NXP Semiconductors MPC8540PX667LC
- Part No.:
- MPC8540PX667LC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 783-BFBGA, FCBGA
- Datasheet:
-
MPC8540PX667LC.pdf
- Description:
- IC MPU MPC85XX 667MHZ 783FCPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MPC8540PX667LC from Freescale Semiconductor is a PowerQUICC III integrated host processor featuring a 667 MHz e500 Power Architecture core, 256 KB configurable L2 cache/SRAM, dual 10/100/1000 Mbps TSEC Ethernet controllers, DDR SDRAM controller (up to 333 MHz), PCI/PCI-X (64-bit @ 133 MHz), RapidIO (8-bit DDR), and OCeaN packet switch - deployed in telecom infrastructure line cards and wireless baseband processing units.
For engineers reviewing the MPC8540PX667LC datasheet, MPC8540PX667LC pinout, MPC8540PX667LC application, or MPC8540PX667LC equivalent, key selection criteria include its 667 MHz core frequency, 256 KB L2 cache configuration flexibility, DDR-1 support with full ECC, dual TSECs with RGMII/GMII/TBI interfaces, and 783-pin FC-PBGA package with 1.2 V core / 2.5–3.3 V I/O voltage domains.
Technical Context
The MPC8540PX667LC implements the Book E–enhanced e500 core with separate 32 KB L1 instruction and data caches (parity protected), MMU optimized for embedded real-time OS environments, and performance monitor facility supporting eight 32-bit event counters. Its memory subsystem integrates an ATMU with eight local access windows and dual-directional mapping for PCI/PCI-X and RapidIO address translation.
System-level interconnect combines a 16 Gb/s OCeaN crossbar switch, four-channel DMA engine with scatter-gather and misaligned transfer support, and coherency-enforced snoop/no-snoop control per channel. The DDR controller supports registered DIMMs, page mode (16 open pages), auto-refresh, and CKE-driven power management - all compliant with JEDEC DDR-1 SDRAM standards at 333 MHz data rate.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 667 MHz - fixed speed grade defining maximum sustained instruction throughput and thermal envelope. |
| L1 Cache | 32 KB instruction + 32 KB data, parity-protected - enables deterministic interrupt latency and cache locking for critical code/data sections. |
| L2 Resource | 256 KB configurable as full cache, full SRAM, or 128 KB each - supports real-time buffer allocation or deterministic memory-mapped I/O regions. |
| DDR Interface | 64-bit, up to 333 MHz, full ECC on 64-bit boundary - ensures data integrity in telecom control plane applications with uncorrectable error detection. |
| TSEC Count | 2 × IEEE 802.3z/ab-compliant controllers - provides redundant or segregated data/control plane connectivity with RGMII/GMII/TBI PHY interface options. |
| RapidIO | 8-bit DDR, 125 MHz clock, LVDS signaling - delivers low-latency, packet-switched inter-processor communication for distributed baseband processing. |
| PCI/PCI-X | 64-bit, up to 133 MHz (PCI-X 1.0), host/agent mode - enables legacy backplane integration with high-bandwidth peripheral bridging. |
| Package | 783-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA) - supports high I/O density and thermal dissipation in conduction-cooled telecom modules. |
Pinout & Package
Package: 783-pin FC-PBGA (27 mm × 27 mm, 1.27 mm pitch), RoHS-compliant, lead-free solder compatible, designed for industrial temperature range (–40°C to +105°C junction).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD[0:15] | Core power supply | 16 dedicated 1.2 V inputs for e500 core and L1/L2 cache logic - requires tight regulation (±60 mV) and low-noise decoupling. |
| GVDD[0:7] | DDR I/O supply | 8 × 2.5 V pins for DDR data/address/command drivers - must track DRAM GVDD within ±50 mV and share common MVREF reference. |
| LVDD[0:3] | TSEC I/O supply | 4 × 2.5 V or 3.3 V pins for Gigabit Ethernet transceivers - selectable per PHY interface standard (RGMII vs GMII) and voltage tolerance. |
| OVDD[0:19] | General-purpose I/O supply | 20 × 3.3 V pins powering PCI, Local Bus, RapidIO, DUART, JTAG, and I²C interfaces - supports mixed-voltage board design with independent rail sequencing. |
| SYSCLK | System clock input | Differential-capable single-ended 166 MHz max reference - drives CCB bus and synchronizes PLL ratio generation for core/DDR/PCI clocks. |
