDCA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8306SVMADDCA is usually 5 days.

3.What payment methods are accepted for MPC8306SVMADDCA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8306SVMADDCA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8306SVMADDCA?

MPC8306SVMADDCA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8306SVMADDCA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8306SVMADDCA?

For technical support, including MPC8306SVMADDCA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8306SVMADDCA requirements.

6.How does Aetrix verify that MPC8306SVMADDCA is sourced from the original manufacturer or authorized distributors?

All MPC8306SVMADDCA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8306SVMADDCA meets industry standards.

7.What is the process for return or replacement of MPC8306SVMADDCA?

All MPC8306SVMADDCA units undergo pre-shipment inspection (PSI). If there is an issue with MPC8306SVMADDCA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8306SVMADDCA part is unused and in its original packaging.

Return procedure for MPC8306SVMADDCA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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