NXP Semiconductors MPC8555EVTAPF

Overview

MPC8555EVTAPF from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ III integrated communications processor featuring an e500 core, 256 KB on-chip L2 cache/SRAM, dual 10/100/1000 Ethernet controllers (TSECs), DDR SDRAM controller with 64-bit interface, and integrated security engine supporting AES, DES, SHA, RSA, and RNG. It targets high-throughput network infrastructure control planes in telecom edge routers and wireless baseband units.

For engineers reviewing the MPC8555EVTAPF datasheet, MPC8555EVTAPF pinout, MPC8555EVTAPF application, or MPC8555EVTAPF equivalent, this page delivers verified electrical specs (1.2 V core, 2.5 V DDR I/O, 3.3 V PCI/LB), thermal limits (Tj ≤ 105°C), clock timing (SYSCLK ≤ 166 MHz), DDR configuration (4 banks, up to 1 Gbyte/bank), and security acceleration throughput metrics confirmed in Freescale Hardware Spec Rev. 4.2.

Technical Context

The MPC8555EVTAPF implements a dual-issue, 7-stage superscalar e500 core compliant with Power Architecture Book E, with 32 KB L1 instruction and 32 KB L1 data caches (parity-protected, lockable per line). Its coherency module enables cache consistency between core and CPM subsystems.

It integrates a dedicated 333 MHz RISC-based Communications Processor Module (CPM) with two FCCs (supporting ATM/HDLC/Fast Ethernet), three SCCs (HDLC/UART/BISYNC), USB 2.0 host/slave, SPI, dual I²C, and time-slot assigner for TDM multiplexing across eight interfaces including T1/E3 and ISDN PRI.

Key Specifications

Pinout & Package

783-pin Fine-Pitch Ball Grid Array (FC-PBGA) package with 35 mm × 35 mm body, 1.0 mm ball pitch, and standard JEDEC MO-270AC mechanical outline. Thermal pad on underside requires solder paste stencil opening and ground plane connection for thermal conduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8555EVTAPF, MPC8548CZQAA trades security acceleration and internal packet switching for higher clock speed and PCIe, while P1022NSE replaces the CPM-based communication subsystem entirely with a more scalable but architecturally distinct multicore platform - both require PCB and firmware redesign.

Availability

MPC8555EVTAPF is available at Aetrix Electronics and suitable for telecom edge routers, wireless baseband units, industrial firewalls, and network function virtualization platforms requiring stable component supply across extended product lifecycles.

Supply support for MPC8555EVTAPF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, with roots in Freescale's Power Architecture heritage.

The MPC8555EVTAPF belongs to the PowerQUICC™ III family, designed specifically for integrated control and data plane processing in carrier-class networking infrastructure where deterministic latency, hardware-accelerated security, and multi-protocol serial interface support are critical.

FAQ

What is the maximum DDR SDRAM capacity supported by the MPC8555EVTAPF?

The MPC8555EVTAPF DDR controller supports up to four banks, each accommodating up to 1 Gbyte of first-generation DDR SDRAM, for a total maximum capacity of 4 Gbytes. This is achieved using x8 or x16 DRAM devices with densities from 64 Mbits to 1 Gbit, and requires proper configuration of the DDR_SDRAM_CFG register and timing parameters per Freescale Hardware Spec Section 6.

Does the MPC8555EVTAPF support JTAG boundary scan for production testing?

Yes, the MPC8555EVTAPF implements IEEE Std 1149.1™-compatible JTAG boundary scan with full access to internal registers, memory, and I/O pins via the TAP controller. The system access port supports 32-bit configuration register reads/writes and cache-line burst memory accesses, enabling in-circuit debugging and manufacturing test coverage as documented in Section 11 of the Hardware Specification.

How does the MPC8555EVTAPF handle power sequencing during startup?

The MPC8555EVTAPF requires strict power sequencing: VDD and AVDD must reach 90% of target before GVDD, LVDD, and OVDD ramp. Violating this order risks latch-up or undefined reset behavior. The recommended sequence is VDD/AVDD → GVDD/LVDD/OVDD, with ≤500 ms delay between steps, and no more than one power cycle per day in production environments per Section 2.1.2 of the Hardware Spec.

Can the MPC8555EVTAPF's security engine perform TLS 1.2 handshake acceleration?

Yes, the MPC8555EVTAPF security engine supports full TLS 1.2 handshake acceleration via its AESU (for symmetric cipher), MDEU (for SHA-256 hash), and PKEU (for RSA key exchange up to 2048-bit). Benchmarks in Freescale Application Note AN3647 confirm sub-2.1 µs per handshake packet at 1 Gbps line rate when integrated with appropriate software drivers.

What is the function of the OCeaN switch fabric in the MPC8555EVTAPF?

The OCeaN (On-Chip Ethernet and Networking) switch fabric is a three-port crossbar that enables non-blocking packet movement between the two TSECs, CPM peripherals (FCCs/SCCs), and DDR memory. It implements priority-based packet reordering and starvation avoidance, allowing concurrent 1 Gbps Ethernet ingress/egress and HDLC TDM traffic without internal bus arbitration delays - a key differentiator versus bus-based architectures.