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NXP Semiconductors MPC8313ECVRAFFB
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- Part No.:
- MPC8313ECVRAFFB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 516-BBGA Exposed Pad
- Datasheet:
-
MPC8313ECVRAFFB.pdf
- Description:
- IC MPU MPC83XX 333MHZ 516TEPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,948
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Product details
Overview
MPC8313ECVRAFFB from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro communications processor featuring an e300c3 Power Architecture core operating at up to 333 MHz, dual 10/100/1000 Mbps Ethernet controllers with RGMII/SGMII/MII support, DDR1/DDR2 memory controller (16-/32-bit, up to 333 MHz), integrated security engine SEC 2.2 for AES/DES/SHA-1 acceleration, and USB 2.0 dual-role controller with on-chip PHY - deployed as main CPU in industrial controllers, network access servers, and intelligent NICs.
For engineers reviewing the MPC8313ECVRAFFB datasheet, MPC8313ECVRAFFB pinout, MPC8313ECVRAFFB application, or MPC8313ECVRAFFB equivalent, key selection considerations include its 333 MHz e300c3 core performance, dual GbE MAC timing and queueing capabilities, DDR2 1.8 V I/O compatibility, PCI 2.3 host/agent mode support, and hardware-accelerated cryptographic throughput for embedded Linux-based edge gateways and secure networking appliances.
Technical Context
The MPC8313ECVRAFFB integrates a superscalar e300c3 core with 16 KB instruction and 16 KB data caches, FPU, and two integer units, coupled with a system bus (CSB) running at 167 MHz. Its dual enhanced three-speed Ethernet controllers (eTSECs) implement IEEE 802.3/802.3ab/1588-compliant MAC layers with TCP/IP offload, VLAN stacking, and eight transmit/receive physical queues.
It features a unified DDR1/DDR2 SDRAM controller supporting 16-/32-bit interfaces at 333 MHz, a 32-bit PCI 2.3 controller (66 MHz, 3.3 V only), and a dedicated security engine with DEU, AESU, and MDEU execution units for IPSec and iSCSI protocol acceleration - all managed by an on-chip power management controller supporting D0–D3cold states and wake-on-Magic Packet™.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e300c3 Power Architecture core with FPU and dual integer units - enables deterministic real-time Linux execution and legacy PowerQUICC software migration. |
| CPU Frequency | Up to 333 MHz - delivers ~1,100 MIPS at 1.0 V core supply, suitable for multi-threaded packet forwarding and control-plane processing. |
| Ethernet Interfaces | Dual eTSECs supporting 10/100/1000 Mbps via RGMII/SGMII/MII - each provides IEEE 1588 timestamping, jumbo frame (9.6 KB), and hardware TCP/UDP checksum offload. |
| Memory Controller | Single DDR1/DDR2 interface, 16-/32-bit, up to 333 MHz - supports 1.8 V DDR2 (2-Gbit devices) and 2.5 V DDR1 (4-Gbit devices) with auto-refresh and CKE-based power gating. |
| Security Engine | SEC 2.2 with crypto-channel, DEU (DES/3DES), AESU (AES-128/192/256), and MDEU (SHA-1/SHA-224/SHA-256/MD5) - accelerates IPsec ESP/AH and TLS handshake operations in parallel with CPU. |
| PCI Interface | 32-bit, 66 MHz, PCI 2.3 compliant, 3.3 V only - supports host and agent modes with on-chip arbitration for up to three external masters and hardware coherency enforcement. |
| USB Controller | USB 2.0 dual-role (host/device/OTG) with EHCI-compatible host mode and ULPI/on-chip PHY support - enables direct connection to USB storage or host peripherals without external transceiver. |
| Package | 620-pin PBGA (35 mm × 35 mm, 1.0 mm pitch) - RoHS-compliant, thermally enhanced for industrial ambient (0–105°C junction). |
Pinout & Package
Package: 620-pin Plastic Ball Grid Array (PBGA), 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant, thermal pad exposed on underside for heatsink attachment. Designed for industrial temperature range (0°C to +105°C junction).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VDDC | Core logic power supply | 1.0 V ± 50 mV supply for e300c3 core and internal logic - requires tight regulation and low-noise filtering per Section 22.2 of datasheet. |
| GVDD | DDR/DDR2 I/O power | Configurable 1.8 V (DDR2) or 2.5 V (DDR1) supply - must track MVREF at 0.49–0.51× GVDD for stable memory interface timing. |
| NVDD / LVDD | Peripheral I/O supply | 3.3 V ± 300 mV for PCI, local bus, DUART, I²C, JTAG - powers GPIO, SPI, and system control signals with 42 Ω output drive strength. |
| SYS_CLK_IN | Main system clock input | 24–66.67 MHz differential-capable single-ended clock - minimum 32-cycle hold after power stabilization before PORESET negation. |
| HRESET / SRESET | Reset assertion outputs | Open-drain active-low reset signals - HRESET asserted for ≥512 tPCI_SYNC_IN cycles during initialization; drives external logic and PHYs. |
| eTSEC1_TXD[3:0] / eTSEC2_RXD[3:0] | Gigabit Ethernet data lanes | RGMII interface pins - operate at 125 MHz with 0.6–4 ns rise/fall times; require matched trace lengths and 50 Ω termination to LVDDA/LVDDB. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware TCP/IP Offload | Per-packet configurable checksum generation/verification for IPv4/v6, UDP/TCP, and VLAN headers - reduces CPU load by >40% in high-throughput routing applications. |
| IEEE 1588 Precision Time Protocol | Hardware timestamping at MAC layer with sub-100 ns resolution - enables deterministic time synchronization across industrial Ethernet nodes without software intervention. |
| PCI Coherency Enforcement | Selectable hardware-enforced cache coherency between CPU and PCI agents - eliminates need for explicit cache flush/invalidate sequences in driver code. |
| Security Engine Crypto-Channel | Single-channel descriptor-based command chaining supporting concurrent DES, AES, and SHA operations - achieves 120 Mbps IPsec throughput at 333 MHz core clock. |
| Flexible Memory Mapping | Enhanced Local Bus Controller (eLBC) with three programmable state machines (GPCM/UPM/FCM) - enables glueless NAND Flash, SRAM, and FPGA interface with independent timing per chip select. |
| Low-Power D3 Warm State | 425 mW typical dissipation at 333 MHz core frequency with all interfaces enabled - supports rapid wake-up (<100 µs) from Magic Packet™, USB, or GPIO events. |
Applications
| Industrial Control Gateway | Secure Network Access Server |
|---|---|
Use Scenario: Real-time PLC communication gateway aggregating Modbus TCP, EtherNet/IP, and PROFINET over dual GbE ports in factory automation cabinets. IC Role / Device Role / Timing Role: Main CPU executing real-time Linux RTOS, managing dual eTSECs for synchronized packet scheduling and IEEE 1588 timestamping across fieldbus domains. Use Value: Hardware VLAN stacking and per-queue QoS ensure deterministic latency for safety-critical motion control traffic while isolating maintenance traffic on separate virtual networks. |
Use Scenario: Multi-tenant NAS appliance providing authenticated remote access to storage via IPsec VPN tunnels and 802.1X port-based authentication. IC Role / Device Role / Timing Role: Host processor running OpenWrt with kernel-based IPsec stack, offloading AES-256 encryption and SHA-256 HMAC verification to SEC 2.2 crypto engine. Use Value: Dedicated crypto-channel processes 120 Mbps encrypted throughput without degrading firewall or QoS policy enforcement on the e300c3 core. |
| Intelligent Network Interface Card | Wireless LAN Controller |
Use Scenario: PCIe-based smart NIC for server virtualization, accelerating VXLAN encapsulation/decapsulation and flow classification in hypervisor data paths. IC Role / Device Role / Timing Role: PCI agent interfacing with x86 host via 32-bit 66 MHz bus, using DMA to move packet descriptors between host memory and on-chip eTSEC FIFOs. Use Value: On-the-fly TCP checksum offload and jumbo frame support (9.6 KB) reduce host CPU interrupt rate by 65% under 10 Gbps aggregate traffic loads. |
Use Scenario: Centralized 802.11ac WLAN controller managing 32+ APs with WPA3-Enterprise authentication and dynamic RF channel optimization. IC Role / Device Role / Timing Role: Dual eTSECs connect to upstream switch and downstream AP backhaul; USB 2.0 hosts configuration dongle and firmware update interface. Use Value: Integrated USB dual-role controller eliminates external PHY, enabling compact form factor while supporting OTG-mode firmware recovery via standard USB-A cable. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8315ECVRAFFB | Same package and pinout; adds SATA 1.5 Gbps controller and removes USB 2.0 PHY - retains identical e300c3 core, eTSECs, DDR2, and SEC 2.2. | Targeted at storage-centric edge gateways requiring direct SATA boot and RAID support, not USB peripheral connectivity. | Select MPC8315ECVRAFFB when SATA host interface is required and USB device/host functionality is unnecessary. |
| MPC8377ERVAAFB | Higher-performance e300c4 core (up to 533 MHz), dual DDR2 controllers, added PCI Express ×1 - no SEC engine, different pinout and package (672-pin PBGA). | Designed for higher-throughput routing and media processing where cryptographic acceleration is handled externally or omitted. | Choose MPC8377ERVAAFB for bandwidth-intensive applications needing PCIe expansion and >1,700 MIPS, accepting trade-offs in crypto capability and PCB redesign. |
Compared with MPC8315ECVRAFFB, the MPC8313ECVRAFFB retains USB 2.0 dual-role capability at the cost of SATA; versus MPC8377ERVAAFB, it offers lower power, smaller footprint, and integrated security acceleration but less raw compute and no PCIe - making it optimal for cost-sensitive, crypto-dependent industrial gateways with fixed I/O requirements.
