NXP Semiconductors MPC8347ECZUAGDB

Overview

MPC8347ECZUAGDB from NXP (formerly Freescale) is a PowerQUICC™ II Pro integrated host processor featuring an embedded PowerPC e300 core operating up to 667 MHz, dual 10/100/1000-Mbps Ethernet controllers (TSECs), DDR SDRAM controller supporting 32-/64-bit interfaces at up to 333 MHz (TBGA), PCI 2.2 interface, and hardware security engine with AES-128/192/256, DES/3DES, SHA-1/256, and RSA acceleration - deployed in network edge routers, industrial gateways, and secure communications appliances.

For engineers reviewing the MPC8347ECZUAGDB datasheet, MPC8347ECZUAGDB pinout, MPC8347ECZUAGDB application, or MPC8347ECZUAGDB equivalent, key selection considerations include DDR timing compliance (2.5-V SSTL2), TSEC RGMII/GMII interface support, PCI host/agent mode flexibility, e300 core cache configuration (32-KB I/D), and hardware crypto-channel concurrency for IPSec/SSL offload.

Technical Context

The MPC8347ECZUAGDB implements a superscalar PowerPC e300 core with floating-point, integer, and branch units, coupled with tightly integrated system logic including dual TSECs compliant with IEEE 802.3z/ac/u standards, DDR-1 SDRAM controller with ECC and page-mode support, and PCI 2.2 host/agent bridge with memory prefetching and coherency enforcement. Its security engine contains four independent crypto-channels with dedicated AESU, DEU, MDEU, PKEU, and AFEU execution units.

It supports multiple clock domains: CSB bus clock derived from PLL (up to 533 MHz), DDR interface clock (up to 333 MHz in TBGA), and independent USB/PCI/TSEC clocks. The device requires precise power sequencing (VDD = 1.2 V ±60 mV, GVDD = 2.5 V ±125 mV, OVDD/LVDD = 3.3 V ±330 mV), and operates across industrial temperature range (–40°C to +105°C junction).

Key Specifications

Pinout & Package

The MPC8347ECZUAGDB is housed in a 783-pin TBGA (Thin Ball Grid Array) package with 1.0-mm ball pitch, designed for high-density routing and thermal dissipation in networking and industrial control PCBs. Pin assignments follow Freescale's standardized PowerQUICC II Pro layout with dedicated banks for DDR, PCI, TSEC, and local bus signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated host processor applications.

Compared with MPC8349ECZUAGDB, the MPC8347ECZUAGDB offers proven thermal margin and lower BOM cost in volume production, while the LX2160A delivers scalable multi-core throughput at the expense of architectural discontinuity and longer qualification cycles.

Availability

MPC8347ECZUAGDB is available at Aetrix Electronics and suitable for industrial gateways, secure remote access appliances, and carrier-grade residential gateways requiring stable component supply, long-term lifecycle support, and traceable sourcing for safety-critical deployments.

Supply support for MPC8347ECZUAGDB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in Power Architecture and networking processors.

The MPC8347ECZUAGDB belongs to the PowerQUICC™ II Pro family, engineered specifically for cost-optimized, single-chip edge networking and embedded control applications requiring integrated security, multi-protocol connectivity, and deterministic real-time performance.

FAQ

What is the maximum DDR data rate supported by the MPC8347ECZUAGDB?

The MPC8347ECZUAGDB supports DDR-1 SDRAM at up to 333 MHz in the TBGA package (783-pin), delivering 5.3 GB/s peak bandwidth on the 64-bit interface. This rate is validated for revision 1.1 silicon and earlier; later revisions (e.g., MPC8347EA) require separate hardware specifications documentation. The DDR controller enforces strict tDISKEW ≤750 ps at 333 MHz and mandates 2.5-V SSTL2 I/O compliance.

Does the MPC8347ECZUAGDB support PCIe or only PCI 2.2?

The MPC8347ECZUAGDB implements PCI Specification Revision 2.2 only - it does not support PCIe. Its 32-bit, 66-MHz PCI interface operates in both host and agent modes, with features including memory prefetching, delayed read transactions, and hardware-enforced coherency. PCIe capability was introduced in later NXP families such as QorIQ LS series, not in the PowerQUICC II Pro generation.

Can the MPC8347ECZUAGDB boot directly from NAND flash?

Yes, the MPC8347ECZUAGDB supports NAND flash boot via its Local Bus Controller (LBC) using the General-Purpose Chip Select Machine (GPCM) with hardware ECC generation. Boot initialization loads the first-stage bootloader from NAND pages configured for 8-bit or 16-bit bus width, with configurable bad-block management and spare-area ECC coverage per the MPC8347E Hardware Specifications Section 10.

What are the voltage requirements for the MPC8347ECZUAGDB's core and I/O supplies?

The MPC8347ECZUAGDB requires five regulated supplies: VDD = 1.2 V ±60 mV (core), AVDD = 1.2 V ±60 mV (PLL), GVDD = 2.5 V ±125 mV (DDR I/O), LVDD = 3.3 V ±330 mV or 2.5 V ±125 mV (TSEC I/O), and OVDD = 3.3 V ±330 mV (PCI/local bus/I²C/JTAG). All supplies must track directionally during ramp-up, and power sequencing recommends asserting PORESET before full stabilization.

Is the MPC8347ECZUAGDB RoHS-compliant and lead-free?

Yes, the MPC8347ECZUAGDB is RoHS-compliant and lead-free, conforming to EU Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) for the TBGA package. The "ZUAGDB" suffix denotes lead-free, halogen-free, and RoHS-compliant packaging per Freescale/NXP ordering nomenclature guidelines in Document Number MPC8347EEC Rev. 11.