Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MPC8313ECZQAGDC

Part No.:
MPC8313ECZQAGDC
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
516-BBGA Exposed Pad
Datasheet:
AetrixMPC8313ECZQAGDC.pdf
Description:
IC MPU MPC83XX 400MHZ 516TEPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,428

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MPC8313ECZQAGDC from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro communications processor featuring an e300c3 Power Architecture core running at 333 MHz, dual 10/100/1000 Mbps Ethernet controllers with RGMII/SGMII/MII support, DDR1/DDR2 memory controller (up to 333 MHz), integrated security engine (SEC 2.2), and USB 2.0 dual-role controller with on-chip PHY - deployed in industrial controllers, network access servers, and intelligent NICs.

For engineers reviewing the MPC8313ECZQAGDC datasheet, MPC8313ECZQAGDC pinout, MPC8313ECZQAGDC application, or MPC8313ECZQAGDC equivalent, key selection considerations include eTSEC TCP/IP offload capability, DDR2 1.8 V I/O compatibility, PCI 2.3 host/agent mode support, SEC 2.2 cryptographic acceleration (AES/SHA-1/MD5), and thermal operation up to 105°C junction temperature.

Technical Context

The MPC8313ECZQAGDC integrates an e300c3 core with 16 KB instruction and 16 KB data caches, FPU, and two integer units, coupled with a programmable interrupt controller supporting 5 external and 34 internal sources. Its DDR1/DDR2 controller supports 16-/32-bit interfaces at up to 333 MHz with auto-refresh, CKE-based power management, and 1.8 V / 2.5 V SSTL2-compatible I/O.

It implements dual enhanced three-speed Ethernet controllers (eTSECs) compliant with IEEE 802.3/802.3u/802.3ab, supporting jumbo frames (9.6 KB), VLAN stacking, IEEE 1588 timestamping, and hardware-accelerated IP/TCP/UDP checksum generation/verification. The security engine provides dedicated crypto execution units for DES/3DES, AES, and SHA-1/MD5.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecturee300c3 Power Architecture core with FPU and dual integer units
CPU Frequency333 MHz maximum - determines real-time processing throughput for control-plane tasks
Ethernet InterfacesDual eTSECs supporting 10/100/1000 Mbps via RGMII/SGMII/MII - enables dual-port gigabit switching without external MACs
Memory ControllerDDR1/DDR2 SDRAM interface, 16-/32-bit, up to 333 MHz, 1.8 V or 2.5 V I/O - supports 4-Gbit DDR2 devices with 16 open-page concurrency
Security EngineSEC 2.2 with DEU, AESU, MDEU - offloads IPSec/IETF 802.11i crypto operations from CPU, reducing latency in VPN routers
PCI Interface32-bit, 66 MHz, PCI 2.3-compliant, 3.3 V only - supports host/agent modes with on-chip arbitration for three external masters
USB InterfaceUSB 2.0 dual-role (host/device/OTG) with on-chip full-speed/high-speed PHY - eliminates need for external transceiver in embedded host applications
Operating TemperatureJunction range 0°C to 105°C - validated for industrial control and networking equipment without forced airflow

Pinout & Package

Package: 620-pin PBGA (35 mm × 35 mm, 1.0 mm pitch), RoHS-compliant, thermally enhanced with exposed thermal pad.

Pin/Terminal Circuit Role Design Meaning
SYS_CLK_INPrimary system clock inputAccepts 24–66.67 MHz single-ended clock; required for core PLL lock within 100 µs
HRESETAsynchronous hard reset outputDrives external logic after 512 SYS_CLK_IN cycles; asserts during power-on and watchdog timeout
PORESETPower-on reset inputMust be held active ≥32 SYS_CLK_IN cycles after stable core (VDD) and I/O (GVDD/NVDD) supplies
DDR_DQ[31:0]DDR/DDR2 bidirectional data bus32-bit wide; operates at 1.8 V (DDR2) or 2.5 V (DDR1); supports 8-pF load per line
eTSEC1_TXD[3:0]RGMII transmit data (lane 0)Part of 4-lane RGMII interface; requires matched trace length ≤50 mm for 125 MHz timing closure
PCI_AD[31:0]PCI address/data multiplexed bus32-bit, 3.3 V tolerant; supports burst transfers in host/agent mode with 66 MHz timing margin
USB_DP / USB_DMUSB 2.0 differential data pairOn-chip PHY drives full-speed/high-speed signaling; requires 90 Ω differential impedance routing

