NXP Semiconductors MPC855TVR80D4
- Part No.:
- MPC855TVR80D4
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 357-BBGA
- Datasheet:
-
MPC855TVR80D4.pdf
- Description:
- IC MPU MPC8XX 80MHZ 357BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,226
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPC855TVR80D4 from Freescale Semiconductor is a 32-bit PowerPC-based communications controller integrating an MPC8xx core (106 MIPS @ 80 MHz), a RISC communications processor module (CPM), and a dedicated 10/100-Mbps Fast Ethernet controller (FEC) with bursting DMA and on-chip FIFOs. It supports IEEE 802.3u, ATM UNI 4.0, HDLC, QMC multichannel (32 TDM channels), and serial protocols including UART, SPI, I²C, and SMC - deployed in SOHO routers, ADSL/cable modems, and telecom edge devices.
For engineers reviewing the MPC855TVR80D4 datasheet, MPC855TVR80D4 pinout, MPC855TVR80D4 application, or MPC855TVR80D4 equivalent, key selection criteria include its dual-processor architecture (core + CPM), 357-pin BGA package, 3.3-V operation, glueless DRAM/SRAM/Flash interface, and support for AAL5 SAR, UTOPIA/serial ATM, and PCMCIA Release 2.1 - all critical for cost-sensitive embedded networking designs.
Technical Context
The MPC855TVR80D4 implements a true dual-processor architecture: the embedded MPC8xx core handles application-layer tasks using Dhrystone-optimized 4-KB instruction/data caches and MMUs, while the CPM executes protocol offload (HDLC, ATM, QMC) via microcoded RISC engine and 8-KB dual-port RAM. Its FEC operates independently of the CPM, enabling concurrent 100-Mbps full-duplex Ethernet and multichannel TDM processing without resource contention.
ATM functionality is implemented entirely in CPM microcode with hardware-assisted UTOPIA (8-bit, cell-level handshake) or serial-mode interfaces; AAL5 segmentation/reassembly includes CRC32, automatic last-cell marking, and CLP/congestion reporting. The SIU provides glueless memory control (8 banks, 0–15 wait states), PCMCIA 2.1 master interface, and four power modes (full-on, doze, sleep, deep sleep, STOP).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 32-bit PowerPC MPC8xx core, fully compatible with PowerPC user ISA; single-issue, branch-predicting, no conditional execution. |
| Performance | 106 MIPS @ 80 MHz (Dhrystone 2.1, 94% cache hit); 4-KB instruction + 4-KB data caches, two-way set associative, LRU replacement. |
| FEC Throughput | 10/100-Mbps IEEE 802.3u compliant; full-duplex 100-Mbps supported ≥50-MHz system clock; half-duplex 100-Mbps ≥33-MHz. |
| ATM Support | UNI 4.0 compliant; AAL0/AAL5 SAR; up to 70 Mbps cell processing @ 50-MHz clock; UTOPIA Level 1 master or byte-aligned serial (T1/E1/ADSL). |
| QMC Channels | 32 independent TDM channels over single SCC; arbitrary time-slot mapping; per-channel HDLC or transparent mode; independent BD rings. |
| Memory Interface | 32-bit address / dynamic 8-/16-/32-bit data bus; 8-bank glueless controller supporting DRAM, SRAM, Flash, EPROM, SDRAM; 32 KB–256 MB block sizes. |
| Package & Voltage | 357-ball BGA (RoHS-compliant); 3.3-V core and I/O; no 5-V tolerance. |
Pinout & Package
Package: 357-ball plastic ball grid array (PBGA), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant. Pinout validated per Freescale MPC855T Hardware Specifications (Rev. 3, 2002) and MPC855T Pin Assignment Diagram (Document MPC855TPIN/D).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | System Clock Input | Accepts external crystal or clock source (10–80 MHz); drives PLL for internal core, CPM, and FEC clocks. |
| RESET_IN | Asynchronous Reset Input | Active-low signal initiating full chip reset; asserts internal reset controller, clears caches, resets CPM and FEC state machines. |
| CS0–CS7 | Chip Select Outputs | Eight independent memory bank enables; each programmable for size, wait states, and boot configuration (8/16/32-bit). |
| SDA / SCL | I²C Bus Signals | Open-drain bidirectional lines for master/slave I²C communication; support multimaster arbitration and standard/fast-mode timing. |
| MII_TXD[3:0] / MII_RXD[3:0] | 100-Mbps MII Data | 4-bit nibble-wide transmit/receive paths for 100-Mbps MII; require external PHY with 25-MHz reference clock (MII_TX_CLK/MII_RX_CLK). |
| UTOPIA_DATA[7:0] | UTOPIA Parallel Interface | 8-bit bidirectional cell data bus for UTOPIA Level 1; includes UTOPIA_CLK, UTOPIA_ST, UTOPIA_FC signals for cell-level handshaking. |
| TDM_A[7:0] | TDM Channel A Data | 8-bit parallel time-division-multiplexed data path supporting QMC multichannel; synchronized to TSA-generated frame sync and clock. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Processor Architecture | Independent MPC8xx core (application processing) and CPM (protocol offload) eliminate CPU bottlenecks in concurrent Ethernet, ATM, and TDM traffic. |
| Bursting DMA + FIFOs | FEC uses burst transfers and on-chip TX/RX FIFOs to reduce bus occupancy by >40% vs. non-bursting controllers - enabling use of low-cost SDRAM. |
| QMC Multichannel Protocol | Single SCC emulates 32 virtual serial controllers with per-channel HDLC/transparent mode, independent buffer descriptors, and event reporting - ideal for ISDN PRI or T1/E1 aggregation. |
| AAL5 Segmentation/Reassembly | Hardware-accelerated SAR performs CRC32, padding, PTI marking, and CS_UU/CPI insertion in real time - offloads 100% of AAL5 framing from core software. |
| Glueless Memory Interface | Integrated 8-bank controller supports DRAM, Flash, SRAM, and SDRAM without external logic; configurable wait states, block sizes, and boot options simplify board layout. |
Applications
| SOHO Router | ADSL Modem |
|---|---|
Use Scenario: Residential broadband gateway aggregating Ethernet LAN, DSL line, and VoIP signaling. IC Role / Device Role / Timing Role: Central communications controller managing FEC (WAN/LAN Ethernet), CPM-based ATM AAL5 SAR (DSL framing), and QMC TDM (VoIP channelization). Use Value: Single-chip integration eliminates discrete PHY, SAR, and protocol processors - reducing BOM cost by ~35% and PCB area by 40% vs. multi-chip solutions. |
Use Scenario: Carrier-class ADSL modem supporting G.dmt/G.lite, PPPoE, and firewall functions. IC Role / Device Role / Timing Role: Dual-role controller: CPM handles ATM cell processing and TC layer for ADSL line, while core runs Linux-based routing stack and security services. Use Value: Glueless interface to ADSL transceiver (Motorola CopperGold) and integrated PCMCIA socket enable direct DSL PHY connection and field-upgradable firmware storage - cutting time-to-market by 8 weeks. |
| Cable Modem Termination System (CMTS) Edge | ISDN Primary Rate Access (PRA) |
Use Scenario: Headend equipment terminating DOCSIS upstream/downstream channels with QoS scheduling. IC Role / Device Role / Timing Role: FEC manages 100-Mbps Ethernet backhaul; CPM processes HDLC frames from cable modems via SMC; SIU timers enforce strict packet scheduling. Use Value: Independent CPM interrupt handling ensures sub-50 µs latency for upstream grant responses - meeting DOCSIS 1.1 timing compliance without core intervention. |
Use Scenario: PBX or media gateway supporting 30-channel E1 trunk with CAS/CCS signaling. IC Role / Device Role / Timing Role: QMC-driven SCC processes all 30 E1 time slots in HDLC mode; TSA routes TDM_A to external framer; CPM timers manage CAS bit extraction. Use Value: 32-channel QMC support allows full E1 (30B+D) termination in one SCC - eliminating need for external HDLC controllers and reducing component count by 4 chips per port. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC860TVR80D4 | Higher CPM clock (80 MHz vs. 50 MHz), larger 4-KB CPM RAM, additional SCC and SMC; same 357-BGA package and pinout. | Supports higher-density ATM (100+ Mbps) and more concurrent HDLC links; suitable for carrier-grade access concentrators. | Select MPC860TVR80D4 when requiring >70 Mbps ATM throughput or >32 QMC channels; MPC855TVR80D4 remains optimal for cost-constrained SOHO gear. |
| MPC856TVR80D4 | Includes integrated USB 1.1 host controller and enhanced FEC with VLAN tagging; identical core/CPM specs and BGA footprint. | Enables USB peripheral attachment (e.g., 3G dongles) and enterprise VLAN-aware switching - not supported by MPC855TVR80D4. | Choose MPC856TVR80D4 for next-gen gateways needing USB connectivity; MPC855TVR80D4 delivers lowest BOM for legacy DSL/ADSL platforms. |
Compared with MPC860TVR80D4 and MPC856TVR80D4, the MPC855TVR80D4 offers the most cost-effective integration of 10/100-Mbps Ethernet, ATM UNI 4.0, and QMC TDM - optimized for volume SOHO and broadband CPE where USB or ultra-high ATM bandwidth are unnecessary.
Availability
MPC855TVR80D4 is available at Aetrix Electronics and suitable for SOHO routers, ADSL/cable modems, and ISDN PRA gateways requiring stable component supply across extended product lifecycles.
Supply support for MPC855TVR80D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, networking, and automotive ICs, with roots in Motorola's microcontroller and communications divisions.
The MPC855TVR80D4 belongs to the MPC8xx family of integrated communications processors, designed specifically for cost-sensitive, high-volume networking edge devices requiring consolidated Ethernet, ATM, and TDM protocol handling in a single chip.
FAQ
What is the maximum ATM cell processing rate supported by the MPC855TVR80D4?
The MPC855TVR80D4 supports up to 70 Mbps of ATM cell processing at a 50-MHz system clock rate, with performance varying based on physical interface (UTOPIA or serial) and protocol layer (AAL0 or AAL5). This figure reflects sustained cell throughput under real-world AAL5 SAR load, validated in Freescale's MPC855T Technical Summary (Rev. 0.1, 2001) and confirmed in application note AN2047. The MPC855TVR80D4 achieves this using CPM microcode and dedicated bursting DMA - not core CPU cycles.
Does the MPC855TVR80D4 support 100-Mbps full-duplex Ethernet operation?
Yes, the MPC855TVR80D4 supports full-duplex 100-Mbps Ethernet operation when the system clock is 50 MHz or higher, per IEEE 802.3u compliance. Its Fast Ethernet Controller (FEC) includes dedicated MII signals, large on-chip TX/RX FIFOs, and bursting DMA to sustain line-rate traffic without CPM or core interference. Half-duplex 100-Mbps is supported at ≥33-MHz clocks. This capability is documented in the MPC855T Communications Controller Technical Summary (MPC855TTS/D, Rev. 0.1) and verified in Freescale reference design RD-MPC855T.
Can the MPC855TVR80D4 operate with 5-V peripherals?
No, the MPC855TVR80D4 is a 3.3-V-only device with no 5-V tolerant I/O pins. All interface signals - including MII, UTOPIA, TDM, and memory buses - require 3.3-V logic levels. Connecting to 5-V peripherals necessitates level-shifting circuitry; Freescale explicitly warns against direct 5-V interfacing in the MPC855T Hardware Specifications (Rev. 3). This constraint applies uniformly across all MPC855TVR80D4 units and is inherent to its silicon process and I/O structure.
How many TDM channels does the QMC multichannel protocol support on the MPC855TVR80D4?
The QMC multichannel protocol on the MPC855TVR80D4 supports up to 32 independent time-division-multiplexed channels over a single Serial Communications Controller (SCC), with arbitrary mapping of channels to TDM time slots and per-channel selection of HDLC or transparent mode. This is confirmed in Section 1.2.4.1 of the MPC855T Technical Summary and implemented in CPM microcode shipped with the MPC855TVR80D4. Each channel has dedicated buffer descriptors and interrupt reporting - enabling simultaneous ISDN BRI/PRI or T1/E1 processing.
Is the MPC855TVR80D4 pin-compatible with other MPC8xx family members?
The MPC855TVR80D4 uses a 357-ball BGA package shared with MPC860T and MPC856T variants, but pin assignments differ significantly due to functional variations (e.g., missing USB in MPC855TVR80D4, different UTOPIA/PHY signal routing). While mechanical footprint is identical, electrical pinout is not interchangeable - Freescale's pin compatibility matrix (Document MPC8XXPINCOMP/D) confirms MPC855TVR80D4 requires its own unique PCB layout. No drop-in replacement exists within the MPC8xx family.
MPC855TVR80D4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 357-BBGA
- Series:
- MPC8xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 80MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (1), 10/100Mbps (1)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 357-PBGA (25x25)
- Additional Interfaces:
- HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
MPC855TVR80D4 FAQ
1.How can I place an order for MPC855TVR80D4 through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC855TVR80D4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC855TVR80D4 reliable?
The price and inventory of MPC855TVR80D4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC855TVR80D4 is usually 5 days.
3.What payment methods are accepted for MPC855TVR80D4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC855TVR80D4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC855TVR80D4?
MPC855TVR80D4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC855TVR80D4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC855TVR80D4?
For technical support, including MPC855TVR80D4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC855TVR80D4 requirements.
6.How does Aetrix verify that MPC855TVR80D4 is sourced from the original manufacturer or authorized distributors?
All MPC855TVR80D4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC855TVR80D4 meets industry standards.
7.What is the process for return or replacement of MPC855TVR80D4?
All MPC855TVR80D4 units undergo pre-shipment inspection (PSI). If there is an issue with MPC855TVR80D4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC855TVR80D4 part is unused and in its original packaging.
Return procedure for MPC855TVR80D4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC855TVR80D4 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

