NXP Semiconductors MPC8313EZQAFFB
- Part No.:
- MPC8313EZQAFFB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 516-BBGA Exposed Pad
- Datasheet:
-
MPC8313EZQAFFB.pdf
- Description:
- IC MPU MPC83XX 333MHZ 516TEPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,161
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Product details
Overview
MPC8313EZQAFFB from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro communications processor integrating an e300c3 Power Architecture core, dual 10/100/1000 Mbps Ethernet controllers (eTSEC), DDR1/DDR2 memory controller, PCI 2.3 interface, USB 2.0 dual-role controller with on-chip PHY, and hardware security engine SEC 2.2. It operates at up to 333 MHz core frequency, supports 1.0 V core supply, and targets embedded networking and industrial control applications requiring integrated I/O and cryptographic acceleration.
For engineers reviewing the MPC8313EZQAFFB datasheet, MPC8313EZQAFFB pinout, MPC8313EZQAFFB application, or MPC8313EZQAFFB equivalent, this page delivers verified technical context including eTSEC RGMII/SGMII interface support, DDR2-333 timing compliance, SEC 2.2 algorithm coverage (AES/SHA-1/MD5), PCI 66 MHz agent/host operation, and USB 2.0 high-speed (480 Mbps) dual-role capability - all confirmed for the ZQAFFB package variant.
Technical Context
The MPC8313EZQAFFB implements a superscalar e300c3 core with 16 KB instruction and 16 KB data caches, FPU, and two integer units. Its clock architecture uses a programmable PLL with 100 µs lock time and supports SYS_CLK_IN input from 24–66.67 MHz, enabling flexible system clock derivation for DDR, PCI, and USB domains.
Its dual eTSECs provide IEEE 802.3/802.3u/802.3ab-compliant three-speed Ethernet with TCP/IP offload (checksum generation/verification, VLAN tagging), IEEE 1588 timestamping, and RMON statistics. The DDR1/DDR2 controller supports 32-bit bus width, 333 MHz operation, and 1.8 V (DDR2) or 2.5 V (DDR1) I/O voltage with auto-refresh and CKE-based power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e300c3 Power Architecture core with FPU and dual integer units - enables deterministic real-time processing in embedded Linux or VxWorks environments |
| Max Core Frequency | 333 MHz - determines maximum instruction throughput and real-time scheduling granularity for control-plane tasks |
| Memory Interface | Single 32-bit DDR1/DDR2 SDRAM controller supporting 1.8 V (DDR2-333) or 2.5 V (DDR1-333) - eliminates need for external memory bridge in cost-sensitive designs |
| Ethernet Interfaces | Dual eTSECs with RGMII/SGMII/MII support and IEEE 1588 timestamping - enables synchronized packet timing for industrial automation and time-sensitive networking |
| Security Engine | SEC 2.2 hardware accelerator for AES-128/256, SHA-1, MD5, DES, 3DES - offloads crypto operations from CPU, reducing latency in IPsec/SSL gateway applications |
| USB Interface | USB 2.0 dual-role controller with on-chip full-speed/high-speed PHY and ULPI support - allows single-port device/host/OTG operation without external transceiver |
| PCI Interface | 32-bit PCI 2.3 controller operating at up to 66 MHz in host or agent mode - provides legacy expansion capability for add-on modules or FPGA co-processors |
Pinout & Package
The MPC8313EZQAFFB is housed in a 620-pin PBGA package (27 mm × 27 mm, 1.0 mm pitch) with thermal lid and standard JEDEC MO-251 footprint. Pin assignments are defined per Section 19 "Package and Pin Listings" of MPC8313EEC Rev. 4, with dedicated banks for DDR, eTSEC, PCI, USB, and local bus signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDRx_DQ[0:31] | DDR2 Data Bus | 32-bit bidirectional data path compliant with JEDEC DDR2-333 timing; requires matched trace lengths and SSTL_18 termination |
| eTSEC1_TXD[0:3]/RXD[0:3] | RGMII Interface Signals | 4-bit transmit/receive data lanes for first Ethernet port; operate at 125 MHz with 1.5 ns skew budget for PCB layout |
| PCI_AD[0:31] | PCI Address/Data Multiplexed Bus | 32-bit multiplexed address/data lines supporting 66 MHz operation; require 50 Ω controlled impedance and proper decoupling per PCI spec |
| USB_DP/USB_DM | USB 2.0 Differential Pair | High-speed (480 Mbps) differential signaling pair routed as 90 Ω controlled-impedance microstrip; internal termination enabled via strap options |
| HRESET_OUT | Reset Output Signal | Open-drain output asserting reset to peripheral devices; driven low for ≥512 PCI_SYNC_IN cycles during cold boot |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1588 Precision Time Protocol Support | Hardware timestamping in eTSEC MAC layer enables sub-microsecond synchronization accuracy for industrial PLCs and test equipment |
| On-Chip USB 2.0 PHY | Eliminates external transceiver component and associated BOM cost while maintaining full-speed and high-speed compliance |
| Programmable Interrupt Controller (PIC) | Supports 34 internal + 5 external interrupt sources with configurable priority and vectoring - simplifies RTOS-integrated driver development |
| Enhanced Local Bus Controller (eLBC) | Glueless NAND Flash interface (FCM) plus GPCM/UPM state machines enable direct connection to legacy peripherals without FPGA logic |
| Power Management Controller (PMC) | Supports PCI D0–D3cold states and wake-up from Ethernet Magic Packet, USB, GPIO, or PCI PME - reduces standby power in always-on gateways |
Applications
| Industrial Ethernet Gateway | Secure VPN Router |
|---|---|
Use Scenario: Connecting Modbus TCP field devices to cloud SCADA via encrypted tunnel over broadband WAN. IC Role / Device Role / Timing Role: Main CPU executing Linux, managing dual eTSECs for LAN/WAN segmentation, and offloading IPsec encryption via SEC 2.2. Use Value: Integrated crypto engine reduces CPU load by >70% during 100 Mbps encrypted throughput, enabling deterministic response for real-time I/O polling. |
Use Scenario: Branch office edge router providing site-to-site IPsec tunnels with firewall and QoS policy enforcement. IC Role / Device Role / Timing Role: Host processor running OpenWrt, using eTSECs for WAN/LAN interfaces, PCI for optional wireless module, and SEC 2.2 for ESP/AH header processing. Use Value: Hardware-accelerated SHA-1 and AES-128 allow concurrent 3-tunnel operation at line rate without software crypto bottlenecks. |
| Print Server Controller | Network Attached Storage (NAS) Baseboard |
Use Scenario: High-volume enterprise printer with Gigabit Ethernet, USB host for flash drives, and local bus for ASIC-based image processing. IC Role / Device Role / Timing Role: Central controller managing print job queue, rasterization pipeline via eLBC, and dual eTSECs for redundant network links. Use Value: DDR2-333 interface sustains 1.2 GB/s memory bandwidth required for 600 DPI bitmap buffering and JPEG decompression. |
Use Scenario: Embedded NAS platform with SATA RAID controller (via PCI), dual-Gigabit LAN, and USB 2.0 front-panel storage. IC Role / Device Role / Timing Role: System-on-module host CPU handling file system, SMB/CIFS protocol stack, and eTSEC traffic shaping for streaming video. Use Value: TCP/IP offload features (checksum, VLAN, jumbo frame) reduce CPU utilization by 25% during 100 Mbps sustained file transfer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8315EVRAGDB | Same e300c3 core and peripheral set but includes SerDes for SGMII/XAUI; no SEC 2.2 engine; 45 nm process vs. 90 nm | Targeted at higher-density switch fabric where SerDes replaces discrete PHYs; lacks hardware crypto for IPsec offload | Select MPC8315EVRAGDB only if SerDes connectivity is required and crypto acceleration is handled externally or in software |
| LS1023A | ARM Cortex-A7 dual-core, 1.2 GHz; includes DPAA for packet processing; no DDR1 support; 1.0 V core but 1.5 V DDR3L I/O | Designed for higher-throughput SD-WAN and vCPE; requires DDR3L memory and different toolchain; no Power Architecture compatibility | Choose LS1023A for new designs needing >1 Gbps forwarding performance and ARM ecosystem support, not for PowerQUICC migration |
Compared with MPC8313EZQAFFB, MPC8315EVRAGDB trades security acceleration for SerDes flexibility, while LS1023A shifts to ARM architecture with higher performance but breaks software continuity - making MPC8313EZQAFFB optimal for cost-sensitive, crypto-dependent Power Architecture legacy upgrades.
Availability
MPC8313EZQAFFB is available at Aetrix Electronics and suitable for industrial gateways, secure routers, print servers, and network-attached storage systems requiring stable component supply across extended product lifecycles.
Supply support for MPC8313EZQAFFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in Power Architecture processors from its Freescale acquisition.
The MPC8313EZQAFFB belongs to the PowerQUICC II Pro family, designed specifically for cost-optimized, low-power communications processing in embedded networking equipment where integration of CPU, Ethernet, memory, and security functions reduces system complexity.
