NXP Semiconductors MPC850CVR50BU

Overview

MPC850CVR50BU from Freescale Semiconductor is a PowerQUICC™ integrated communications processor combining a 32-bit MPC8xx core with a dedicated RISC communications processor (CP), 8-Kbyte dual-port RAM, one Ethernet-capable SCC, USB 1.1 controller, two SMCs, SPI, I²C, and PCMCIA-ATA interface - designed for cost-sensitive remote-access and telecom edge devices operating at up to 50 MHz.

For engineers reviewing the MPC850CVR50BU datasheet, MPC850CVR50BU pinout, MPC850CVR50BU application, or MPC850CVR50BU equivalent, this page delivers verified electrical specs, bus timing constraints, thermal resistance (θ_JA = 31°C/W on multilayer board), low-power stop mode support, and confirmed IEEE 1149.1 JTAG debug interface compliance.

Technical Context

The MPC850CVR50BU implements a Harvard-architecture embedded MPC8xx core (2-Kbyte I-cache, 1-Kbyte D-cache, MMU with 8-entry TLB) alongside an independent 32-bit RISC communications processor (CP) that offloads serial protocol handling via 20 SDMA channels and 8-Kbyte dual-port RAM. Its CPM supports seven serial interfaces: one SCC (Ethernet/HDLC), one USB, two SMCs, one SPI, and one I²C.

It features dynamic bus sizing (8/16/32-bit), full static operation (0–50 MHz), 3.3-V core I/O with 5-V tolerant GPIO, four programmable baud-rate generators, time-slot assigner for TDM multiplexing, and five low-power modes (Doze, Sleep, Deep Sleep, Low-power Stop) managed by the system integration unit (SIU).

Key Specifications

Pinout & Package

Package: 352-ball PBGA (Plastic Ball Grid Array), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC850CVR50BU, MPC850DEVR50BU adds a second SCC at the cost of increased pin count and layout revision, while MPC860PZQ50B trades USB connectivity for higher packet-processing bandwidth and QUICC Engine offload - neither is pin-compatible, requiring schematic and layout updates.

Availability

MPC850CVR50BU is available at Aetrix Electronics and suitable for DSLAM line cards, industrial RTUs, VoIP edge gateways, and telecom network management cards requiring stable component supply across extended product lifecycles.

Supply support for MPC850CVR50BU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.

The MPC850 family was developed as the foundational PowerQUICC™ platform for cost-optimized communications processors targeting remote-access concentrators, DSL equipment, and telecom infrastructure edge nodes.

FAQ

What is the maximum supported bus frequency for MPC850CVR50BU?

The MPC850CVR50BU supports a maximum bus frequency of 50 MHz. When operated at higher core frequencies (e.g., 66 MHz or 80 MHz), it must be configured in half-speed bus mode - meaning the external bus runs at 33 MHz or 40 MHz respectively. This constraint is enforced by internal timing logic and documented in the bus signal timing tables of the MPC850EC Rev. 2 specification.

Does MPC850CVR50BU support USB device mode?

Yes, MPC850CVR50BU supports both USB host and slave (device) modes at full-speed (12 Mbps) and low-speed (1.5 Mbps). The USB controller integrates PHY-level signaling and endpoint management, enabling direct connection to keyboards, flash drives, or host PCs without external transceivers - confirmed in Section 2 Features and Table 1 functionality matrix of the MPC850 hardware spec.

What package type and ball count does MPC850CVR50BU use?

MPC850CVR50BU uses a 352-ball plastic ball grid array (PBGA) package with 27 mm × 27 mm body size and 1.27 mm ball pitch. This package is specified in Section 9 "Mechanical Data and Ordering Information" of the MPC850EC Rev. 2 document and is compatible with standard PBGA reflow profiles and IPC-7351B land patterns.

Can MPC850CVR50BU operate with mixed 3.3-V and 2.2-V supplies?

Yes - MPC850CVR50BU supports dynamic voltage scaling: at frequencies ≤25 MHz, internal logic can operate at 2.2 V (VDDH/VDDL) while I/O remains at 3.3 V. This dual-voltage mode reduces dynamic power consumption by ~35% versus full 3.3-V operation, as validated in the Power Considerations section (Section 5) and Electrical Characteristics (Table 5) of the MPC850EC Rev. 2 datasheet.

Is MPC850CVR50BU pin-compatible with other MPC850 family members?

No - MPC850CVR50BU is not pin-compatible with MPC850DEVR50BU, MPC850SR, or MPC850DSL variants. Differences in SCC count, ATM support, and USB configuration result in distinct pin assignments and ball maps. The MPC850 Functionality Matrix (Table 1) and mechanical drawings confirm unique package mappings per variant.