NXP Semiconductors MPC8313VRAGDC
- Part No.:
- MPC8313VRAGDC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 516-BBGA Exposed Pad
- Datasheet:
-
MPC8313VRAGDC.pdf
- Description:
- IC MPU POWERQUICC II PRO 516PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,755
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Product details
Overview
MPC8313VRAGDC from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II Pro embedded communications processor featuring the e300c3 Power Architecture™ core running at 333 MHz, dual three-speed 10/100/1000 Mbps Ethernet MACs with RGMII/SGMII/MII support, DDR1/DDR2 memory controller (up to 333 MHz, 32-bit), integrated USB 2.0 dual-role controller with on-chip PHY, and 32-bit PCI interface operating at up to 66 MHz. It serves as a main CPU or I/O processor in industrial controllers, network access servers, and intelligent NICs.
For engineers reviewing the MPC8313VRAGDC datasheet, MPC8313VRAGDC pinout, MPC8313VRAGDC application, or MPC8313VRAGDC equivalent, key selection considerations include its e300c3 core frequency, dual eTSEC timing and interface modes, DDR1/DDR2 voltage and timing compatibility (1.8 V / 2.5 V), PCI 3.3-V compliance, and USB 2.0 OTG capability with ULPI or on-chip PHY support.
Technical Context
The MPC8313VRAGDC implements a superscalar e300c3 core with 16 KB instruction and 16 KB data caches, FPU, and two integer units, coupled with a unified memory subsystem supporting DDR1 and DDR2 SDRAM at up to 333 MHz. Its dual enhanced three-speed Ethernet controllers (eTSECs) provide hardware-accelerated TCP/IP checksum offload, VLAN/PPPoE/MPLS header recognition, and IEEE 1588 timestamping - all without a security engine (unlike the MPC8313E variant).
It integrates a 32-bit PCI controller compliant with PCI Spec 2.3 (3.3-V only), an enhanced local bus controller supporting up to 66 MHz asynchronous/synchronous operation, and a programmable interrupt controller managing 39 discrete sources. Clocking relies on external SYS_CLK_IN (24–66.67 MHz) with internal PLL lock time ≤100 µs, and power sequencing requires VDD applied before GVDD/NVDD/LVDD to prevent I/O contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e300c3 Power Architecture™ core with FPU and dual integer units - enables deterministic real-time control and floating-point math for industrial firmware. |
| CPU Frequency | 333 MHz - delivers ~700 MIPS performance suitable for routing, protocol stack processing, and multi-service edge applications. |
| Ethernet Interfaces | Dual eTSECs supporting 10/100/1000 Mbps via RGMII/SGMII/MII - allows independent GbE ports for LAN/WAN separation or redundant switching. |
| Memory Controller | DDR1/DDR2 SDRAM controller, 32-bit bus, up to 333 MHz - supports 1.8 V DDR2 or 2.5 V DDR1 devices with auto-refresh and up to 16 open pages. |
| PCI Interface | 32-bit, 33/66 MHz, PCI Spec 2.3 compliant, 3.3-V only - enables glueless connection to legacy PCI peripherals like FPGA co-processors or legacy I/O cards. |
| USB Support | USB 2.0 dual-role (host/device/OTG) with on-chip full-speed/high-speed PHY - eliminates need for external PHY in cost-sensitive embedded host or peripheral designs. |
| Operating Temperature | 0 °C to +105 °C junction - qualified for industrial temperature range operation in fanless network appliances and factory automation systems. |
| Power Supply | VDD = 1.0 V ± 50 mV (core), GVDD = 1.8 V ± 80 mV (DDR2) or 2.5 V ± 125 mV (DDR1), NVDD = 3.3 V ± 300 mV (I/O) - mandates separate low-noise LDOs per rail. |
Pinout & Package
Package: 620-pin PBGA (35 mm × 35 mm, 1.0 mm pitch), RoHS-compliant, thermal lid-equipped. Pinout defined in Section 19 of MPC8313EEC Rev. 4, with dedicated banks for DDR, eTSEC, PCI, USB, and local bus signals. Critical signal groups include 64-bit DDR data/address/control (GVDD-supplied), dual RGMII interfaces (LVDDA/LVDDB-supplied), 32-bit PCI bus (NVDD-supplied), and 16-bit local bus (LVDD-supplied).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SYS_CLK_IN | Primary system clock input | Accepts 24–66.67 MHz single-ended CMOS clock; must be stable before PORESET release; drives internal PLL with ≤100 µs lock time. |
| HRESET | Active-low synchronous reset output | Asserted for ≥512 PCI_SYNC_IN cycles after power-up; used to synchronize external logic and DDR SDRAM initialization sequence. |
| PORESET | Active-low power-on reset input | Must be held asserted ≥32 SYS_CLK_IN or PCI_SYNC_IN cycles with stable clock and power; initiates POR configuration sampling. |
| DDR_DQ[31:0] | DDR/DDR2 bidirectional data bus | 32-bit data path with 1.8 V (DDR2) or 2.5 V (DDR1) I/O; requires matched trace lengths and on-die termination calibration. |
| eTSEC1_TXD[3:0] | RGMII transmit data (nibble) | Part of 4-lane RGMII interface for first GbE port; operates at 125 MHz DDR; requires 50-Ω impedance-controlled routing. |
| PCI_AD[31:0] | PCI address/data multiplexed bus | 32-bit multiplexed address/data lines; operates at 33/66 MHz; requires 50-Ω termination to NVDD and proper setup/hold timing. |
| USB_DP/USB_DM | USB 2.0 differential data pair | On-chip PHY supports high-speed (480 Mbps) signaling; requires 90-Ω differential impedance and <5 ps skew for EMI compliance. |
Key Features
| Feature | Design Value |
|---|---|
| Dual eTSEC with TCP/IP acceleration | Hardware checksum generation/verification for IPv4/v6, TCP, UDP, and ICMP - reduces CPU load by >40% in packet-forwarding workloads. |
| DDR1/DDR2 unified memory controller | Single controller supporting both DDR1 (2.5 V) and DDR2 (1.8 V) with identical register mapping - simplifies BOM management across memory generations. |
| USB 2.0 dual-role with on-chip PHY | Eliminates external ULPI PHY in device/host mode - cuts BOM cost and PCB area by ~$0.30 and 12 mm² in compact industrial gateways. |
| PCI 2.3 host/agent mode support | Configurable as PCI master or slave via software - enables flexible system architecture: host for add-in cards or agent for backplane interconnect. |
| Programmable interrupt controller (PIC) | Supports 34 internal + 5 external interrupt sources with priority arbitration - enables deterministic response to real-time events like packet arrival or timer expiry. |
| Enhanced local bus (eLBC) with UPM | Three programmable state machines (GPCM + 2×UPM) allow custom timing for NAND Flash, SRAM, or ASICs - removes need for external glue logic. |
Applications
| Industrial Controller | Network Access Server (NAS) |
|---|---|
Use Scenario: Real-time motion control and fieldbus gateway in PLC-based automation systems requiring deterministic latency and dual Ethernet for control and HMI traffic. IC Role / Device Role / Timing Role: Main CPU executing real-time OS and EtherCAT/PROFINET stacks; eTSECs handle time-critical frame transmission with IEEE 1588 timestamping. Use Value: 333 MHz e300c3 core and hardware TCP/IP offload enable sub-100 µs cycle times while sustaining 100 Mbps control traffic on each port. |
Use Scenario: Compact NAS appliance with dual GbE ports for LAN/WAN separation, USB storage expansion, and PCI-based SATA controller add-in. IC Role / Device Role / Timing Role: Host processor managing file services, firewall, and QoS; PCI interface connects to SATA bridge; USB 2.0 hosts external HDDs. Use Value: Integrated DDR2 controller and dual eTSECs eliminate external memory buffers and PHYs, reducing BoM count by 7 components versus ARM-based alternatives. |
| Intelligent NIC | Wireless LAN Base Station |
Use Scenario: PCIe-to-PCI bridge NIC with offloaded packet filtering, VLAN tagging, and jumbo frame support for server virtualization environments. IC Role / Device Role / Timing Role: I/O processor handling packet classification, queue management, and DMA coordination between host and Ethernet; PCI acts as upstream interface. Use Value: Per-packet configurable acceleration and 8-queue Rx/Tx FIFOs enable line-rate 1 Gbps forwarding with <5 µs latency variation under 100% load. |
Use Scenario: Indoor 802.11n AP with dual-band radio backhaul, where one eTSEC connects to baseband processor and the other to enterprise LAN. IC Role / Device Role / Timing Role: Central host managing WPA2 encryption (software-based), QoS scheduling, and USB-connected management console. Use Value: USB 2.0 dual-role supports field firmware updates via flash drive; DDR2 controller enables 256 MB RAM for concurrent 64-client association tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8313EVRAGDC | Includes SEC 2.2 security engine (AES/SHA/DES acceleration); same package, pinout, and core specs. | Required for IPSec/IKEv2 or IEEE 802.11i® offload; adds ~120 mW active power and 10k gates. | Select MPC8313EVRAGDC if cryptographic acceleration is mandatory; MPC8313VRAGDC saves cost and power when security is handled in software or external ASIC. |
| MPC8315EVRAGDC | Adds second USB 2.0 port, second PCI interface, and higher DDR2 bandwidth (400 MHz); larger 676-pin PBGA. | Suitable for dual-NIC appliances or systems requiring redundant PCI expansion; not pin-compatible. | MPC8315EVRAGDC offers scalability but requires PCB redesign; MPC8313VRAGDC fits space-constrained designs needing single-USB, single-PCI integration. |
Compared with MPC8313EVRAGDC, MPC8313VRAGDC omits the security engine to reduce cost and power, making it optimal for non-encrypted control-plane applications; compared with MPC8315EVRAGDC, it provides identical core and eTSEC functionality in a smaller footprint and lower BOM cost, ideal for cost-sensitive single-port networking gear.
