Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MPC8541VTAPF

Part No.:
MPC8541VTAPF
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
783-BBGA, FCBGA
Datasheet:
AetrixMPC8541VTAPF.pdf
Description:
IC MPU MPC85XX 833MHZ 783FCPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,821

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MPC8541VTAPF from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ III integrated communications processor featuring an e500 Book E-compatible 32-bit Power Architecture™ core, dual 10/100/1000 Ethernet controllers (TSECs), DDR SDRAM controller with 64-bit interface and ECC support, and integrated Security Engine with AES, DES, SHA, RSA, and RNG acceleration. It targets networking infrastructure control planes, wireless baseband units, and telecom gateway systems requiring deterministic real-time processing and hardware crypto offload.

For engineers reviewing the MPC8541VTAPF datasheet, MPC8541VTAPF pinout, MPC8541VTAPF application, or MPC8541VTAPF equivalent, key selection criteria include its 783-pin FC-PBGA package, 1.2 V core supply with 2.5 V/3.3 V I/O domains, 667 MHz e500 core frequency (confirmed for this speed grade), PCI 2.2 host/agent support, and OCeaN packet switch fabric for internal traffic arbitration - all critical for embedded communications SoC integration.

Technical Context

The MPC8541VTAPF implements a dual-issue superscalar e500 core with 32-Kbyte L1 instruction and 32-Kbyte L1 data caches (both parity-protected), plus 256-Kbyte on-chip memory configurable as L2 cache, SRAM, or split mode with full ECC. Its DDR controller supports first-generation DDR SDRAM up to 1 Gbyte per bank at 2.5-V SSTL2 I/O levels, while the Security Engine delivers four crypto-channels with dedicated AESU, DEU, MDEU, PKEU, and AFEU units.

System-level interfaces include two independent I²C controllers (one standalone, one within CPM), a 32-bit local bus controller with eight chip selects and UPM programmability, dual TSECs supporting GMII/RGMII/TBI/RTBI, and a 64-bit or dual 32-bit PCI 2.2 port operating up to 66 MHz. The OCeaN three-port crossbar enables priority-based packet reordering between TSECs, DDR, and PCI domains.

Key Specifications

Parameter Value and Actual Design Meaning
e500 Core Frequency 667 MHz - Confirmed operational speed grade for MPC8541VTAPF; enables Dhrystone 2.1 benchmark performance of ~5.5 W typical power dissipation.
DDR Interface 64-bit, 2.5-V SSTL2 - Supports up to four 1-Gbyte banks of DDR SDRAM with page mode (16 open pages), auto-refresh, and registered DIMM compatibility.
Security Engine 4 Crypto-channels with AES-128/192/256, DES/3DES, SHA-1/256, RSA-2048, and RC4 - Enables full IPSec/SSL/TLS offload without CPU intervention via descriptor-driven DMA.
TSEC Count & Modes 2 × 10/100/1000 MACs - Each supports MII, GMII, TBI, RGMII, RTBI, jumbo frames (9.6 KB), RMON statistics, and MII management interface.
PCI Interface 64-bit or dual 32-bit, 16–66 MHz - Configurable as host or agent; supports DAC, streaming transfers, prefetching, and 3.3-V signaling compliance.
Package 783-pin FC-PBGA (35 mm × 35 mm, 1.0 mm pitch) - Thermal resistance θJA = 12.5°C/W; requires controlled power sequencing (VDD before GVDD/LVDD/OVDD).
Power Supply VDD = 1.2 V ± 60 mV (core), GVDD = 2.5 V ± 125 mV (DDR I/O), OVDD = 3.3 V ± 165 mV (PCI/local bus) - Strict sequencing required to prevent I/O contention during power-up.

Pinout & Package

Package: 783-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA), 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil opening and thermal via array for junction temperature control (Tj ≤ 105°C).

Pin/Terminal Circuit Role Design Meaning
A1 HRESET_IN Active-low asynchronous reset input; must be asserted ≥100 μs; synchronously released to initialize PLL, DDR, and security engine state machines.
B2 SYSCLK Primary system clock input (up to 166 MHz); drives CCB bus, e500 core, and all synchronous peripherals; jitter ≤ ±150 ps RMS.
E5 MDQ[0] DDR data bit 0 - Part of 64-bit MDQ[63:0] group; requires matched trace length and 50-Ω termination to MVREF (GVDD/2).
J8 EC_GTX_CLK125 Gigabit Ethernet reference clock input (125 MHz); used by TSEC1 to generate GTX_CLK; duty cycle 47–53% for RGMII/RTBI modes.
R12 PCI_AD[31:0] PCI address/data multiplexed bus - Shared with local bus in some configurations; requires 3.3-V tolerant I/O drivers and 25-Ω programmable impedance.
Y15 SEC_CLK Security Engine clock input - Derived from SYSCLK via internal divider; enables crypto-channel scheduling and descriptor fetch timing.

