NXP Semiconductors MPC8360EVVAGDGA

Overview

MPC8360EVVAGDGA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II Pro integrated communications processor featuring an e300 Power Architecture™ core operating at 667 MHz, dual DDR/DDR2 memory controllers (333 MHz data rate), and a dedicated QUICC Engine module running at 500 MHz for protocol offload. It integrates PCI 2.3, eight UCCs supporting Ethernet (10/100/1000 Mbps), ATM, HDLC, POS, TDM, and USB 2.0 - deployed in DSLAMs, 3G Node B interface cards, and media gateways.

For engineers reviewing the MPC8360EVVAGDGA datasheet, MPC8360EVVAGDGA pinout, MPC8360EVVAGDGA application, or MPC8360EVVAGDGA equivalent, this page delivers verified functional identity, validated package mapping (672-pin TBGA), confirmed pin-level I/O roles, real-world interworking capabilities (ATM-to-Ethernet, L2 switching), and two field-validated alternative processors with documented technical divergence.

Technical Context

The MPC8360EVVAGDGA implements a dual-core architecture: the e300 CPU core handles control-plane tasks with 32 KB instruction and 32 KB data cache, while the QUICC Engine's two 32-bit RISC controllers manage data-plane processing - including full-duplex ATM SAR (622 Mbps), IEEE 1588 timestamping, and hardware-accelerated interworking between Ethernet and ATM/AAL5. Its dual DDR SDRAM controllers support independent 32-bit configurations with ECC, enabling strict separation of control and data memory spaces.

Hardware security acceleration includes four crypto-channels with dedicated AESU (128/192/256-bit keys), DEU (DES/3DES), MDEU (SHA-1/224/256, MD5), PKEU (RSA up to 2048-bit), and AFEU (RC4). The device uses a 672-ball TBGA package with 1.3 V core supply, 1.8 V DDR2/GVDD, and 3.3 V LVDD/OVDD I/O domains - requiring strict power-up sequencing (VDD before GVDD/LVDD/OVDD) to prevent bus contention.

Key Specifications

Pinout & Package

Package: 672-ball Thin Ball Grid Array (TBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil design per IPC-7351B.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8379EVVAGDGA and P1022NSN2HFB, the MPC8360EVVAGDGA uniquely balances legacy protocol hardware acceleration (ATM, HDLC, TDM) with PCI 2.3 and dual DDR2 - making it the only option among the three that supports OC-12 ATM SAR, IEEE 1588 timestamping, and PCI add-in cards without software compromise or external components.

Availability

MPC8360EVVAGDGA is available at Aetrix Electronics and suitable for DSLAM control plane, 3G Node B interface cards, and media gateway applications requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing from authorized channels.

Supply support for MPC8360EVVAGDGA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full support for the PowerQUICC II Pro family, delivering automotive, industrial, and networking silicon with ISO 9001-certified manufacturing and AEC-Q100 qualification rigor.

The MPC8360EVVAGDGA belongs to the PowerQUICC II Pro communications processor line, engineered specifically for carrier-class access equipment requiring hardware-accelerated protocol processing, deterministic real-time response, and multi-standard interoperability in space- and power-constrained platforms.

FAQ

What is the maximum DDR2 data rate supported by the MPC8360EVVAGDGA?

The MPC8360EVVAGDGA supports DDR2 SDRAM at up to 333 MHz data rate (667 MT/s), with 1.8 V SSTL_18 I/O compatibility, on-die termination (ODT), and external driver impedance calibration. This is confirmed in Section 5 of the MPC8360EEC Rev. 5 specification, where DDR2 timing parameters are defined for 333 MHz operation under 1.8 V GVDD. The MPC8360EVVAGDGA achieves this using its dual 32-bit DDR2 controllers, each capable of independent 333 MHz operation.

Does the MPC8360EVVAGDGA support IEEE 1588 Precision Time Protocol hardware timestamping?

Yes, the MPC8360EVVAGDGA includes dedicated IEEE 1588 hardware timestamping logic within its QUICC Engine module. It supports sub-microsecond timestamp insertion and extraction on Ethernet frames across all eight UCCs, with configurable event detection (Sync, Delay_Req, Pdelay_Req) and hardware-based correction for ingress/egress latency. This capability is explicitly documented in Section 4 of the MPC8360EEC Rev. 5 specification under "QUICC Engine Unit" features.

What is the required power-up sequence for the MPC8360EVVAGDGA?

The MPC8360EVVAGDGA requires VDD (core supply) to reach 90% of nominal (1.3 V) before any I/O supply (GVDD, LVDD, OVDD) exceeds 0.7 V. This prevents bus contention and excessive current draw (3–5 A) during ramp-up. PORESET must be asserted throughout power stabilization. I/O supplies have no sequencing order relative to each other. This is mandated in Section 2.2.1 "Power-Up Sequencing" of the MPC8360EEC Rev. 5 specification.

How many UCCs does the MPC8360EVVAGDGA integrate, and what protocols do they support?

The MPC8360EVVAGDGA integrates eight Universal Communication Controllers (UCCs), each configurable for multiple protocols including 10/100/1000 Mbps Ethernet (GMII/RGMII/TBI/RTBI), ATM SAR (OC-12/622 Mbps), HDLC (70 Mbps), transparent serial, BISYNC, UART, and TDM. UCC1 and UCC2 support full Gigabit Ethernet; UCC3–UCC8 support lower-speed interfaces. This is specified in Section 1 of the MPC8360EEC Rev. 5 document and confirmed in the block diagram (Figure 1).

Is the MPC8360EVVAGDGA pin-compatible with other MPC8360E variants such as MPC8360EVVAJGB?

No, the MPC8360EVVAGDGA is not pin-compatible with MPC8360EVVAJGB. While both use the same 672-ball TBGA package, the GDGA suffix denotes revision 2.x silicon with 667 MHz CPU/500 MHz QUICC Engine and DDR2 support, whereas JGB indicates 533 MHz CPU/400 MHz QUICC Engine and DDR1-only support - resulting in different voltage domain assignments (e.g., GVDD = 1.8 V vs. 2.5 V) and incompatible power sequencing requirements. Pinouts differ in I/O voltage assignment and function multiplexing per Table 20 in MPC8360EEC Rev. 5.