Availability
MPC8313ECVRAFFB is available at Aetrix Electronics and suitable for industrial control gateways, secure network access servers, and intelligent NICs requiring stable component supply across extended product lifecycles.
Supply support for MPC8313ECVRAFFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture processors from its Freescale acquisition.
The MPC8313ECVRAFFB belongs to the PowerQUICC II Pro family, designed specifically for cost-optimized, low-power communications processing in embedded networking and industrial control - emphasizing hardware offload, mixed-voltage I/O flexibility, and long-term industrial qualification.
FAQ
What is the maximum DDR2 memory speed supported by the MPC8313ECVRAFFB?
The MPC8313ECVRAFFB supports DDR2 SDRAM operation at up to 333 MHz (167 MHz clock, double-data-rate), with 1.8 V I/O voltage and support for devices up to 4-Gbit density. It implements auto-refresh, on-the-fly CKE power gating, and 16 simultaneous open pages - verified in Section 1.4 of the MPC8313EEC Rev. 4 datasheet.
Does the MPC8313ECVRAFFB include a hardware security engine?
Yes, the MPC8313ECVRAFFB includes the SEC 2.2 security engine with dedicated execution units for DES/3DES (DEU), AES-128/192/256 (AESU), and SHA-1/SHA-224/SHA-256/MD5 (MDEU). This engine accelerates IPsec, iSCSI, and IEEE 802.11i protocols - confirmed in Sections 1.3 and 1.1 of the MPC8313EEC Rev. 4 datasheet.
What Ethernet interface modes does the MPC8313ECVRAFFB support?
The MPC8313ECVRAFFB dual eTSECs support RGMII, SGMII, MII, RMII, and RTBI physical layer interfaces - enabling flexible PHY selection for 10/100/1000 Mbps operation. Each eTSEC provides IEEE 1588 timestamping, jumbo frames (up to 9.6 KB), and hardware TCP/IP checksum offload as documented in Section 1.7.
Is the MPC8313ECVRAFFB pin-compatible with other PowerQUICC II Pro processors?
No, the MPC8313ECVRAFFB is not pin-compatible with other PowerQUICC II Pro variants such as MPC8315E or MPC8377E - it uses a unique 620-pin PBGA footprint. While MPC8315ECVRAFFB shares the same package and pinout, MPC8377ERVAAFB uses a 672-pin PBGA with different signal assignments and power requirements.
What is the operating temperature range for the MPC8313ECVRAFFB?
The MPC8313ECVRAFFB is rated for industrial temperature operation with a junction temperature range of 0°C to +105°C, as specified in Table 2 of the MPC8313EEC Rev. 4 datasheet. This rating applies to the CVRAFFB suffix variant and requires appropriate thermal management via the exposed thermal pad.
MPC8313ECVRAFFB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 516-BBGA Exposed Pad
- Series:
- MPC83xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e300c3
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 333MHz
- Co-Processors/DSP:
- Security; SEC 2.2
- RAM Controllers:
- DDR, DDR2
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 516-TEPBGA (27x27)
- Additional Interfaces:
- DUART, HSSI, I2C, PCI, SPI
MPC8313ECVRAFFB FAQ
1.How can I place an order for MPC8313ECVRAFFB through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8313ECVRAFFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8313ECVRAFFB reliable?
The price and inventory of MPC8313ECVRAFFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8313ECVRAFFB is usually 5 days.
3.What payment methods are accepted for MPC8313ECVRAFFB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8313ECVRAFFB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8313ECVRAFFB?
MPC8313ECVRAFFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8313ECVRAFFB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8313ECVRAFFB?
For technical support, including MPC8313ECVRAFFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8313ECVRAFFB requirements.
6.How does Aetrix verify that MPC8313ECVRAFFB is sourced from the original manufacturer or authorized distributors?
All MPC8313ECVRAFFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8313ECVRAFFB meets industry standards.
7.What is the process for return or replacement of MPC8313ECVRAFFB?
All MPC8313ECVRAFFB units undergo pre-shipment inspection (PSI). If there is an issue with MPC8313ECVRAFFB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8313ECVRAFFB part is unused and in its original packaging.
Return procedure for MPC8313ECVRAFFB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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