NXP Semiconductors MPC8313CZQAGDC

Overview

MPC8313CZQAGDC from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro communications processor featuring an e300c3 Power Architecture core operating at 333 MHz, dual three-speed 10/100/1000 Mbps Ethernet MACs with RGMII/SGMII/MII support, DDR1/DDR2 memory controller (up to 333 MHz, 16-/32-bit), integrated USB 2.0 dual-role controller with on-chip PHY, and 32-bit PCI interface - deployed as main CPU or I/O processor in industrial controllers, network access servers, and intelligent NICs.

For engineers reviewing the MPC8313CZQAGDC datasheet, MPC8313CZQAGDC pinout, MPC8313CZQAGDC application, or MPC8313CZQAGDC equivalent, key selection considerations include its 333 MHz e300c3 core performance, dual GbE MAC timing and interface options (RGMII/SGMII), DDR1/DDR2 voltage flexibility (1.8 V / 2.5 V), PCI 2.3 compliance at 66 MHz, and USB 2.0 host/device/OTG capability with ULPI or on-chip PHY support.

Technical Context

The MPC8313CZQAGDC implements a superscalar e300c3 core with 16 KB instruction and 16 KB data caches, FPU, and two integer units, coupled to a high-bandwidth crossbar interconnect. Its dual eTSECs support IEEE 802.3/802.3u/802.3ab/802.1588 with TCP/IP acceleration, VLAN stacking, and up to eight transmit/receive queues per MAC.

Memory subsystem includes a single DDR1/DDR2 controller supporting 16- or 32-bit bus widths, two chip selects, auto-refresh, and CKE-based power management. The integrated security engine (SEC 2.2) is absent in MPC8313 (non-E suffix); this part lacks hardware crypto acceleration for DES/AES/SHA.

Key Specifications

Pinout & Package

Package: 620-pin PBGA (Plastic Ball Grid Array), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant - designed for high-density industrial PCB layouts with thermal pad under die for junction-to-board heat transfer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8315CZQAGDC, MPC8313CZQAGDC omits the security engine to reduce cost and power, making it ideal for non-encrypted industrial control; versus MPC8377CZQAGDC, it trades higher clock speed and PCIe for lower BOM cost and proven thermal behavior in compact enclosures.

Availability

MPC8313CZQAGDC is available at Aetrix Electronics and suitable for industrial controllers, network access servers, and intelligent NICs requiring stable component supply across extended product lifecycles.

Supply support for MPC8313CZQAGDC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in Power Architecture processors from its Freescale acquisition.

The MPC8313CZQAGDC belongs to the PowerQUICC II Pro family, designed specifically for cost-sensitive, low-power communications infrastructure where integration of GbE, DDR, PCI, and USB reduces system complexity without sacrificing real-time determinism.

FAQ

Does MPC8313CZQAGDC include a hardware security engine?

No, MPC8313CZQAGDC does not include the SEC 2.2 security engine. Unlike the MPC8313E variant, the MPC8313 (non-E) part omits cryptographic acceleration blocks for DES, AES, SHA-1, and MD-5. This is explicitly confirmed in the Freescale hardware specification document section 1.3, which states "The MPC8313 does not include a security engine." Designers requiring hardware crypto must select MPC8315CZQAGDC or similar E-suffix variants.

What DDR memory standards does MPC8313CZQAGDC support?

MPC8313CZQAGDC supports both DDR1 SDRAM (2.5 V I/O) and DDR2 SDRAM (1.8 V I/O) via a unified controller. It operates at up to 333 MHz with 16- or 32-bit bus widths, two chip selects, and supports x8/x16/x32 DRAM devices. The controller handles auto-refresh, CKE-based power-down, and up to 16 open pages - all documented in Section 1.4 of the MPC8313E Hardware Specifications Rev. 4.

Is MPC8313CZQAGDC pin-compatible with MPC8315CZQAGDC?

Yes, MPC8313CZQAGDC and MPC8315CZQAGDC share identical 620-pin PBGA packaging, mechanical footprint, and signal pinout. The only functional difference is the presence of the SEC 2.2 security engine in the MPC8315 variant; all other peripherals, clocks, resets, and power domains match exactly - enabling drop-in replacement where crypto acceleration is not required.

What USB modes does MPC8313CZQAGDC support with its on-chip PHY?

MPC8313CZQAGDC supports USB 2.0 high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operation using its integrated on-chip PHY. It operates in host mode (EHCI-compliant), device mode (with three programmable endpoints), and OTG mode - all detailed in Section 1.6 of the hardware spec. Low-speed operation is host-only; no external ULPI PHY is required for basic functionality.

What is the maximum operating junction temperature for MPC8313CZQAGDC?

The maximum operating junction temperature for MPC8313CZQAGDC is 105 °C, as specified in Table 2 (Recommended Operating Conditions) of the MPC8313E Hardware Specifications Rev. 4. This rating applies under full utilization across core, DDR, eTSEC, and PCI blocks, and is validated for industrial ambient environments with appropriate PCB thermal design.