| HRESET | Hard reset input | Asynchronous active-low signal requiring ≥100 μs assertion - initiates full hardware initialization including PLL/DLL lock, cache flush, and boot sequencer activation. |
Key Features
| Feature | Design Value |
|---|---|
| e500 Core Locking | Per-line or full L1 instruction/data cache locking via Book E instructions - guarantees worst-case execution time for safety-critical firmware routines. |
| L2 Configuration Flexibility | Runtime-selectable modes: 256 KB cache, 256 KB SRAM, or split 128 KB each - enables dynamic trade-off between instruction throughput and deterministic buffer memory. |
| DDR ECC Protection | Full 64-bit boundary ECC with SEC-DED correction - prevents silent data corruption in control-plane memory used for routing tables and session state. |
| TSEC Buffer Descriptor Compatibility | Backward-compatible with MPC8260/MPC860T programming model - simplifies migration of legacy network stack drivers and reduces validation effort. |
| RapidIO Atomic Operations | Hardware-accelerated increment/decrement/set/clear on message payloads - eliminates software synchronization overhead in multi-processor shared-memory messaging. |
| OCeaN Packet Switch | Four-port crossbar with priority-based reordering and starvation avoidance - ensures bounded latency for time-sensitive traffic across internal fabric links. |
Applications
| Wireless Baseband Processing | Telecom Line Card Control |
|---|---|
Use Scenario: Real-time processing of LTE/UMTS physical layer signals in macrocell BTS baseband units. IC Role / Device Role / Timing Role: Primary host processor managing DSP offload, RF calibration data exchange, and Layer 2 protocol stack execution. Use Value: 667 MHz e500 core + dual TSECs enable concurrent CPRI fronthaul and backhaul traffic handling while L2 SRAM mode buffers bursty IQ samples. | Use Scenario: Embedded control unit in carrier-grade Ethernet switching line cards requiring redundancy and service assurance. IC Role / Device Role / Timing Role: System controller interfacing with packet ASICs via RapidIO and managing out-of-band management via 10/100 FEC. Use Value: OCeaN switch fabric routes control messages between ASICs with sub-100 ns latency; DDR ECC prevents configuration corruption during failover events. |
| Industrial Protocol Gateway | Secure Network Appliance |
Use Scenario: Fieldbus-to-Ethernet gateway aggregating Modbus TCP and PROFINET traffic in factory automation systems. IC Role / Device Role / Timing Role: Dual-role processor executing real-time PLC logic and Linux-based network stack with hardware-accelerated packet forwarding. Use Value: Local Bus controller interfaces legacy parallel/serial peripherals; PCI-X connects encryption co-processor for TLS offload without CPU intervention. | Use Scenario: Firewall/NAC appliance performing deep packet inspection and policy enforcement at 1 Gbps line rate. IC Role / Device Role / Timing Role: Host processor orchestrating flow classification, signature matching, and session state tracking across multiple security engines. Use Value: 256 KB L2 cache configured for full caching minimizes memory stalls during pattern-matching workloads; TSEC RMON statistics feed real-time threat analytics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated host processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548ECVRAG | 1.0 GHz e500 core, 512 KB L2 cache, DDR2 support, same 783-pin FC-PBGA package | Higher compute density for next-gen LTE-A baseband; requires DDR2 memory redesign and updated thermal solution | Select when >667 MHz core performance and DDR2 bandwidth are required; verify PCB layout compatibility with identical pinout but higher power delivery demands. |
| P1022NSE | Power Architecture e500v2 core, 800 MHz, dual 1 GbE, PCIe instead of PCI-X, 689-pin PBGA | PCI Express endpoint capability replaces PCI-X; lower power profile but different pin assignment and boot architecture | Choose for new designs prioritizing PCIe ecosystem compatibility and reduced thermal footprint; not drop-in due to package and interface differences. |
Compared with MPC8540PX667LC, MPC8548ECVRAG offers higher clock speed and DDR2 readiness for bandwidth-intensive upgrades, while P1022NSE shifts to PCIe and e500v2 for improved IPC and lower static power - both require board-level redesign but provide scalable paths beyond the MPC8540's DDR-1/PCI-X constraints.
Availability
MPC8540PX667LC is available at Aetrix Electronics and suitable for wireless infrastructure, telecom line card development, and industrial protocol gateway applications requiring stable component supply across extended product lifecycles.
Supply support for MPC8540PX667LC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MPC8540PX667LC belongs to the PowerQUICC III family - engineered specifically for carrier-grade communications infrastructure where deterministic real-time processing, multi-standard connectivity (RapidIO/PCI-X/TSEC), and hardware-assisted reliability (ECC, cache locking) are mandatory.
FAQ
What is the maximum DDR SDRAM data rate supported by the MPC8540PX667LC?
The MPC8540PX667LC supports DDR-1 SDRAM at up to 333 MHz data rate (166 MHz clock), delivering 2.7 GB/s peak bandwidth over its 64-bit interface. This is confirmed in Section 6 of the Hardware Specifications document, which specifies programmable timing for DDR-1, four-bank support, and registered DIMM compatibility - all operating within the 2.5 V ±125 mV GVDD supply range.
Does the MPC8540PX667LC support PCI Express?
No, the MPC8540PX667LC does not support PCI Express. It implements a PCI 2.2 and PCI-X 1.0 compliant controller with 64-bit bus width and up to 133 MHz operation. PCI Express capability was introduced in later PowerQUICC generations such as the QorIQ P1/P2 series. The MPC8540PX667LC's PCI/PCI-X interface remains fully functional for legacy backplane and add-in card integration.
What are the core and I/O voltage requirements for the MPC8540PX667LC?
The MPC8540PX667LC requires a 1.2 V ±60 mV core supply (VDD) and separate I/O supplies: 2.5 V ±125 mV for DDR (GVDD), 2.5 V or 3.3 V ±165 mV for TSEC (LVDD), and 3.3 V ±165 mV for PCI/Local Bus/RapidIO/JTAG (OVDD). Power sequencing mandates VDD/AVDD ramp before I/O supplies to prevent undefined I/O states during startup.
Can the L2 memory on the MPC8540PX667LC be used as both cache and SRAM simultaneously?
Yes, the MPC8540PX667LC's 256 KB L2 resource can be partitioned into 128 KB cache and 128 KB memory-mapped SRAM. This mode is explicitly documented in Section 1.1 "Key Features" of the Hardware Specifications, enabling simultaneous use for instruction/data caching and deterministic buffer allocation - critical for real-time packet buffering in telecom control plane applications.
Is the MPC8540PX667LC pin-compatible with other MPC8540 speed grades?
Yes, the MPC8540PX667LC shares the identical 783-pin FC-PBGA package and pinout with other MPC8540 variants (e.g., MPC8540VX800LC, MPC8540EC), differing only in speed grade, thermal specification, and factory-programmed PLL ratios. Pin compatibility is confirmed in Section 14 "Package and Pin Listings" of the Hardware Specifications, allowing drop-in replacement within the same package variant for frequency-scaling or qualification upgrades.
MPC8540PX667LC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 783-BFBGA, FCBGA
- Series:
- MPC85xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 667MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (1), 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 783-FCPBGA (29x29)
- Additional Interfaces:
- DUART, I2C, PCI, RapidIO
MPC8540PX667LC FAQ
1.How can I place an order for MPC8540PX667LC through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8540PX667LC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8540PX667LC reliable?
The price and inventory of MPC8540PX667LC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8540PX667LC is usually 5 days.
3.What payment methods are accepted for MPC8540PX667LC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8540PX667LC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8540PX667LC?
MPC8540PX667LC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8540PX667LC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8540PX667LC?
For technical support, including MPC8540PX667LC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8540PX667LC requirements.
6.How does Aetrix verify that MPC8540PX667LC is sourced from the original manufacturer or authorized distributors?
All MPC8540PX667LC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8540PX667LC meets industry standards.
7.What is the process for return or replacement of MPC8540PX667LC?
All MPC8540PX667LC units undergo pre-shipment inspection (PSI). If there is an issue with MPC8540PX667LC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8540PX667LC part is unused and in its original packaging.
Return procedure for MPC8540PX667LC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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