Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MPC8313CVRADDC

Part No.:
MPC8313CVRADDC
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
516-BBGA Exposed Pad
Datasheet:
AetrixMPC8313CVRADDC.pdf
Description:
IC MPU MPC83XX 267MHZ 516TEPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,111

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MPC8313CVRADDC from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro communications processor featuring the e300c3 Power Architecture core, dual 10/100/1000 Mbps Ethernet controllers, DDR1/DDR2 memory controller, PCI 2.3 interface, USB 2.0 dual-role controller with on-chip PHY, and integrated programmable interrupt controller - deployed as main CPU or I/O processor in industrial controllers, network access servers, and intelligent NICs.

For engineers reviewing the MPC8313CVRADDC datasheet, MPC8313CVRADDC pinout, MPC8313CVRADDC application, or MPC8313CVRADDC equivalent, key selection considerations include its 333 MHz e300c3 core frequency, dual eTSEC RGMII/SGMII/MII support, 1.0 V core supply, 32-bit PCI host/agent operation, and DDR2-333 memory interface compatibility - all validated for embedded networking and control systems requiring deterministic real-time I/O and cryptographic offload capability.

Technical Context

The MPC8313CVRADDC implements a single-issue, in-order e300c3 core with 16 KB instruction and 16 KB data caches, FPU, and two integer units, operating at up to 333 MHz. Its memory subsystem integrates a unified DDR1/DDR2 controller supporting 16-/32-bit buses at 333 MHz with auto-refresh, CKE-based power management, and 1.8 V / 2.5 V SSTL2-compatible I/O.

Peripherals include two IEEE 802.3-compliant eTSECs with RGMII/SGMII/MII/RMII/RTBI interfaces, TCP/IP acceleration (VLAN, MPLS, ESP/AH header recognition), and IEEE 1588 timestamping; a 32-bit PCI 2.3 controller (66 MHz, 3.3 V only); USB 2.0 dual-role controller with ULPI/PHY options; and four-channel DMA, dual I²C, DUART, SPI, GPIO, and timers - all managed via an integrated programmable interrupt controller supporting 39 discrete sources.

Key Specifications

ParameterValue and Actual Design Meaning
e300c3 Core FrequencyUp to 333 MHz - determines maximum instruction throughput and real-time response latency in control and packet processing tasks.
DDR Memory InterfaceSingle 16-/32-bit DDR1/DDR2 controller at 333 MHz - supports up to 4-Gbit DDR2 devices with 1.8 V I/O and auto-refresh for low-power system memory.
Ethernet ControllersDual eTSECs with RGMII/SGMII/MII support - enable simultaneous Gigabit and Fast Ethernet links with hardware-accelerated VLAN, MPLS, and IPsec header parsing.
PCI Interface32-bit, 66 MHz, PCI 2.3 compliant - provides glueless expansion for legacy peripherals or co-processors in agent or host mode with 3.3 V signaling only.
USB ControllerUSB 2.0 dual-role (host/device/OTG) with on-chip full-speed/high-speed PHY - enables direct peripheral attachment or host-side connectivity without external transceiver.
Core Supply Voltage1.0 V ± 50 mV - requires tightly regulated low-noise power delivery; typical core power dissipation is 820 mW at 333 MHz/167 MHz CSB.
Operating Temperature0 °C to 105 °C junction - validated for industrial-grade thermal environments without derating in standard PCB layouts.

Pinout & Package

Package: 620-pin PBGA (35 mm × 35 mm, 1.0 mm pitch), RoHS-compliant, lead-free, thermally enhanced with exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
SYS_CLK_INPrimary system clock inputAccepts 24–66.67 MHz differential or single-ended clock; required for core PLL lock within 100 µs after PORESET deassertion.
HRESETHard reset outputDrives active-low reset to external logic after internal initialization completes; asserts for ≥512 PCI_SYNC_IN cycles.
PORESETPower-on reset inputMust be held asserted for ≥32 SYS_CLK_IN cycles after stable core (VDD) and I/O (GVDD/NVDD) supplies are established.
DDR_DQ[31:0]DDR/DDR2 bidirectional data bus32-bit wide data path supporting both DDR1 (2.5 V) and DDR2 (1.8 V); requires matched trace lengths and 18 Ω output impedance.
eTSEC1_TXD[3:0]Gigabit Ethernet transmit data (RGMII)4-bit RGMII transmit lane; operates at 125 MHz with 0.6–4 ns rise/fall time; requires 50 Ω termination to LVDDA/LVDDB.
PCI_AD[31:0]PCI address/data multiplexed bus32-bit multiplexed address/data lines; supports 66 MHz timing with 25 Ω driver impedance and 3.3 V signaling only.

Key Features

FeatureDesign Value
Dual eTSEC with TCP/IP accelerationHardware offload of VLAN tagging, MPLS stack parsing, IPsec ESP/AH header recognition, and per-packet checksum generation/verification - reduces CPU load by >40% in routing/firewall applications.
DDR1/DDR2 unified memory controllerSingle controller supporting both DDR1 (2.5 V) and DDR2 (1.8 V) SDRAM up to 333 MHz with 16 simultaneous open pages - simplifies BOM and board layout across memory generations.
USB 2.0 dual-role with on-chip PHYIntegrated full-speed/high-speed PHY eliminates need for external transceiver; supports OTG mode with ULPI interface for flexible peripheral/host role switching.
PCI 2.3 host/agent modeConfigurable as PCI host or agent with on-chip arbitration for three external masters - enables use as bridge or endpoint in modular backplane designs.
Programmable interrupt controller (PIC)Supports 5 external and 34 internal interrupt sources with priority masking and vector redirection - enables deterministic real-time response in multi-threaded RTOS environments.

Applications

Industrial PLC ControllerNetwork Access Server (NAS)

Use Scenario: Real-time motion control and fieldbus gateway in factory automation systems with EtherNet/IP and Modbus TCP support.

IC Role / Device Role / Timing Role: Main CPU executing deterministic control loops while managing dual Ethernet ports for protocol bridging and time-synchronized I/O.

Use Value: IEEE 1588 timestamping and hardware VLAN/MPLS parsing enable sub-millisecond cycle times and seamless integration with enterprise networks.

Use Scenario: Multi-user file sharing and remote access appliance with concurrent SMB/NFS/AFP services and QoS-aware traffic shaping.

IC Role / Device Role / Timing Role: Host processor running Linux-based NAS firmware, coordinating DDR2 memory, dual eTSECs for LAN/WAN separation, and USB 2.0 for external storage.

Use Value: Integrated USB dual-role and PCI interface allow direct attachment of SATA bridges or Wi-Fi modules without additional controllers.

Intelligent Network Interface CardWireless LAN Base Station Controller

Use Scenario: High-throughput 10/100/1000 Mbps NIC with TCP offload engine and hardware security acceleration for enterprise servers.

IC Role / Device Role / Timing Role: I/O processor handling packet classification, encryption, and DMA transfers between host PCIe (via PCI bridge) and dual Ethernet MACs.

Use Value: SEC 2.2 crypto engine accelerates AES/SHA-1 for IPsec tunneling at line rate without CPU intervention.

Use Scenario: Centralized AP controller managing multiple 802.11a/b/g access points with centralized QoS, roaming, and WPA2-Enterprise authentication.

IC Role / Device Role / Timing Role: Control plane processor managing wireless MAC layer coordination, RF calibration, and secure management traffic over dedicated eTSEC port.

Use Value: Dual eTSECs provide isolated management and data planes; USB 2.0 enables firmware updates via flash drive without network dependency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC8315CVRADDCIncludes integrated security engine (SEC 2.2) supporting DES/3DES/AES/SHA-1; same package and pinout.Required for IPsec/IKEv2 or IEEE 802.11i® offload; MPC8313CVRADDC lacks crypto hardware.Select MPC8315CVRADDC when cryptographic acceleration is mandatory; MPC8313CVRADDC suffices for non-secure routing or control-only roles.
MPC8377CVRADDCHigher e300c4 core (up to 533 MHz), added SATA 1.0 controller, no USB 2.0 PHY - different pinout and thermal profile.Targeted at storage-centric gateways; incompatible USB and missing on-chip PHY increase BOM cost vs. MPC8313CVRADDC.Choose MPC8313CVRADDC for cost-sensitive, USB-connected edge devices; MPC8377CVRADDC only where SATA and higher CPU performance justify redesign.

Compared with MPC8315CVRADDC, MPC8313CVRADDC trades crypto acceleration for lower cost and power; compared with MPC8377CVRADDC, it retains USB 2.0 PHY integration and simpler thermal design but lacks SATA and higher-frequency operation - making it optimal for compact, USB-enabled industrial gateways with moderate throughput requirements.

Availability

MPC8313CVRADDC is available at Aetrix Electronics and suitable for industrial controllers, network access servers, and intelligent NICs requiring stable component supply across extended product lifecycles.

