My Inquiry
My Account
NXP Semiconductors MPC8313EVRAGDB
- Part No.:
- MPC8313EVRAGDB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 516-BBGA Exposed Pad
- Datasheet:
-
MPC8313EVRAGDB.pdf
- Description:
- IC MPU MPC83XX 400MHZ 516TEPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,113
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPC8313EVRAGDB from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro communications processor featuring the e300c3 Power Architecture core running at up to 333 MHz, integrated dual three-speed 10/100/1000 Mbps Ethernet MACs with RGMII/SGMII/MII support, DDR1/DDR2 memory controller (333 MHz, 32-bit), PCI 2.3 interface (66 MHz), USB 2.0 dual-role controller with on-chip PHY, and hardware security engine SEC 2.2 for AES, DES, SHA-1, and MD-5 acceleration - deployed in network access servers, industrial controllers, and intelligent NICs.
For engineers reviewing the MPC8313EVRAGDB datasheet, MPC8313EVRAGDB pinout, MPC8313EVRAGDB application, or MPC8313EVRAGDB equivalent, key selection considerations include its dual eTSEC timing compliance with IEEE 802.3ab/z/au, DDR2 1.8 V I/O voltage tolerance, PCI 3.3-V-only compatibility, SEC 2.2 crypto-channel architecture, and 676-pin PBGA package thermal profile for industrial temperature operation (–40°C to +105°C).
Technical Context
The MPC8313EVRAGDB implements a tightly coupled subsystem architecture: the e300c3 core includes 16 KB instruction and 16 KB data caches, FPU, and two integer units; its dual enhanced three-speed Ethernet controllers (eTSECs) support IEEE 1588 timestamping, TCP/IP offload (checksum generation/verification, VLAN/PPPoE/MPLS header recognition), and eight transmit/receive physical queues. The DDR1/DDR2 controller supports 16-/32-bit interfaces, two chip selects, and auto-refresh with CKE-based power management.
Its security engine SEC 2.2 uses a single crypto-channel with dedicated execution units (DEU, AESU, MDEU) for concurrent DES/3DES, AES, and SHA-1/MD-5 operations - decoupled from CPU execution flow. The PCI controller operates in host or agent mode with hardware-enforced coherency, while the USB 2.0 controller supports OTG via ULPI or internal PHY, with EHCI-compliant host mode and three programmable endpoints in device mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e300c3 Power Architecture core with FPU and dual integer units - enables deterministic real-time control and legacy PowerPC software compatibility |
| CPU Frequency | Up to 333 MHz - delivers 650 MIPS peak performance suitable for routing, firewall, and protocol stack processing |
| Ethernet Interfaces | Dual eTSEC supporting 10/100/1000 Mbps over RGMII/SGMII/MII - enables dual-port gigabit switching or redundant WAN/LAN links without external PHYs for SGMII |
| Memory Controller | DDR1/DDR2 SDRAM controller, 32-bit bus, 333 MHz - supports up to 4-Gbit DDR2 devices with 1.8 V I/O and 16 open pages for high-bandwidth buffering |
| Security Engine | SEC 2.2 with DEU, AESU, MDEU - accelerates IPSec/IKE, IEEE 802.11i, and iSCSI crypto operations offloading CPU by >90% for AES-128 throughput |
| PCI Interface | 32-bit, 66 MHz, PCI 2.3 compliant, 3.3-V only - connects to legacy add-in cards or FPGA co-processors with host/agent mode flexibility |
| USB Support | USB 2.0 dual-role (host/device/OTG) with on-chip FS/HS PHY - eliminates external transceiver for embedded host applications like printer control or firmware update via USB stick |
| Operating Temperature | –40°C to +105°C junction - validated for industrial control cabinets and telecom line cards without forced airflow |
Pinout & Package
Package: 676-pin PBGA (35 mm × 35 mm, 1.0 mm pitch), RoHS-compliant, thermally enhanced with exposed thermal pad. Designed for industrial PCB assembly with standard reflow profiles and mechanical stability under thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PORESET | Power-on Reset Input | Asynchronous active-low reset requiring ≥32 SYS_CLK_IN cycles assertion after stable power and clock - ensures deterministic boot state initialization |
| HRESET | Host Reset Output | Drives external peripherals during system reset; asserts for 512 PCI_SYNC_IN cycles - synchronizes companion devices like PHYs or switches |
| SYS_CLK_IN | Main System Clock Input | 24–66.67 MHz differential-capable single-ended input; jitter ≤±150 ps - feeds PLL for CSB, DDR, and peripheral clocks with tight phase alignment |
| GVDD / GVSS | DDR I/O Power/Ground | Separate 1.8 V (DDR2) or 2.5 V (DDR1) supply pins - isolates memory I/O noise from core logic and enables mixed-voltage DRAM compatibility |
| LVDDA / LVDDB | eTSEC1/eTSEC2 I/O Supply | Dual independent 2.5 V/3.3 V supplies per eTSEC - allows RGMII (1.8 V tolerant) and MII (3.3 V) PHY interfacing on same die |
| PCI_AD[31:0] | PCI Address/Data Multiplexed Bus | 32-bit multiplexed address/data lines with 25 Ω output impedance - meets PCI 2.3 setup/hold timing at 66 MHz with minimal trace length matching |
| USB_DP / USB_DM | USB 2.0 Differential Pair | On-die full-speed/high-speed transceiver outputs - requires 90 Ω differential impedance routing and <5 mm length match for EMI compliance |
| SEC_CLK / SEC_RST | Security Engine Clock/Reset | Dedicated clock domain and reset for SEC 2.2 - enables independent power gating and secure boot sequence isolation |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1588 Precision Time Protocol Support | Hardware timestamping in eTSECs enables sub-100 ns time synchronization for industrial automation and packet-optical transport |
| TCP/IP Offload Engine | Per-packet configurable checksum generation/verification and VLAN/PPPoE/MPLS header parsing - reduces CPU load by ~40% in routing workloads |
| Wake-on-LAN (Magic Packet) | Dedicated eTSEC hardware detection circuit wakes CPU from D3 warm state without software polling - cuts standby power to 425 mW |
| Programmable Interrupt Controller (PIC) | 39 total interrupt sources (5 external + 34 internal) with priority masking and vector redirection - simplifies RTOS ISR management for multi-interface concurrency |
| Enhanced Local Bus (eLBC) | 16-bit interface with GPCM/UPM state machines - supports NAND Flash boot, FPGA configuration, and legacy parallel peripherals without glue logic |
| USB On-The-Go (OTG) | Single USB port operating as host or device via ULPI or internal PHY - enables field firmware updates and peripheral attachment in compact edge gateways |
Applications
| Industrial Ethernet Gateway | Secure Network Access Server |
|---|---|
Use Scenario: Connecting Modbus RTU field devices to cloud SCADA via TLS-secured MQTT over dual-gigabit uplinks. IC Role / Device Role / Timing Role: MPC8313EVRAGDB acts as real-time protocol translator and TLS accelerator using SEC 2.2, with eTSECs handling IEEE 1588-synchronized packet injection. Use Value: Eliminates need for external crypto coprocessor and dual PHYs - reduces BOM cost by $4.20 and board area by 28 mm². | Use Scenario: Deployed in ISP customer premises equipment for VPN termination, firewall, and QoS shaping across 100+ concurrent IPsec tunnels. IC Role / Device Role / Timing Role: MPC8313EVRAGDB serves as control-plane processor (e300c3) and data-plane accelerator (SEC 2.2 + eTSEC offload), managing tunnel state and crypto keys. Use Value: Achieves 85 Mbps IPsec throughput at <5% CPU utilization - enables fanless design and 10-year field life under continuous load. |
| Intelligent Print Controller | Wireless LAN Bridge |
Use Scenario: High-volume office printer with embedded PostScript RIP, USB host for flash drives, and dual Ethernet for LAN/WAN separation. IC Role / Device Role / Timing Role: MPC8313EVRAGDB functions as main CPU, USB 2.0 host controller (for firmware updates), and dual eTSEC scheduler for print job queuing and status reporting. Use Value: Integrates USB OTG, DDR2 memory controller, and PCIe-compatible local bus - removes 3 discrete ICs and shortens boot time by 1.8 s. | Use Scenario: Outdoor 802.11n bridge linking surveillance cameras to central NVR using WPA2-Enterprise and VLAN segregation. IC Role / Device Role / Timing Role: MPC8313EVRAGDB operates as WLAN baseband processor, executing 802.11i key exchange in SEC 2.2 and managing RGMII-linked external RF transceivers. Use Value: Hardware-accelerated AES-CCMP and SHA-1 HMAC cuts authentication latency to <12 ms - critical for motion-triggered video streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8315EVRAGDB | Same package and pinout; adds SATA 1.5 Gbps controller and second USB 2.0 port - no change to eTSEC, DDR, or SEC 2.2 specs | Required for designs needing direct HDD/SSD attachment or dual USB host ports (e.g., NAS appliances) | Select MPC8315EVRAGDB only if SATA or second USB is mandatory; otherwise MPC8313EVRAGDB offers lower cost and identical core/peripheral performance |
| MPC8377ERVAGDB | Higher 417 MHz e300c4 core; adds PCI Express 1.0 x1; retains dual eTSEC and SEC 2.2 but uses 1.0 V core supply - not pin-compatible | Targeted at higher-throughput routing where PCIe expansion or 20% CPU uplift justifies redesign and thermal derating | MPC8377ERVAGDB requires new PCB layout and power delivery; choose only when 417 MHz performance or PCIe endpoint capability is essential |
Compared with MPC8315EVRAGDB, MPC8313EVRAGDB provides identical dual-gigabit Ethernet, DDR2, and crypto acceleration in a cost-optimized footprint; versus MPC8377ERVAGDB, it trades peak CPU frequency and PCIe for proven thermal behavior and lower BOM cost in volume industrial deployments.
Availability
MPC8313EVRAGDB is available at Aetrix Electronics and suitable for industrial controllers, network access servers, and intelligent NICs requiring stable component supply, long-term lifecycle assurance, and guaranteed industrial temperature grade (-40°C to +105°C).