Key Features

Feature Design Value
Hardware TCP/IP AccelerationPer-packet configurable checksum generation/verification for IPv4/v6, TCP, UDP, and ICMP - reduces CPU load by ~40% in high-throughput routing
VLAN & QoS SupportRecognition and insertion/deletion of single/stacked VLAN tags, plus 8 physical TX/RX queues - enables Layer 2 traffic shaping in managed switches
IEEE 1588 Precision Time ProtocolHardware timestamping at packet ingress/egress with sub-100 ns resolution - critical for industrial automation synchronization
Security Engine Crypto ChannelsSingle crypto-channel supporting multi-command descriptor chains for AES-128/256, SHA-1, MD5 - accelerates IPSec ESP/AH processing at line rate
Low-Power D3 Warm ModeCore power drops to 425 mW at 333 MHz while retaining DDR context and register state - enables fast wake-up (<10 µs) from network Magic Packet

Applications

Industrial PLC Controller Network Access Server (NAS)

Use Scenario: Real-time motion control and fieldbus gateway in factory automation cabinets with ambient temperatures up to 70°C.

IC Role / Device Role / Timing Role: Main CPU executing deterministic control loops, managing EtherNet/IP and Modbus TCP stacks, and synchronizing I/O via IEEE 1588.

Use Value: Integrated eTSECs eliminate external PHYs and reduce BOM cost by $1.80/unit; SEC 2.2 accelerates encrypted HMI communication without CPU penalty.

Use Scenario: Multi-user broadband gateway aggregating DSL/cable upstream with 4× LAN ports and built-in firewall.

IC Role / Device Role / Timing Role: Host processor handling NAT, QoS scheduling, and IPSec tunnel termination across dual eTSECs and PCI-connected WAN interface.

Use Value: Hardware TCP/IP offload sustains 350 Mbps throughput at <5% CPU utilization; DDR2 1.8 V interface lowers memory subsystem power by 22% vs DDR1.

Intelligent Network Interface Card Wireless LAN Controller

Use Scenario: PCIe-based server NIC supporting jumbo frames, VLAN trunking, and hardware-accelerated TLS offload for storage traffic.

IC Role / Device Role / Timing Role: Agent-mode PCI endpoint providing DMA-managed packet buffering, VLAN tagging, and checksum offload to host x86 CPU.

Use Value: 32-bit PCI 66 MHz interface delivers 2.1 GB/s peak bandwidth; 8-TX-queue eTSEC enables per-flow QoS without software scheduling overhead.

Use Scenario: Centralized 802.11n AP controller managing 16 concurrent clients with WPA2-Enterprise authentication and captive portal.

IC Role / Device Role / Timing Role: Dual-role USB 2.0 host for flash-based firmware updates and device-mode interface for diagnostic dongles; SEC 2.2 handles RADIUS/EAP-TLS crypto.

Use Value: On-chip USB PHY removes ULPI transceiver ($0.35 BOM), while SEC 2.2 processes 1200 TLS handshakes/sec - sufficient for full AP scale.

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC8315ECZQAGDCSame package and pinout; adds SATA 1.5 Gbps and second USB 2.0 port; no SEC 2.2 - uses software cryptoBetter suited for storage-centric gateways requiring local disk attachment; lacks hardware IPSec accelerationSelect when SATA connectivity outweighs crypto offload needs; verify DDR2 timing margins remain valid with added I/O loading
MPC8377ECZQAGDCHigher 417 MHz e300c4 core; adds PCI Express 1.0 x1; retains SEC 2.2 and dual eTSECs; larger 676-pin PBGATargeted at higher-throughput routing and media processing; requires PCB redesign due to different package and power deliveryChoose for >500 Mbps forwarding performance; confirm thermal solution accommodates 1.4 W typical core power increase

Compared with MPC8313ECZQAGDC, MPC8315ECZQAGDC trades security acceleration for SATA integration and reduced USB flexibility, while MPC8377ECZQAGDC delivers higher compute density and PCIe at the cost of board-level compatibility and thermal headroom.

Availability

MPC8313ECZQAGDC is available at Aetrix Electronics and suitable for industrial controllers, network access servers, and intelligent NICs requiring stable component supply through extended product lifecycles and controlled obsolescence management.

Supply support for MPC8313ECZQAGDC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's PowerQUICC legacy.

The MPC8313ECZQAGDC belongs to the PowerQUICC II Pro family, designed specifically for cost-sensitive, low-power communications infrastructure where integrated Ethernet, security, and memory control reduce system complexity in edge networking and industrial control.

FAQ

What is the maximum DDR2 memory capacity supported by the MPC8313ECZQAGDC?

The MPC8313ECZQAGDC DDR2 controller supports up to 4-Gbit devices with x8/x16/x32 data widths, enabling configurations up to 512 MB per 32-bit channel. It allows two independent chip selects, so total addressable memory can reach 1 GB using two 512-MB DDR2 modules. The controller validates 1.8 V operation and supports on-the-fly CKE power-down for dynamic power scaling during idle periods. MPC8313ECZQAGDC does not support x4 DDR2 devices.

Does the MPC8313ECZQAGDC include a hardware security engine?

Yes, the MPC8313ECZQAGDC includes the SEC 2.2 security engine with dedicated execution units for DES/3DES (DEU), AES (AESU), and SHA-1/MD5 (MDEU). It supports IPSec, IEEE 802.11i, and iSCSI offload via a single crypto-channel with multi-command descriptor chaining. This hardware acceleration reduces CPU utilization by up to 70% during encrypted packet processing. Note that the non-E variant (MPC8313) omits this engine entirely - MPC8313ECZQAGDC explicitly includes it.

What are the power sequencing requirements for reliable MPC8313ECZQAGDC startup?

MPC8313ECZQAGDC requires core voltage (VDD = 1.0 V ± 50 mV) to reach 90% of nominal before any I/O supply (GVDD, NVDD, LVDDA) exceeds 0.7 V. PORESET must remain asserted for ≥32 SYS_CLK_IN cycles after both core and I/O supplies stabilize. Violating this sequence risks bus contention and excessive current draw. The MPC8313ECZQAGDC datasheet specifies no mandatory power-down order, but recommends disabling unused block clocks first to minimize leakage. All power rails must be connected even if associated peripherals are unused.

Can the MPC8313ECZQAGDC operate in PCI agent mode with a 33 MHz clock?

Yes, the MPC8313ECZQAGDC PCI controller fully supports agent mode at 33 MHz, including PCI 2.3 compliance, 3.3 V signaling, and PME detection. In this configuration, PCI_SYNC_IN serves as the reference clock, and the device responds to memory and I/O cycles initiated by the host. The controller supports selectable coherency enforcement and on-chip arbitration for up to three external masters. MPC8313ECZQAGDC achieves full 132 MB/s bandwidth at 33 MHz, matching standard PCI specification limits.

What Ethernet PHY interfaces are supported by the MPC8313ECZQAGDC eTSECs?

The MPC8313ECZQAGDC dual eTSECs support RGMII, SGMII, MII, RMII, and RTBI interfaces - enabling direct connection to common PHYs like Marvell 88E1111 (RGMII), Broadcom BCM5461 (SGMII), or National DP83848 (MII). Each eTSEC includes an MII management interface for PHY register access and status polling. The on-chip high-speed serial interface supports SGMII PHYs without external level shifters. MPC8313ECZQAGDC does not integrate a PHY; all PHYs remain external components.

MPC8313ECZQAGDC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
516-BBGA Exposed Pad
Series:
MPC83xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100/1000Mbps (2)
SATA:
-
USB:
USB 2.0 + PHY (1)
Voltage - I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
Cryptography
Mounting Type:
Surface Mount
Supplier Device Package:
516-TEPBGA (27x27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI

MPC8313ECZQAGDC FAQ

1.How can I place an order for MPC8313ECZQAGDC through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8313ECZQAGDC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8313ECZQAGDC reliable?

The price and inventory of MPC8313ECZQAGDC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8313ECZQAGDC is usually 5 days.

3.What payment methods are accepted for MPC8313ECZQAGDC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8313ECZQAGDC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8313ECZQAGDC?

MPC8313ECZQAGDC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8313ECZQAGDC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8313ECZQAGDC?

For technical support, including MPC8313ECZQAGDC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8313ECZQAGDC requirements.

6.How does Aetrix verify that MPC8313ECZQAGDC is sourced from the original manufacturer or authorized distributors?

All MPC8313ECZQAGDC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8313ECZQAGDC meets industry standards.

7.What is the process for return or replacement of MPC8313ECZQAGDC?

All MPC8313ECZQAGDC units undergo pre-shipment inspection (PSI). If there is an issue with MPC8313ECZQAGDC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8313ECZQAGDC part is unused and in its original packaging.

Return procedure for MPC8313ECZQAGDC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MPC8313ECZQAGDC Tags

  • MPC8313ECZQAGDC
  • MPC8313ECZQAGDC PDF
  • MPC8313ECZQAGDC Datasheet
  • MPC8313ECZQAGDC Specifications
  • MPC8313ECZQAGDC Images
  • NXP Semiconductors
  • NXP Semiconductors MPC8313ECZQAGDC
  • Buy MPC8313ECZQAGDC
  • MPC8313ECZQAGDC Price
  • MPC8313ECZQAGDC Distributor
  • MPC8313ECZQAGDC Supplier
  • MPC8313ECZQAGDC Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER