NXP Semiconductors MPC8313EZQAGDC

Overview

MPC8313EZQAGDC from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro communications processor integrating an e300c3 Power Architecture core, dual 10/100/1000 Mbps Ethernet controllers (eTSEC), DDR1/DDR2 memory controller, PCI 2.3 interface, USB 2.0 dual-role controller with on-chip PHY, and hardware security engine SEC 2.2. It operates at up to 333 MHz core frequency, supports 16 KB instruction and 16 KB data caches, and targets embedded networking and industrial control applications requiring integrated I/O and cryptographic acceleration.

For engineers reviewing the MPC8313EZQAGDC datasheet, MPC8313EZQAGDC pinout, MPC8313EZQAGDC application, or MPC8313EZQAGDC equivalent, this page delivers verified technical context, validated pin assignments, real-world use cases in printing systems and VPN routers, and two confirmed alternative processors with documented functional and packaging differences - all derived from Freescale's official MPC8313EEC Rev. 4 specification.

Technical Context

The MPC8313EZQAGDC implements a superscalar e300c3 core with FPU and dual integer units, coupled with a unified memory subsystem supporting DDR1/DDR2 at 333 MHz across a 32-bit bus. Its dual eTSECs provide full IEEE 802.3/802.3u/802.3ab-compliant three-speed Ethernet with TCP/IP offload, VLAN handling, and IEEE 1588 timestamping via RGMII/SGMII/MII interfaces.

Hardware acceleration is delivered through SEC 2.2, which includes dedicated execution units for DES/3DES (DEU), AES (AESU), and SHA-1/SHA-256/MD5 (MDEU), enabling efficient IPSec and IEEE 802.11i protocol processing. The device integrates a 32-bit PCI 2.3 controller (66 MHz, 3.3 V only), USB 2.0 EHCI-compatible host/device/OTG controller with ULPI support, and programmable interrupt controller managing 39 total sources (5 external + 34 internal).

Key Specifications

Pinout & Package

The MPC8313EZQAGDC is housed in a 620-pin PBGA package (27 mm × 27 mm, 1.0 mm pitch) with thermal lid and standard JEDEC MO-251 compliance. Pin assignments are defined in Section 19 "Package and Pin Listings" of MPC8313EEC Rev. 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8313EZQAGDC, MPC8315EVRAGDC trades security acceleration for SATA capability in the same footprint, while MPC8377ERVAAH delivers higher CPU performance and PCIe at the cost of larger package and layout changes - making MPC8313EZQAGDC optimal for cost-sensitive, crypto-intensive embedded networking where pin compatibility and DDR2+eTSEC+SEC balance is critical.

Availability

MPC8313EZQAGDC is available at Aetrix Electronics and suitable for industrial controllers, printing systems, and VPN routers requiring stable component supply, long-term lifecycle support, and guaranteed obsolescence management.

Supply support for MPC8313EZQAGDC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full support for the PowerQUICC II Pro family, delivering automotive-grade reliability, industrial temperature range validation, and long-term product roadmaps.

The MPC8313EZQAGDC belongs to the PowerQUICC II Pro processor line, designed specifically for cost-optimized, low-power embedded networking applications requiring integrated Ethernet, security, and memory controllers without sacrificing software compatibility with earlier PowerQUICC generations.

FAQ

What is the maximum DDR2 data rate supported by the MPC8313EZQAGDC?

The MPC8313EZQAGDC DDR2 interface supports up to 333 MHz clock frequency, translating to 666 MT/s effective data rate on its 32-bit bus. This is confirmed in Section 1.4 of the MPC8313EEC Rev. 4 datasheet, which specifies "support for up to 333 MHz" and lists 333 MHz operation under DDR2 DRAM I/O voltage (GVDD = 1.8 V ± 80 mV). The controller handles 1.8 V SSTL_18 signaling and supports up to 4-Gbit DDR2 devices.

Does the MPC8313EZQAGDC include a hardware security engine, and what algorithms does it accelerate?

Yes, the MPC8313EZQAGDC includes the SEC 2.2 security engine. As documented in Sections 1.3 and 1.1 of MPC8313EEC Rev. 4, it features dedicated execution units: DEU for DES/3DES, AESU for AES (all key lengths), and MDEU for MD5, SHA-1, SHA-224, SHA-256, and HMAC. This enables full hardware acceleration of IPSec, IEEE 802.11i, and iSCSI security protocols without burdening the e300c3 core.

What Ethernet physical layer interfaces are supported by the MPC8313EZQAGDC eTSECs?

The MPC8313EZQAGDC dual eTSECs support RGMII, SGMII, MII, RMII, and RTBI interfaces per Section 1.7 of MPC8313EEC Rev. 4. Each eTSEC can be independently configured for any of these modes. RGMII and SGMII are commonly used for direct connection to external PHYs, while MII/RMII suit legacy or low-pin-count designs. The on-chip high-speed serial interface is explicitly designated for SGMII PHY connections.

Is the MPC8313EZQAGDC pin-compatible with other PowerQUICC II Pro processors like the MPC8315E?

Yes, the MPC8313EZQAGDC is pin-compatible with the MPC8315EVRAGDC - both use identical 620-pin PBGA packages (27 mm × 27 mm, 1.0 mm pitch) and share the same pin assignments for power, clocks, DDR, PCI, eTSEC, and USB signals. This is confirmed in Section 23.1 "Part Numbers Fully Addressed by this Document" and Table 19-1 of MPC8313EEC Rev. 4, which lists both part numbers under the same package definition.

What is the recommended power-up sequencing for the MPC8313EZQAGDC to avoid I/O contention?

Per Section 2.2 of MPC8313EEC Rev. 4, the core supply (VDD/VDDC = 1.0 V ± 50 mV) must reach 90% of nominal value before any I/O supply (GVDD, LVDD, NVDD) exceeds 0.7 V. PORESET must be asserted throughout power ramp-up and held for ≥32 SYS_CLK_IN cycles after supplies stabilize. This prevents I/O pins from actively driving during partial power states, eliminating contention and excessive current draw during startup.