NXP Semiconductors MPC850DEZQ50BU

Overview

MPC850DEZQ50BU from Freescale Semiconductor is a PowerQUICC™ integrated communications processor combining a 32-bit MPC8xx core with a dedicated RISC communications processor (CP), dual-port RAM (8 KB), two Ethernet-capable serial communications controllers (SCCs), USB 1.1 host/slave controller, and PCMCIA-ATA interface - designed for cost-sensitive remote-access and telecom edge devices operating at up to 50 MHz.

For engineers reviewing the MPC850DEZQ50BU datasheet, MPC850DEZQ50BU pinout, MPC850DEZQ50BU application, or MPC850DEZQ50BU equivalent, key selection criteria include its dual-SCC Ethernet support, 3.3 V/5 V-tolerant I/O, BGA-352 package thermal performance (θJA = 31 °C/W), and compatibility with legacy MPC860-based designs requiring USB and enhanced CPM functionality.

Technical Context

The MPC850DEZQ50BU implements a Harvard-architecture embedded MPC8xx core (2 KB instruction cache, 1 KB data cache) alongside an independent 32-bit RISC communications processor (CP) that offloads serial protocol handling-including IEEE 802.3 Ethernet, HDLC, UART, and USB-via 20 SDMA channels and 8 KB dual-port RAM. Its memory controller supports DRAM, SDRAM, SRAM, and flash across eight banks with programmable block sizes (32 KB–256 MB).

It integrates a system interface unit (SIU) with JTAG debug, real-time clock, watchdog, and clock synthesizer; four baud-rate generators; time-slot assigner for TDM multiplexing; and low-power modes (Doze, Sleep, Deep Sleep) enabling operation from 0–50 MHz with dynamic voltage scaling (2.2 V @ ≤25 MHz, 3.3 V @ ≥40 MHz).

Key Specifications

Pinout & Package

The MPC850DEZQ50BU is housed in a 352-ball plastic ball grid array (PBGA) package with 27 mm × 27 mm footprint and 1.27 mm ball pitch. Thermal vias and multilayer PCB layout are required to meet θJA = 31 °C/W specification under 1 W load.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC850DEZQ50BU, MPC860PZQ50B omits USB and dual-SCC functionality but offers lower cost and proven maturity in legacy telecom systems, while MPC850SRZQ50B extends capabilities with ATM support at the expense of increased thermal budget and design complexity.

Availability

MPC850DEZQ50BU is available at Aetrix Electronics and suitable for DSL termination units, industrial protocol gateways, remote access concentrators, and secure wireless bridges requiring stable component supply across extended lifecycle programs.

Supply support for MPC850DEZQ50BU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors and analog/mixed-signal ICs for automotive, networking, and industrial markets.

The MPC850 family was developed as a cost-optimized evolution of the MPC860, targeting entry-level communications infrastructure with added USB, larger dual-port RAM, and enhanced CPM microcode - specifically for remote-access, DSL, and Ethernet edge applications.

FAQ

What is the maximum supported bus frequency for the MPC850DEZQ50BU?

The MPC850DEZQ50BU supports a maximum bus frequency of 50 MHz. When operated at higher CPU frequencies (e.g., 66 MHz or 80 MHz), it must be configured in half-speed bus mode - meaning a 66 MHz part uses a 33 MHz bus clock. This constraint is enforced by internal timing logic and documented in Table 6 of the hardware specifications.

Does the MPC850DEZQ50BU support USB device mode?

Yes, the MPC850DEZQ50BU includes a full-speed (12 Mbps) and low-speed (1.5 Mbps) USB 1.1 controller that supports both host and peripheral (device) modes. Pin assignments such as USBRXP, USBTXP, and USBRXD are dedicated to the transceiver, and microcode in the CPM handles enumeration and endpoint management without CPU intervention.

What package type and thermal characteristics apply to the MPC850DEZQ50BU?

The MPC850DEZQ50BU uses a 352-ball PBGA package (27 mm × 27 mm, 1.27 mm pitch). Its thermal resistance is specified as θJA = 31 °C/W under natural convection on a multilayer board with thermal vias and 1 W power dissipation - a value confirmed in Table 3 of the Freescale hardware specification document.

How many serial communication controllers (SCCs) does the MPC850DEZQ50BU integrate?

The MPC850DEZQ50BU integrates two serial communications controllers (SCCs), as confirmed in Table 1 ("MPC850DE" row) and Section 2 ("Features") of the Freescale hardware specification. Each SCC supports Ethernet, HDLC, UART, and transparent protocols - distinguishing it from the base MPC850 (one SCC) and enabling dual-port networking applications.

Is the MPC850DEZQ50BU pin-compatible with other MPC850 family members?

The MPC850DEZQ50BU shares the same 352-ball PBGA package and pinout with other MPC850 variants including MPC850SRZQ50B and MPC850DSLZQ50B, as verified in Freescale's mechanical data section (Document Number: MPC850EC, Rev. 2, Section 9). Signal mapping and power/ground ball locations are identical across the ZQ50B suffix family.