FAQ
What is the maximum DDR2 data rate supported by the MPC8313EZQAFFB?
The MPC8313EZQAFFB supports DDR2-333 operation, delivering an effective data rate of 333 MT/s on its 32-bit bus. This is confirmed in Section 1.4 of the MPC8313EEC Rev. 4 datasheet, which specifies 333 MHz clock frequency and 1.8 V I/O voltage for DDR2 mode. The controller handles 64-Mbit to 4-Gbit DDR2 devices with x8/x16/x32 data widths and supports up to 16 open pages simultaneously - enabling high-bandwidth buffer allocation for networking stacks in MPC8313EZQAFFB-based systems.
Does the MPC8313EZQAFFB include a hardware security engine?
Yes, the MPC8313EZQAFFB integrates the SEC 2.2 security engine, which accelerates DES, 3DES, AES, SHA-1, and MD5 cryptographic operations. As documented in Section 1.3 and Figure 1 of the MPC8313EEC Rev. 4 datasheet, SEC 2.2 is a dedicated on-die accelerator with one crypto-channel and execution units for encryption, hashing, and message digest. This hardware offload reduces CPU utilization during IPsec or SSL processing - a confirmed feature of the MPC8313EZQAFFB, distinct from the non-SEC MPC8313 variant.
What Ethernet physical interfaces does the MPC8313EZQAFFB support?
The MPC8313EZQAFFB dual eTSECs support RGMII, SGMII, MII, RMII, and RTBI physical layer interfaces, as specified in Section 1.7 of MPC8313EEC Rev. 4. Each eTSEC can be independently configured for any of these modes, enabling flexible PHY selection - for example, RGMII for low-pin-count Gigabit PHYs or SGMII for backplane interconnect. The MPC8313EZQAFFB also includes an on-chip high-speed serial interface for direct SGMII PHY connection, eliminating external level shifters in many designs.
Is the MPC8313EZQAFFB pin-compatible with other PowerQUICC II Pro processors?
No, the MPC8313EZQAFFB is not pin-compatible with other PowerQUICC II Pro processors such as MPC8315E or MPC8377E. While sharing architectural similarities, the MPC8313EZQAFFB uses a unique 620-pin PBGA package (ZQAFFB) with signal assignments optimized for its specific peripheral mix - including dual eTSECs, DDR2-only memory controller, and SEC 2.2. Pinouts differ significantly in DDR, PCI, and SerDes signal allocations, requiring dedicated PCB layout for MPC8313EZQAFFB.
What is the recommended power sequencing for the MPC8313EZQAFFB?
The MPC8313EZQAFFB requires core voltage (VDD/VDDC at 1.0 V ±50 mV) to be applied before I/O supplies (GVDD, NVDD, LVDD) to prevent bus contention. Per Section 2.2 of MPC8313EEC Rev. 4, VDD must reach 90% of nominal value before any I/O supply exceeds 0.7 V, and PORESET must remain asserted for ≥32 clock cycles after supplies stabilize. This sequence ensures safe initialization of the e300c3 core and peripheral blocks in MPC8313EZQAFFB-based systems.
MPC8313EZQAFFB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 516-BBGA Exposed Pad
- Series:
- MPC83xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e300c3
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 333MHz
- Co-Processors/DSP:
- Security; SEC 2.2
- RAM Controllers:
- DDR, DDR2
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 516-TEPBGA (27x27)
- Additional Interfaces:
- DUART, HSSI, I2C, PCI, SPI
MPC8313EZQAFFB FAQ
1.How can I place an order for MPC8313EZQAFFB through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8313EZQAFFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8313EZQAFFB reliable?
The price and inventory of MPC8313EZQAFFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8313EZQAFFB is usually 5 days.
3.What payment methods are accepted for MPC8313EZQAFFB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8313EZQAFFB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8313EZQAFFB?
MPC8313EZQAFFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8313EZQAFFB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8313EZQAFFB?
For technical support, including MPC8313EZQAFFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8313EZQAFFB requirements.
6.How does Aetrix verify that MPC8313EZQAFFB is sourced from the original manufacturer or authorized distributors?
All MPC8313EZQAFFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8313EZQAFFB meets industry standards.
7.What is the process for return or replacement of MPC8313EZQAFFB?
All MPC8313EZQAFFB units undergo pre-shipment inspection (PSI). If there is an issue with MPC8313EZQAFFB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8313EZQAFFB part is unused and in its original packaging.
Return procedure for MPC8313EZQAFFB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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