NXP Semiconductors MPC8347EVVAGDB

Overview

MPC8347EVVAGDB from NXP (formerly Freescale) is a PowerQUICC™ II Pro integrated host processor featuring an embedded PowerPC e300 core operating up to 667 MHz, dual 10/100/1000-Mbps Ethernet controllers (TSEC), DDR SDRAM controller supporting 32-/64-bit interfaces at up to 333 MHz (TBGA), PCI 2.2 interface, and hardware security engine with AES-128/192/256, DES/3DES, SHA-1/256, and RSA acceleration - deployed in network edge routers, industrial gateways, and secure communications appliances.

For engineers reviewing the MPC8347EVVAGDB datasheet, MPC8347EVVAGDB pinout, MPC8347EVVAGDB application, or MPC8347EVVAGDB equivalent, this page delivers verified electrical specs (1.2 V core, 2.5 V DDR I/O, 3.3 V I/O), thermal power data (up to 3.6 W max, TBGA), silicon revision context (Rev. 1.1), and functional mapping for TSEC, DDR, PCI, USB 2.0 OTG, and security crypto-channel deployment.

Technical Context

The MPC8347EVVAGDB implements a superscalar PowerPC e300 core with 32 KB instruction and 32 KB data L1 caches, lockable cache segments, and dynamic power management. Its DDR SDRAM controller supports programmable timing, ECC, registered DIMMs, and 2.5-V SSTL2 I/O - with data rates up to 333 MHz on TBGA packages.

It integrates two IEEE 802.3-compliant TSECs with RGMII/GMII/TBI interfaces, MII management, 9.6-KB jumbo frames, and 2-KB Tx/Rx FIFOs per channel. The security engine contains four crypto-channels with dedicated AESU, DEU, PKEU, MDEU, and RNG units - enabling concurrent IPSec, SSL/TLS, and iSCSI offload without CPU intervention.

Key Specifications

Pinout & Package

Package: 672-pin TBGA (Thin Ball Grid Array), 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil design for optimal heat dissipation in industrial ambient conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated host processor applications.

Compared with MPC8349EVVAGDB and MPC8377ERVAGDB, the MPC8347EVVAGDB delivers optimal balance of DDR1 memory cost, dual-gigabit Ethernet, and hardware crypto for fixed-form-factor industrial gateways - avoiding unnecessary complexity or footprint increase where DDR2 or dual-PCI are not required.

Availability

MPC8347EVVAGDB is available at Aetrix Electronics and suitable for network edge routers, industrial IoT gateways, and secure communications appliances requiring stable component supply across long-lifecycle deployments.

Supply support for MPC8347EVVAGDB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and networking markets, with deep expertise in Power Architecture™ processors and embedded security.

The MPC8347E belongs to the PowerQUICC™ II Pro family - designed specifically for cost-sensitive, power-efficient integrated host processors in carrier-class access equipment, enterprise edge devices, and secure infrastructure appliances.

FAQ

What is the maximum DDR data rate supported by the MPC8347EVVAGDB?

The MPC8347EVVAGDB supports DDR-1 SDRAM at up to 333 MHz data rate in TBGA packages (e.g., MPC8347EVVAGDB), delivering 5.3 GB/s peak bandwidth on the 64-bit interface. This is confirmed in Section 6 of the Hardware Specifications (Rev. 11, Feb 2009) and applies specifically to revision 1.1 silicon - the version embodied in the MPC8347EVVAGDB orderable part number.

Does the MPC8347EVVAGDB include hardware cryptographic acceleration?

Yes, the MPC8347EVVAGDB integrates a dedicated security engine with four crypto-channels supporting AES-128/192/256, DES/3DES, SHA-1/256, MD5, RSA-2048, and HMAC - enabling full IPSec/IKE and TLS offload without CPU involvement. This is documented in Section 1, "Overview", and Section 4, "Security Engine", of the MPC8347EEC Rev. 11 specification.

What package type and pin count does the MPC8347EVVAGDB use?

The MPC8347EVVAGDB uses a 672-ball TBGA (Thin Ball Grid Array) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Pinout details are provided in Section 18, "Package and Pin Listings", of the MPC8347E Hardware Specifications (Rev. 11), confirming signal assignments for DDR, TSEC, PCI, and USB interfaces.

Is the MPC8347EVVAGDB compatible with the MPC8349E pinout?

No, the MPC8347EVVAGDB is not pin-compatible with the MPC8349E. While both share the same 672-pin TBGA footprint, signal mappings differ significantly - particularly for DDR (DDR1 vs DDR2 I/O voltage and timing), SATA (absent in MPC8347E), and certain PCI control pins. The MPC8347EVVAGDB is functionally and physically distinct per Freescale's ordering matrix in Section 23.1.

What is the core supply voltage requirement for the MPC8347EVVAGDB?

The MPC8347EVVAGDB requires a core supply voltage of 1.2 V ± 60 mV (VDD), as specified in Table 2, "Recommended Operating Conditions", of the Hardware Specifications (Rev. 11). This tight tolerance ensures stable e300 core operation at frequencies up to 667 MHz and must be maintained independently from I/O rails (OVDD, LVDD, GVDD).