NXP Semiconductors MPC850DSLCVR50BU

Overview

MPC850DSLCVR50BU from NXP (formerly Freescale) is a PowerQUICC™ integrated communications processor combining an embedded 32-bit MPC8xx core with a dedicated RISC communications processor (CP), dual-port RAM, Ethernet/ATM-capable SCCs, USB 1.1 controller, and PCMCIA-ATA interface - designed for DSL access multiplexers, remote terminal units, and cost-sensitive telecom edge equipment operating at up to 50 MHz.

For engineers reviewing the MPC850DSLCVR50BU datasheet, MPC850DSLCVR50BU pinout, MPC850DSLCVR50BU application, or MPC850DSLCVR50BU equivalent, key selection factors include its dual SCC support for ATM/HDLC/Ethernet, 8-Kbyte dual-port RAM allocation, 3.3-V core I/O with 5-V tolerant pins, BGA-352 package thermal profile, and CPM-based offload architecture enabling deterministic real-time serial protocol handling without CPU intervention.

Technical Context

The MPC850DSLCVR50BU implements a Harvard-architecture 32-bit MPC8xx core (PowerPC v.2.03) with 2-Kbyte instruction cache and 1-Kbyte data cache, MMU with 8-entry TLB, and branch prediction - paired with a separate 32-bit RISC communications processor (CP) executing microcode in on-chip ROM to manage up to seven serial channels. Its CPM handles protocol framing, CRC generation, DMA transfers, and time-slot assignment independently of the main core.

It integrates two serial communications controllers (SCCs) supporting IEEE 802.3 10-Mbps Ethernet, ATM UTOPIA Level 1, HDLC/SDLC (2 Mbps), PPP, and transparent bit-stream modes; one USB 1.1 controller (host/slave, 1.5/12 Mbps); two SMCs; one SPI; one I²C port; and a time-slot assigner for TDM multiplexing across SCC/SMC channels - all coordinated via 8-Kbyte dual-port RAM shared between core and CP.

Key Specifications

Pinout & Package

Package: 352-ball Plastic Ball Grid Array (PBGA), 19 mm × 19 mm, 1.27 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil opening and ground plane connection per AN-1231/D layout guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC850SRVR50BU, the MPC850DSLCVR50BU omits UTOPIA but retains full ATM cell processing in microcode - making it optimal for DSLAMs where physical layer is handled externally. Against MPC860PZQ50B, it trades PCI bandwidth and RAM size for lower power, smaller footprint, and integrated USB - better matching cost-constrained remote access nodes.

Availability

MPC850DSLCVR50BU is available at Aetrix Electronics and suitable for DSL access multiplexers, industrial RTUs, telecom edge routers, and VoIP gateway control cards requiring stable component supply across extended product lifecycles.

Supply support for MPC850DSLCVR50BU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture® processors.

The MPC850 family was developed by Freescale as part of the PowerQUICC™ platform to deliver integrated communications processing for cost-sensitive, high-reliability telecom infrastructure - specifically targeting DSL, remote access, and industrial protocol gateway use cases.

FAQ

What is the maximum supported bus frequency for the MPC850DSLCVR50BU?

The MPC850DSLCVR50BU supports a maximum bus frequency of 50 MHz in native mode. When operated at core frequencies above 50 MHz (e.g., 66 MHz or 80 MHz), it must be configured in half-speed bus mode - resulting in a 33 MHz or 40 MHz bus clock respectively - as specified in Section 6 of the MPC850EC Rev. 2 datasheet. This constraint ensures timing compliance for memory and peripheral interfaces.

Does the MPC850DSLCVR50BU support USB device mode?

Yes, the MPC850DSLCVR50BU includes a full-featured USB 1.1 controller that supports both host and slave (device) modes at 1.5 Mbps (low-speed) and 12 Mbps (full-speed). The USB interface is implemented in the CPM and uses dedicated endpoints with programmable descriptors - enabling direct connection to USB peripherals such as modems, flash drives, or configuration dongles without external transceivers.

How does the CPM in the MPC850DSLCVR50BU reduce CPU load during serial communication?

The CPM in the MPC850DSLCVR50BU contains a dedicated 32-bit RISC communications processor (CP) that executes protocol-specific microcode independently of the main MPC8xx core. It handles frame assembly/disassembly, CRC calculation, DMA transfers, and buffer descriptor management for all serial channels - allowing the main CPU to remain free for application-layer tasks while maintaining deterministic real-time response for Ethernet, HDLC, or ATM traffic on the MPC850DSLCVR50BU.

What package type and thermal characteristics apply to the MPC850DSLCVR50BU?

The MPC850DSLCVR50BU is packaged in a 352-ball PBGA (19 mm × 19 mm, 1.27 mm pitch) with exposed thermal pad. Its thermal resistance is θJA = 31°C/W under natural convection on a multilayer board with thermal vias and 1 W dissipation - per Table 3 of MPC850EC Rev. 2. Junction temperature must not exceed 95°C (standard grade), requiring adequate PCB copper area and airflow in sealed enclosures.

Can the MPC850DSLCVR50BU operate with mixed voltage I/O (e.g., 5-V peripherals)?

Yes, the MPC850DSLCVR50BU features 5-V tolerant general-purpose I/O pins (VIH up to 5.5 V), enabling direct interfacing with legacy 5-V peripherals such as RS-232 transceivers or industrial sensors without level shifters. However, absolute input voltage must not exceed VDDH + 2.5 V - so 3.3-V supply operation requires limiting 5-V signals to ≤5.8 V, and unused inputs must be pulled to VCC or GND to prevent floating states.