NXP Semiconductors MPC855TVR50D4R2

Overview

MPC855TVR50D4R2 from Freescale Semiconductor is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core, Communications Processor Module (CPM), 10/100 Mbps Ethernet MAC, ATM UTOPIA interface, and system integration unit in a single PBGA357 package. It operates at 50 MHz with 4 KB instruction and 4 KB data caches, supports DRAM/SRAM/Flash memory interfaces, and targets embedded networking control applications including DSL access multiplexers and enterprise branch routers.

For engineers reviewing the MPC855TVR50D4R2 datasheet, MPC855TVR50D4R2 pinout, MPC855TVR50D4R2 application, or MPC855TVR50D4R2 equivalent, key selection criteria include its 50 MHz system clock, IEEE 802.3u-compliant Ethernet MAC, UTOPIA Level 1 ATM support up to 50–70 Mbps, 357-pin PBGA package with 1.27 mm pitch, and dual-voltage 3.3 V core/I/O operation with 5 V-tolerant inputs.

Technical Context

The MPC855TVR50D4R2 implements a superscalar 32-bit Power Architecture™ CPU core with MMU, 4 KB instruction and 4 KB data caches, and a separate RISC-based Communications Processor Module (CPM) handling serial protocols, Ethernet framing, and ATM cell processing. Its CPM includes 8 KB dual-port RAM, four SCCs, two SMCs, one SPI, one I²C port, and time-slot assigner for TDM routing.

It integrates a memory controller supporting eight banks with programmable wait states, PCMCIA socket controller (Rev. 2.1), real-time clock, IEEE 1149.1 JTAG debug interface, and system-level features including software watchdog, periodic interrupt timer, and low-power stop/sleep/deep-sleep modes. The device uses a 357-pin PBGA package (package code VR, case 1103D-02) with 25 × 25 mm footprint and 1.27 mm ball pitch.

Key Specifications

Pinout & Package

Package: 357-ball plastic ball grid array (PBGA), 25 mm × 25 mm body, 1.27 mm ball pitch, package code VR (Freescale case number 1103D-02). Thermal pad exposed on underside; requires solder connection to PCB ground plane for optimal thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860T, MPC855TVR50D4R2 trades maximum frequency and SCC count for lower power and validated 50 MHz stability; compared with MPC855T, it adds three extra SCCs and UTOPIA support-enabling full-featured DSLAM line cards without external protocol accelerators.

Availability

MPC855TVR50D4R2 is available at Aetrix Electronics and suitable for DSL access multiplexers, enterprise branch routers, industrial protocol gateways, and wireless base station controllers requiring stable component supply across extended product lifecycles.

Supply support for MPC855TVR50D4R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC855T belongs to the PowerQUICC™ family of integrated communications controllers designed specifically for cost-sensitive, high-reliability embedded networking applications requiring combined CPU, communications processor, and peripheral integration in a single package.

FAQ

What is the maximum operating frequency of the MPC855TVR50D4R2?

The MPC855TVR50D4R2 is rated for a maximum system clock frequency of 50 MHz in 1:1 mode (CPU and bus synchronized). It supports 50 MHz operation with guaranteed timing margins under specified voltage (3.135–3.465 V) and temperature (0–95 °C junction) conditions. Higher frequencies require derating or use of faster variants like the MPC860T.

Does the MPC855TVR50D4R2 include an integrated Ethernet PHY?

No, the MPC855TVR50D4R2 does not include an integrated Ethernet PHY. It provides a Media Independent Interface (MII) with MII_TXD[0:3], MII_RXD[0:3], MII_TX_EN, MII_TX_ER, MII_CRS, MII_COL, and MII_MDC/MDIO signals. An external 10/100 Mbps PHY (e.g., DP83848) must be used to complete the physical layer interface.

What package type and thermal characteristics apply to the MPC855TVR50D4R2?

The MPC855TVR50D4R2 uses a 357-ball PBGA package (code VR, case 1103D-02) with 25 × 25 mm body and 1.27 mm ball pitch. Its thermal resistance is RθJA = 34 °C/W (natural convection, single-layer board) and RθJB = 13 °C/W. The exposed thermal pad must be soldered to a PCB ground plane for effective heat dissipation.

Can the MPC855TVR50D4R2 support both ATM and Ethernet simultaneously?

Yes, the MPC855TVR50D4R2 can operate its UTOPIA ATM interface and 10/100 Mbps Ethernet MAC concurrently. However, IEEE 802.3u compliance is disabled when the UTOPIA interface is active - the Ethernet functionality remains available only in non-UTOPIA configurations. System firmware must manage resource arbitration between the two interfaces.

What debug capabilities does the MPC855TVR50D4R2 provide?

The MPC855TVR50D4R2 includes a full IEEE 1149.1 JTAG test access port with eight hardware watchpoint comparators (four for instruction address, two for data address, two for data value), supporting breakpoint generation, real-time trace, and non-intrusive debugging. It also features advanced on-chip emulation (OnCE) mode for full visibility into CPU and CPM execution states.