My Inquiry
My Account
NXP Semiconductors MPC8547EPXAQGD557
- Part No.:
- MPC8547EPXAQGD557
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 783-BBGA
- Datasheet:
-
MPC8547EPXAQGD557.pdf
- Description:
- RISC MICROPROCESSOR, CMOS
- Quantity:
- Payment:
- Shipping:
Inventory:4,812
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPC8547EPXAQGD557 from NXP Semiconductors (formerly Freescale) is a PowerQUICC III integrated communications processor featuring a 32-bit e500v2 core, 512-Kbyte on-chip L2 cache/SRAM with full ECC, dual DDR/DDR2 memory controller (64-bit, up to 16 Gbytes), and four enhanced three-speed Ethernet controllers (10/100/1000 Mbps). It targets high-throughput network edge and control-plane applications including secure routers, media gateways, and industrial communication systems.
For engineers reviewing the MPC8547EPXAQGD557 datasheet, MPC8547EPXAQGD557 pinout, MPC8547EPXAQGD557 application, or MPC8547EPXAQGD557 equivalent, key selection considerations include its 1.1 V core supply, 133 MHz local bus interface, PCI Express x8 support, integrated security engine (SEC) with AES/SHA/RSA acceleration, and SerDes-based high-speed I/O configurability between PCI Express and Serial RapidIO.
Technical Context
The MPC8547EPXAQGD557 implements the e500v2 core with 32-Kbyte L1 instruction and data caches (parity-protected), 36-bit real addressing, MMU supporting 4-Kbyte to 4-Gbyte pages, and SPE/FP APUs for signal and floating-point processing. Its memory subsystem includes a programmable DDR/DDR2 controller with on-die termination support for DDR2, auto-refresh, and battery-backed memory capability.
High-speed interconnects are implemented via two PCI/PCI-X controllers (one 32-/64-bit at up to 133 MHz, one 32-bit at 16–66 MHz), a PCI Express 1.0a interface (x1/x2/x4/x8, root/endpoint configurable), and a Serial RapidIO™ interface (1.25/2.5/3.125 Gbaud, 1×/4× LP-serial links). The device supports pin-multiplexed I/O configurations-either eight PCI Express lanes or four PCI Express plus four Serial RapidIO lanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e500v2 Power Architecture® core with 32-Kbyte L1 I/D caches, 36-bit real addressing, MMU, SPE and double-precision FP APUs |
| Max Core Frequency | 1.0 GHz - delivers Dhrystone performance suitable for real-time packet forwarding and control-plane processing |
| L2 Cache/SRAM | 512-Kbyte unified, configurable as cache or SRAM, with full ECC on 64-bit boundaries and eight-way set-associative organization |
| Memory Interface | 64-bit DDR/DDR2 SDRAM controller supporting four banks up to 4 Gbytes each (16 Gbytes total), 2.5-V SSTL_2 / 1.8-V SSTL_1.8 I/O |
| Ethernet Controllers | Four eTSECs supporting 10/100/1000 Mbps with GMII/MII/RGMII/RTBI/TBI/RMII PHY interfaces and TCP/IP offload (checksum, VLAN, QoS) |
| Security Engine | Integrated SEC with AES-128/192/256, SHA-1/256, MD5, RSA up to 2048-bit, ECC up to 511-bit, and RNG for IPSec/SSL/TLS acceleration |
| High-Speed I/O | PCI Express 1.0a (x8/x4/x2/x1), Serial RapidIO™ 1.2 (1.25/2.5/3.125 Gbaud), dual PCI/PCI-X (133 MHz 64-bit + 66 MHz 32-bit) |
| Supply Voltages | Core: 1.1 V ±55 mV; DDR2 I/O: 1.8 V ±90 mV; PCIe/RapidIO SerDes: SVDD/XVDD = 1.1 V ±55 mV |
Pinout & Package
The MPC8547EPXAQGD557 is housed in a 783-pin PBGA package (27 mm × 27 mm, 1.0 mm pitch) with thermal lid and standard JEDEC MO-251 compliance. Pin assignments are defined per functional group: core power (VDD/AVDD), I/O banks (GVDD/LVDD/OVDD/BVDD), DDR/DDR2 signals (DQ, DQS, ADDR/CMD), high-speed serial interfaces (PCIe/RapidIO differential pairs), and system control (RESET, JTAG, BOOT).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, AVDD, SVDD, XVDD | Core & SerDes power supplies | Must be ramped before GVDD during power-up; 1.1 V ±55 mV required for stable e500v2 operation and SerDes link integrity |
| GVDD, MVREF | DDR2 I/O supply & reference | GVDD = 1.8 V ±90 mV; MVREF = GVDD/2 ±1% - critical for SSTL_1.8 receiver threshold stability and timing margin |
| LVDD, TVDD | eTSEC1–2 / eTSEC3–4 I/O supplies | Configurable for 2.5 V or 3.3 V; determines MII/GMII/RGMII voltage compatibility and drive strength (45 Ω default) |
| OVDD, BVDD | PCI/PCI-X & Local Bus I/O supplies | OVDD = 3.3 V ±165 mV for PCI/JTAG/I2C; BVDD = 3.3 V or 2.5 V for 133 MHz local bus - sets timing closure and noise immunity |
| PCIE_RX[0:7]+/−, PCIE_TX[0:7]+/− | PCI Express differential lanes | Eight dedicated high-speed serial pairs supporting x8 configuration; require controlled 100-Ω differential impedance routing |
| SRIO_RX[0:3]+/−, SRIO_TX[0:3]+/− | Serial RapidIO differential lanes | Four LP-serial pairs for 1.25/2.5/3.125 Gbaud operation; support long-haul pre-compensation and hardware flow control |
| DDR_DQ[0:63], DDR_DQS[0:7] | Data and strobe signals | 64-bit data bus with 8-byte-wide DQS groups; enable DDR2-800 (400 MHz) operation with 2.5-ns setup/hold timing |
| JTAG_TCK/TMS/TDI/TDO/TRST | IEEE 1149.1 boundary scan interface | Enables full-chip debug, system access port (SAP) memory access, and production test via TAP controller |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Security Engine (SEC) | Hardware-accelerated crypto processing for IPSec, SSL/TLS, and 3GPP protocols - reduces CPU load by offloading AES, SHA, RSA, and ECC operations |
| Flexible High-Speed I/O Multiplexing | Single package supports either 8-lane PCI Express or 4-lane PCI Express + 4-lane Serial RapidIO - enables platform reuse across different backplane architectures |
| DDR2 Memory Controller with ODT | On-die termination eliminates external resistors for DDR2-800 interfaces - simplifies PCB layout and improves signal integrity at 400 MHz data rates |
| eTSEC TCP/IP Offload | Hardware checksum generation/verification, VLAN insertion/deletion, and 8-queue QoS - enables line-rate 1-Gbps forwarding without CPU intervention |
| L2 Cache Coherency Support | Hardware-enforced snoop/no-snoop DMA and external master access - ensures cache coherency for multi-master systems using DMA or RapidIO peer-to-peer transfers |
| Power Management Modes | Doze, nap, and sleep states with dynamic block gating - reduces active power to ≤2.7 W in SLEEP mode (Tj = 65°C) for energy-sensitive deployments |
Applications
| Secure Enterprise Router | Industrial Media Gateway |
|---|---|
|
Use Scenario: Aggregating and securing traffic across multiple WAN/LAN interfaces in enterprise branch routers. IC Role / Device Role / Timing Role: Control-plane processor executing routing protocols (BGP/OSPF), managing firewall policies, and accelerating encrypted tunnels via SEC. Use Value: Full AES-256 and SHA-256 acceleration enables >500 Mbps IPSec throughput while maintaining sub-10 µs interrupt latency for real-time route updates. |
Use Scenario: Converting legacy TDM voice streams to VoIP packets and bridging to IP networks in factory-floor communication gateways. IC Role / Device Role / Timing Role: Real-time packet processor handling jitter buffering, RTP timestamping, and QoS scheduling across four eTSECs. Use Value: Hardware VLAN tagging, 8-queue eTSEC transmit scheduling, and low-latency DUART support ensure deterministic <1 ms end-to-end voice delay. |
| Telecom Base Station Controller | Ruggedized Network Appliance |
|
Use Scenario: Managing fronthaul/backhaul connectivity, radio resource allocation, and security in LTE small-cell baseband units. IC Role / Device Role / Timing Role: Embedded host processor interfacing with FPGA-based PHY layers via RapidIO and controlling DDR2-based packet buffers. Use Value: 3.125 Gbaud Serial RapidIO provides 2.5 Gbps full-duplex link to baseband FPGAs, enabling sub-100 ns latency for MAC-layer handshaking. |
Use Scenario: Deploying hardened network monitoring appliances in transportation or energy infrastructure with extended temperature requirements. IC Role / Device Role / Timing Role: Mission-critical compute engine running Linux with real-time extensions, managing dual 1-Gbps eTSEC interfaces and local flash storage. Use Value: Extended junction temperature range (0–105°C), battery-backed DDR2 support, and JTAG-based field firmware recovery ensure >10-year operational reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548EVRAGD557 | Same e500v2 core, identical pinout and memory/peripheral IP, but rated for 1.2 GHz max frequency and includes additional SerDes lanes | Higher clock headroom for compute-intensive control-plane tasks; supports full x8 PCIe + 4× RapidIO simultaneously | Select when >1.0 GHz sustained throughput or dual high-speed fabric usage is required; otherwise MPC8547EPXAQGD557 offers cost-optimized performance |
| LS1023A | ARM Cortex-A7 dual-core, no e500 legacy, integrated QorIQ packet engine, lower power (≈5 W typical), no SEC hardware acceleration | Targets lightweight SD-WAN CPE and IoT gateways where ARM ecosystem and Linux compatibility outweigh Power Architecture legacy needs | Choose for new designs prioritizing ARM toolchain adoption and lower thermal envelope; avoid if existing PowerQUICC III software stack or SEC crypto acceleration is mandatory |
Compared with MPC8548EVRAGD557, the MPC8547EPXAQGD557 trades 200 MHz frequency headroom and dual-fabric concurrency for lower BOM cost and thermal design complexity; versus LS1023A, it retains Power Architecture binary compatibility and hardware crypto but requires legacy toolchain support and higher power budgeting.