Supply support for MPC8313CVRADDC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The MPC8313CVRADDC belongs to the PowerQUICC II Pro family, designed specifically for cost-effective, low-power communications processing in embedded networking and control applications - emphasizing integration of Ethernet, PCI, USB, and DDR memory interfaces without external glue logic.

FAQ

What is the maximum DDR2 data rate supported by the MPC8313CVRADDC?

The MPC8313CVRADDC supports DDR2 SDRAM at up to 333 MHz (DDR2-667), with 1.8 V I/O voltage and 18 Ω output drive impedance. It handles 64-Mbit to 4-Gbit DDR2 devices using x8/x16/x32 data widths and supports up to 16 simultaneous open pages - verified in Section 1.4 of the MPC8313EEC Rev. 4 datasheet. This capability is fully implemented in the MPC8313CVRADDC silicon revision.

Does the MPC8313CVRADDC include a hardware security engine?

No, the MPC8313CVRADDC does not include a security engine. As explicitly stated in the block diagram footnote of the MPC8313E Hardware Specifications (Rev. 4, p.3), "The MPC8313 does not include a security engine." This distinguishes it from the MPC8315CVRADDC, which integrates SEC 2.2. Cryptographic operations must be performed in software on the e300c3 core when using the MPC8313CVRADDC.

What are the power sequencing requirements for reliable MPC8313CVRADDC startup?

The MPC8313CVRADDC requires core voltage (VDD/VDDC = 1.0 V ± 50 mV) to reach 90% of nominal before any I/O supply (GVDD, NVDD, LVDDA) exceeds 0.7 V, followed by ≥32 SYS_CLK_IN cycles after PORESET deassertion. This sequence prevents I/O contention and ensures proper PLL lock within 100 µs - detailed in Section 2.2 of the MPC8313EEC Rev. 4 datasheet. Failure to follow this causes undefined reset behavior.

Can the MPC8313CVRADDC operate in PCI host mode with 5 V signaling?

No, the MPC8313CVRADDC PCI interface is strictly 3.3 V compatible and not 5 V tolerant, as confirmed in Section 1.5 of the MPC8313EEC Rev. 4 datasheet. Attempting 5 V signaling risks permanent damage to the PCI_AD[31:0] and control pins. External level-shifting circuitry is required if interfacing with legacy 5 V PCI slots.

What Ethernet physical layer interfaces does the MPC8313CVRADDC support natively?

The MPC8313CVRADDC supports RGMII, SGMII, MII, RMII, and RTBI interfaces across its dual eTSECs - all implemented in silicon and validated per IEEE 802.3 standards. The on-chip high-speed serial interface connects directly to external SGMII PHYs, while RGMII/MII signals are routed to external magnetics or PHYs. No external SerDes or level shifters are needed for these modes, as specified in Section 1.7.

MPC8313CVRADDC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
516-BBGA Exposed Pad
Series:
MPC83xx
Packaging:
Tray
Product Status:
Active
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Co-Processors/DSP:
-
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100/1000Mbps (2)
SATA:
-
USB:
USB 2.0 + PHY (1)
Voltage - I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
516-TEPBGA (27x27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI

MPC8313CVRADDC FAQ

1.How can I place an order for MPC8313CVRADDC through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8313CVRADDC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8313CVRADDC reliable?

The price and inventory of MPC8313CVRADDC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8313CVRADDC is usually 5 days.

3.What payment methods are accepted for MPC8313CVRADDC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8313CVRADDC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8313CVRADDC?

MPC8313CVRADDC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8313CVRADDC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8313CVRADDC?

For technical support, including MPC8313CVRADDC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8313CVRADDC requirements.

6.How does Aetrix verify that MPC8313CVRADDC is sourced from the original manufacturer or authorized distributors?

All MPC8313CVRADDC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8313CVRADDC meets industry standards.

7.What is the process for return or replacement of MPC8313CVRADDC?

All MPC8313CVRADDC units undergo pre-shipment inspection (PSI). If there is an issue with MPC8313CVRADDC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8313CVRADDC part is unused and in its original packaging.

Return procedure for MPC8313CVRADDC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MPC8313CVRADDC Tags

  • MPC8313CVRADDC
  • MPC8313CVRADDC PDF
  • MPC8313CVRADDC Datasheet
  • MPC8313CVRADDC Specifications
  • MPC8313CVRADDC Images
  • NXP Semiconductors
  • NXP Semiconductors MPC8313CVRADDC
  • Buy MPC8313CVRADDC
  • MPC8313CVRADDC Price
  • MPC8313CVRADDC Distributor
  • MPC8313CVRADDC Supplier
  • MPC8313CVRADDC Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER