NXP Semiconductors MPC850CZQ50BU

Overview

MPC850CZQ50BU from Freescale Semiconductor is a PowerQUICC™ integrated communications processor combining an embedded 32-bit MPC8xx core with a dedicated RISC communications processor (CP), 8-Kbyte dual-port RAM, one Ethernet-capable SCC, USB 1.1 controller, two SMCs, SPI, I²C, and PCMCIA-ATA interface - designed for cost-sensitive remote-access and telecommunications equipment operating at up to 50 MHz bus speed.

For engineers reviewing the MPC850CZQ50BU datasheet, MPC850CZQ50BU pinout, MPC850CZQ50BU application, or MPC850CZQ50BU equivalent, this page delivers verified technical context, package mapping, timing-critical specifications, and real-world deployment guidance for embedded networking controller design.

Technical Context

The MPC850CZQ50BU implements a dual-processor architecture: a single-issue PowerPC-compatible MPC8xx core (2-Kbyte I-cache, 1-Kbyte D-cache, MMU with 8-entry TLB) handles system control, while a separate 32-bit Harvard-architecture communications processor (CP) offloads serial protocol processing across seven channels - including one SCC supporting IEEE 802.3 10-Mbps Ethernet, HDLC/SDLC, UART, and transparent modes.

It integrates a programmable memory controller supporting DRAM, SDRAM, SRAM, and flash; a system interface unit with JTAG debug, RTC, watchdog, and clock synthesizer; and low-power modes (Doze, Sleep, Deep Sleep) enabled by dynamic voltage scaling between 2.2 V (≤25 MHz) and 3.3 V operation - all in a 352-ball PBGA package compliant with JEDEC MO-205AC.

Key Specifications

Pinout & Package

Package: 352-ball plastic ball grid array (PBGA), 27 mm × 27 mm body, 1.27 mm ball pitch, JEDEC MO-205AC compliant, RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC850DEZQ50B, MPC850CZQ50BU saves board space and BOM cost where single-Ethernet suffices; versus MPC860TZQ50B, it trades PCI expandability for USB connectivity and lower power - ideal for compact, cost-sensitive edge devices.

Availability

MPC850CZQ50BU is available at Aetrix Electronics and suitable for DSL modems, remote access servers, industrial protocol gateways, and legacy network bridges requiring stable component supply across extended product lifecycles.

Supply support for MPC850CZQ50BU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC850 family was engineered as a cost-optimized PowerQUICC™ platform for entry-level communications infrastructure - prioritizing integration density, protocol offload efficiency, and low-power operation in space-constrained remote-access equipment.

FAQ

What is the maximum supported bus frequency for MPC850CZQ50BU?

The MPC850CZQ50BU supports a maximum bus frequency of 50 MHz. When operated at higher core frequencies (e.g., 50 MHz), the bus must be configured in half-speed mode (25 MHz effective) per Freescale's hardware specification. This constraint is enforced by internal timing logic and documented in Table 6 of the MPC850EC Rev. 2 datasheet. Operating above 50 MHz bus speed violates AC timing limits and risks data corruption.

Does MPC850CZQ50BU support USB host mode?

Yes, the MPC850CZQ50BU includes a full-speed USB 1.1 controller supporting both host and peripheral (slave) modes at 1.5 Mbps and 12 Mbps. Its USB PHY interface uses differential pairs (USBRXP/USBRXN and USBTXP/USBTXN) and requires external 1.5-kΩ pull-up resistors on D+ or D− depending on device role. This capability is confirmed in Section 2 ("Features") and Table 1 of the MPC850EC Rev. 2 documentation.

What package type and dimensions does MPC850CZQ50BU use?

MPC850CZQ50BU uses a 352-ball plastic ball grid array (PBGA) package per JEDEC MO-205AC standard, measuring 27 mm × 27 mm with 1.27 mm ball pitch. It features RoHS-compliant lead-free solder finish and thermal vias compatible with standard PCB reflow profiles. Mechanical data is specified in Section 9 ("Mechanical Data and Ordering Information") of the MPC850EC Rev. 2 datasheet.

How does the communications processor (CP) in MPC850CZQ50BU reduce CPU load?

The CP in MPC850CZQ50BU is a dedicated 32-bit RISC processor that executes protocol-specific microcode for SCC, SMC, USB, and SPI peripherals - handling frame assembly/disassembly, CRC generation, and buffer management autonomously. This offloads ~70% of serial I/O processing from the main MPC8xx core, as validated by Freescale's PowerQUICC™ benchmark reports and confirmed in Figure 1 and Section 2 of the MPC850EC Rev. 2 spec.

Is MPC850CZQ50BU pin-compatible with other MPC850 variants like MPC850DEZQ50B?

Yes, MPC850CZQ50BU is pin-compatible with MPC850DEZQ50B and other members of the MPC850 family sharing the 352-ball PBGA package (e.g., MPC850SR, MPC850DSL). All share identical mechanical footprint, power pin mapping, and bus signal assignments. Functional differences (e.g., number of SCCs) are implemented internally and do not affect PCB layout - confirmed in Table 1 and Section 9 of the MPC850EC Rev. 2 datasheet.