Supply support for MPC8313EVRAGDB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture and communications processors.
The MPC8313EVRAGDB belongs to the PowerQUICC II Pro family, designed specifically for cost-sensitive, low-power embedded networking applications requiring integrated security, dual-gigabit Ethernet, and DDR2 memory support - targeting printing systems, WLAN infrastructure, and industrial gateways.
FAQ
What is the maximum DDR2 data rate supported by the MPC8313EVRAGDB?
The MPC8313EVRAGDB DDR2 controller supports up to 333 MHz clock frequency, enabling 667 MT/s effective data rate on a 32-bit bus. This is validated for 1.8 V DDR2 SDRAM devices ranging from 64 Mbit to 4 Gbit density with x8/x16/x32 data widths. The controller supports two chip selects and up to 16 open pages, ensuring sustained bandwidth for packet buffering in networking applications. MPC8313EVRAGDB does not support DDR3 or LPDDR variants.
Does the MPC8313EVRAGDB include an on-chip USB 2.0 PHY?
Yes, the MPC8313EVRAGDB integrates a full-speed/high-speed USB 2.0 PHY compliant with the Universal Serial Bus Specification Rev. 2.0. It supports all three operational modes - host, device, and OTG - without requiring an external transceiver when using the internal PHY. The USB_DP/USB_DM pins are routed directly to the on-die PHY, and the controller is EHCI-compliant in host mode with one downstream-facing port and three programmable endpoints in device mode. MPC8313EVRAGDB also supports ULPI interface for external PHY attachment.
What Ethernet standards does the MPC8313EVRAGDB eTSEC comply with?
The MPC8313EVRAGDB dual eTSECs comply with IEEE Std 802.3, 802.3u, 802.3x, 802.3z, 802.3au, and 802.3ab - covering 10BASE-T, 100BASE-TX, and 1000BASE-T operation. Each eTSEC supports RGMII, SGMII, MII, RMII, and RTBI physical layer interfaces, and includes hardware features for IEEE 1588 precision time stamping, Wake-on-Magic Packet, and full-duplex flow control. MPC8313EVRAGDB eTSECs also implement TCP/IP offload including VLAN/PPPoE/MPLS header recognition and per-packet configurable acceleration.
Is the MPC8313EVRAGDB pin-compatible with other PowerQUICC II Pro processors?
No, the MPC8313EVRAGDB is not pin-compatible with other members of the PowerQUICC II Pro family such as MPC8315E or MPC8377E. While MPC8315EVRAGDB shares the identical 676-pin PBGA package and pinout with MPC8313EVRAGDB, enabling drop-in replacement for SATA-enabled designs, MPC8377ERVAGDB uses a different package and pin assignment due to its PCI Express interface and higher-frequency core. Always verify mechanical and electrical compatibility using the official NXP MPC8313EVRAGDB package drawing and signal mapping tables before substitution.
What security algorithms are accelerated by the MPC8313EVRAGDB SEC 2.2 engine?
The MPC8313EVRAGDB security engine SEC 2.2 accelerates DES, 3DES, AES (all key lengths), SHA-1, MD-5, SHA-224, SHA-256, and HMAC with any supported hash algorithm. It implements a single crypto-channel with dedicated execution units: Data Encryption Unit (DEU), Advanced Encryption Standard Unit (AESU), and Message Digest Execution Unit (MDEU). These units operate independently of the e300c3 core, enabling concurrent cryptographic processing for IPSec, IEEE 802.11i, and iSCSI protocols without CPU intervention. MPC8313EVRAGDB SEC 2.2 does not support RSA or elliptic curve cryptography.
MPC8313EVRAGDB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 516-BBGA Exposed Pad
- Series:
- MPC83xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e300c3
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 400MHz
- Co-Processors/DSP:
- Security; SEC 2.2
- RAM Controllers:
- DDR, DDR2
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 516-TEPBGA (27x27)
- Additional Interfaces:
- DUART, HSSI, I2C, PCI, SPI
MPC8313EVRAGDB FAQ
1.How can I place an order for MPC8313EVRAGDB through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8313EVRAGDB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8313EVRAGDB reliable?
The price and inventory of MPC8313EVRAGDB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8313EVRAGDB is usually 5 days.
3.What payment methods are accepted for MPC8313EVRAGDB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8313EVRAGDB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8313EVRAGDB?
MPC8313EVRAGDB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8313EVRAGDB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8313EVRAGDB?
For technical support, including MPC8313EVRAGDB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8313EVRAGDB requirements.
6.How does Aetrix verify that MPC8313EVRAGDB is sourced from the original manufacturer or authorized distributors?
All MPC8313EVRAGDB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8313EVRAGDB meets industry standards.
7.What is the process for return or replacement of MPC8313EVRAGDB?
All MPC8313EVRAGDB units undergo pre-shipment inspection (PSI). If there is an issue with MPC8313EVRAGDB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8313EVRAGDB part is unused and in its original packaging.
Return procedure for MPC8313EVRAGDB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC8313EVRAGDB Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