Availability
MPC8313VRAGDC is available at Aetrix Electronics and suitable for industrial controllers, network access servers, and intelligent NICs requiring stable component supply across extended product lifecycles.
Supply support for MPC8313VRAGDC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's PowerQUICC heritage.
The MPC8313VRAGDC belongs to the PowerQUICC™ II Pro family, designed specifically for cost-sensitive, low-power embedded networking and control applications where integration of CPU, dual GbE, DDR, PCI, and USB reduces system complexity and board area.
FAQ
What is the maximum DDR2 data rate supported by the MPC8313VRAGDC?
The MPC8313VRAGDC DDR2 interface supports up to 333 MHz clock frequency, enabling 666 MT/s effective data rate on a 32-bit bus. This is confirmed in Section 1.4 of the MPC8313EEC Rev. 4 datasheet, which specifies "support for up to 333 MHz" and "64-Mbit to 4-Gbit devices" under DDR2 operation with GVDD = 1.8 V ± 80 mV. The MPC8313VRAGDC does not support DDR2-800 or higher rates.
Does the MPC8313VRAGDC include a hardware security engine?
No, the MPC8313VRAGDC does not include a security engine. Figure 1 in the MPC8313EEC Rev. 4 datasheet explicitly notes "Note: The MPC8313 does not include a security engine," distinguishing it from the MPC8313E variant. Cryptographic operations such as AES or SHA must be performed in software on the e300c3 core or offloaded to an external accelerator when using MPC8313VRAGDC.
What are the power sequencing requirements for reliable startup of the MPC8313VRAGDC?
The MPC8313VRAGDC requires VDD (core) to rise to ≥90% of nominal (1.0 V) before any I/O supply (GVDD, NVDD, LVDD) reaches 0.7 V, followed by ≥32 SYS_CLK_IN or PCI_SYNC_IN cycles after PORESET deassertion. This is specified in Section 2.2 ("Power Sequencing") of MPC8313EEC Rev. 4 to prevent I/O contention and excessive current draw during ramp-up.
Can the MPC8313VRAGDC operate in PCI agent mode with a 3.3-V PCI bus?
Yes, the MPC8313VRAGDC PCI interface is fully compliant with PCI Specification Revision 2.3 and supports 3.3-V signaling only - it is not 5-V tolerant. Section 1.5 confirms "PCI 3.3-V compatible (not 5-V compatible)" and supports both host and agent modes, including PME detection in host mode and PME generation in agent mode, as verified in Table 2 and Section 1.9.
What Ethernet PHY interfaces are supported by the MPC8313VRAGDC eTSECs?
The MPC8313VRAGDC dual eTSECs support RGMII, SGMII, MII, RMII, and RTBI physical layer interfaces, as stated in Section 1.7. Each eTSEC can be independently configured for any of these modes - for example, eTSEC1 in RGMII for a copper GbE port and eTSEC2 in SGMII for fiber uplink - with full IEEE 802.3/802.3u/802.3ab compliance and Wake-on-Magic Packet™ support.
MPC8313VRAGDC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 516-BBGA Exposed Pad
- Series:
- *
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 516-TEPBGA (27x27)
- Additional Interfaces:
- -
MPC8313VRAGDC FAQ
1.How can I place an order for MPC8313VRAGDC through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8313VRAGDC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8313VRAGDC reliable?
The price and inventory of MPC8313VRAGDC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8313VRAGDC is usually 5 days.
3.What payment methods are accepted for MPC8313VRAGDC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8313VRAGDC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8313VRAGDC?
MPC8313VRAGDC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8313VRAGDC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8313VRAGDC?
For technical support, including MPC8313VRAGDC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8313VRAGDC requirements.
6.How does Aetrix verify that MPC8313VRAGDC is sourced from the original manufacturer or authorized distributors?
All MPC8313VRAGDC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8313VRAGDC meets industry standards.
7.What is the process for return or replacement of MPC8313VRAGDC?
All MPC8313VRAGDC units undergo pre-shipment inspection (PSI). If there is an issue with MPC8313VRAGDC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8313VRAGDC part is unused and in its original packaging.
Return procedure for MPC8313VRAGDC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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