Availability
MPC8547EPXAQGD557 is available at Aetrix Electronics and suitable for secure networking equipment, industrial gateways, and telecom infrastructure requiring stable component supply, long-term lifecycle assurance, and qualified obsolescence management.
Supply support for MPC8547EPXAQGD557 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, formed from the acquisition of Freescale Semiconductor in 2015.
The MPC8547EPXAQGD557 belongs to the PowerQUICC III family - designed specifically for high-performance, secure communications processing in carrier-grade and industrial edge systems requiring integrated networking, crypto acceleration, and real-time determinism.
FAQ
What is the maximum DDR2 data rate supported by the MPC8547EPXAQGD557?
The MPC8547EPXAQGD557 supports DDR2-800 operation, delivering an effective data rate of 800 MT/s (400 MHz clock). This is achieved through its 64-bit DDR2 memory controller with programmable timing, on-die termination, and 2.5-ns setup/hold window compliance - enabling up to 16 Gbytes of addressable memory across four banks.
Does the MPC8547EPXAQGD557 support PCI Express endpoint mode?
Yes, the MPC8547EPXAQGD557 supports configurable PCI Express operation as either root complex or endpoint, per its PCI Express 1.0a-compliant interface. This allows direct connection to host systems as a peripheral or integration into larger switch fabrics as a managed endpoint - with full 32-/64-bit addressing and 256-byte payload support.
How does the integrated security engine (SEC) in the MPC8547EPXAQGD557 accelerate cryptographic operations?
The MPC8547EPXAQGD557's SEC includes dedicated execution units: AESU (AES-128/192/256), MDEU (SHA-1/256, MD5), PKEU (RSA up to 2048-bit), and RNG. These operate in parallel with the e500v2 core, enabling simultaneous encryption, hashing, and key exchange - reducing IPSec tunnel setup time by >90% versus software-only implementations.
What thermal specifications apply to the MPC8547EPXAQGD557 in continuous operation?
The MPC8547EPXAQGD557 has a specified junction temperature range of 0°C to 105°C. At 105°C junction and 1.1 V core supply, its maximum power dissipation reaches 18.6 W under smoke-test conditions - requiring a thermal solution capable of ≤1.5°C/W junction-to-ambient resistance for reliable 24/7 deployment in enclosed industrial enclosures.
Can the MPC8547EPXAQGD557 boot directly from SPI flash?
No, the MPC8547EPXAQGD557 does not support native SPI flash boot. Its boot sequencer loads configuration data exclusively from serial ROM via the I2C interface (supporting extended addressing mode), or from NOR flash connected to the local bus. SPI flash requires external glue logic or a companion microcontroller for initialization.
MPC8547EPXAQGD557 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 783-BBGA
- Series:
- MPC85xx
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- PowerPC e500
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1GHz
- Co-Processors/DSP:
- Signal Processing; SPE, Security; SEC
- RAM Controllers:
- DDR, DDR2, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (4)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.8V, 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, Cryptography, Kasumi, Random Number Generator
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 783-PBGA (29x29)
- Additional Interfaces:
- DUART, I2C, PCI, RapidIO
MPC8547EPXAQGD557 FAQ
1.How can I place an order for MPC8547EPXAQGD557 through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8547EPXAQGD557 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8547EPXAQGD557 reliable?
The price and inventory of MPC8547EPXAQGD557 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8547EPXAQGD557 is usually 5 days.
3.What payment methods are accepted for MPC8547EPXAQGD557?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8547EPXAQGD557 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8547EPXAQGD557?
MPC8547EPXAQGD557 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8547EPXAQGD557 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8547EPXAQGD557?
For technical support, including MPC8547EPXAQGD557 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8547EPXAQGD557 requirements.
6.How does Aetrix verify that MPC8547EPXAQGD557 is sourced from the original manufacturer or authorized distributors?
All MPC8547EPXAQGD557 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8547EPXAQGD557 meets industry standards.
7.What is the process for return or replacement of MPC8547EPXAQGD557?
All MPC8547EPXAQGD557 units undergo pre-shipment inspection (PSI). If there is an issue with MPC8547EPXAQGD557, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8547EPXAQGD557 part is unused and in its original packaging.
Return procedure for MPC8547EPXAQGD557:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC8547EPXAQGD557 Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