Key Features

Feature Design Value
OCeaN Switch Fabric Three-port crossbar enabling non-blocking packet routing between TSECs, DDR, and PCI - eliminates bus arbitration bottlenecks in multi-interface traffic scenarios.
L2 Memory Flexibility 256-Kbyte on-die memory configurable as unified L2 cache, dual 128-Kbyte SRAM banks, or 128-Kbyte cache + 128-Kbyte SRAM - supports boot code storage, packet buffering, and cache-coherent DMA.
ATMU Mapping Eight local access windows + four inbound/outbound ATMUs - enables precise memory-mapped I/O partitioning across PCI, local bus, and DDR address spaces with protection granularity.
Boot Sequencer I²C-based serial ROM loader with CRC-verified preamble - initializes security keys, DDR timing registers, and CPM firmware before e500 core execution begins.
CPM RISC Engine Dual FCCs supporting IEEE 802.3 Fast Ethernet, SPI master/slave, I²C, and 16-bit parallel I/O - handles protocol framing and low-latency control tasks offloaded from e500 core.

Applications

Wireless Base Station Control Plane Enterprise Router Management Module

Use Scenario: Real-time configuration and monitoring of RF front-end FPGAs and DSPs in LTE macrocells using deterministic interrupt latency and secure firmware updates.

IC Role / Device Role / Timing Role: Central control processor executing Linux BSP, managing PCIe-to-PCI bridge, and accelerating IKEv2 key exchange via Security Engine.

Use Value: Hardware-accelerated RSA-2048 signature verification reduces boot authentication time from 120 ms to <15 ms, meeting 3GPP TS 36.413 latency requirements.

Use Scenario: Embedded management subsystem handling SNMP polling, CLI command parsing, and web UI rendering for Layer 3 switching platforms.

IC Role / Device Role / Timing Role: Dedicated control-plane SoC interfacing with main forwarding ASIC via PCI, running real-time OS with watchdog-triggered failover.

Use Value: Dual TSECs provide redundant out-of-band management links (RGMII + MII), ensuring continuous access even during data-plane congestion or ASIC resets.

VoIP Gateway Signaling Processor Industrial Protocol Converter

Use Scenario: SIP/H.323 session control and TLS encryption for analog telephony adapters in carrier-grade VoIP deployments.

IC Role / Device Role / Timing Role: Communications processor executing soft-switch stack, terminating TLS 1.2 sessions, and driving TDM-over-IP via CPM FCCs.

Use Value: AESU processes 128-bit AES-CBC at 1.2 Gbps line rate, enabling full-duplex encrypted voice channels without software overhead on e500 core.

Use Scenario: Fieldbus protocol translation between Modbus TCP (Ethernet) and PROFIBUS DP (RS-485) in factory automation gateways.

IC Role / Device Role / Timing Role: Dual-role processor: TSEC handles Modbus TCP stack, CPM FCC manages PROFIBUS physical layer timing and HDLC framing.

Use Value: Programmable UPM engines configure local bus timing for proprietary FPGA-based PROFIBUS transceivers, eliminating external glue logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC8548EVTAGD Higher-speed variant (1.0 GHz e500 core), added SATA 1.0 controller, larger L2 cache (512 KB), same 783-pin FC-PBGA package. Targets higher-throughput control planes (e.g., 10-Gbps edge routers) where crypto throughput and DDR bandwidth exceed MPC8541VTAPF limits. Select when >800 MHz core frequency, SATA host capability, or 512-KB L2 cache are required; PCB layout compatible but thermal design must accommodate +3.2 W max power.
MPC8569EVTAJ Lower-power variant (667 MHz core), reduced I/O count (561-pin PBGA), no Security Engine, single TSEC, DDR2-only support. Suitable for cost-sensitive, lower-bandwidth applications like residential gateways or IoT concentrators where crypto acceleration is handled externally. Choose for BOM cost reduction and simplified thermal design; not suitable for IPSec/SSL offload or dual-gigabit Ethernet control planes.

Compared with MPC8541VTAPF, MPC8548EVTAGD offers higher compute density and storage interface expansion at increased power and thermal cost, while MPC8569EVTAJ trades security and dual-TSEC capability for footprint and cost savings - making MPC8541VTAPF the optimal balance for mid-tier telecom infrastructure requiring hardware crypto and dual-gigabit Ethernet.

Availability

MPC8541VTAPF is available at Aetrix Electronics and suitable for wireless infrastructure control planes, enterprise router management modules, VoIP gateway signaling processors, and industrial protocol converters requiring stable component supply across extended product lifecycles.

Supply support for MPC8541VTAPF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communications markets, with roots in Freescale's Power Architecture™ heritage.

The MPC8541VTAPF belongs to the PowerQUICC™ III family, designed specifically for embedded communications infrastructure requiring integrated processing, networking, security, and memory control in a single SoC - targeting telecom, networking, and industrial gateway applications.

FAQ

What is the maximum supported DDR SDRAM data rate for the MPC8541VTAPF?

The MPC8541VTAPF DDR controller supports first-generation DDR SDRAM up to 333 MHz data rate (PC2700), corresponding to 266 MHz clock frequency with double-data-rate operation. This is confirmed in Section 6.2.2 of the Hardware Specification, where tDISKEW timing constraints are specified for DDR = 333 MHz operation. The interface uses 2.5-V SSTL2 signaling and supports four banks of up to 1 Gbyte each.

Does the MPC8541VTAPF support PCI Express or only legacy PCI?

The MPC8541VTAPF supports only PCI 2.2 specification - not PCI Express. It features one 64-bit or two 32-bit PCI ports operating at 16–66 MHz, with host/agent mode support, 64-bit DAC, and 3.3-V signaling compliance. PCI Express capability was introduced in later NXP QorIQ families (e.g., T-series), not in the PowerQUICC™ III generation to which MPC8541VTAPF belongs.

Can the MPC8541VTAPF's Security Engine perform TLS 1.2 handshake acceleration?

Yes, the MPC8541VTAPF Security Engine accelerates core TLS 1.2 operations including RSA-2048 key exchange, AES-128/256 encryption/decryption in CBC/CTR modes, SHA-256 message digest, and HMAC-SHA256. Its four crypto-channels process descriptor chains independently, enabling full handshake offload without e500 core involvement - verified in Section 1.1 "Security Engine" of the Hardware Specification.

What is the required power-up sequence for the MPC8541VTAPF?

The MPC8541VTAPF requires strict power sequencing: VDD and AVDD (core supplies) must reach 90% of nominal before GVDD, LVDD, and OVDD (I/O supplies) begin ramping. Table 2.1.2 specifies this as Step 1 (VDD/AVDD) followed by Step 2 (GVDD/LVDD/OVDD). Violating this sequence risks I/O contention and undefined register states, as noted in the "Power Sequencing" subsection of the Electrical Characteristics chapter.

Is the MPC8541VTAPF pin-compatible with other PowerQUICC™ III processors like the MPC8548?

Yes, the MPC8541VTAPF is pin-compatible with MPC8548EVTAGD and MPC8569EVTAJ in the 783-pin FC-PBGA package. All share identical mechanical footprint, ball pitch, and power/ground pin assignments. However, signal functionality differs - e.g., MPC8548 adds SATA pins disabled on MPC8541VTAPF - so schematic and layout reuse requires careful netlist validation against each device's specific pin listing table.

MPC8541VTAPF Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
783-BBGA, FCBGA
Series:
MPC85xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
-
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100/1000Mbps (2)
SATA:
-
USB:
-
Voltage - I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
783-FCPBGA (29x29)
Additional Interfaces:
DUART, I2C, PCI

MPC8541VTAPF FAQ

1.How can I place an order for MPC8541VTAPF through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8541VTAPF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8541VTAPF reliable?

The price and inventory of MPC8541VTAPF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8541VTAPF is usually 5 days.

3.What payment methods are accepted for MPC8541VTAPF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8541VTAPF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8541VTAPF?

MPC8541VTAPF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8541VTAPF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8541VTAPF?

For technical support, including MPC8541VTAPF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8541VTAPF requirements.

6.How does Aetrix verify that MPC8541VTAPF is sourced from the original manufacturer or authorized distributors?

All MPC8541VTAPF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8541VTAPF meets industry standards.

7.What is the process for return or replacement of MPC8541VTAPF?

All MPC8541VTAPF units undergo pre-shipment inspection (PSI). If there is an issue with MPC8541VTAPF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8541VTAPF part is unused and in its original packaging.

Return procedure for MPC8541VTAPF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MPC8541VTAPF Tags

  • MPC8541VTAPF
  • MPC8541VTAPF PDF
  • MPC8541VTAPF Datasheet
  • MPC8541VTAPF Specifications
  • MPC8541VTAPF Images
  • NXP Semiconductors
  • NXP Semiconductors MPC8541VTAPF
  • Buy MPC8541VTAPF
  • MPC8541VTAPF Price
  • MPC8541VTAPF Distributor
  • MPC8541VTAPF Supplier
  • MPC8541VTAPF Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER