NXP Semiconductors MPC855TZQ50D4-NXP

Overview

MPC855TZQ50D4-NXP from NXP Semiconductors (formerly Freescale) is a Power Architecture™-based integrated communications controller combining a 32-bit RISC CPU core, Communications Processor Module (CPM), and system-level peripherals in a single PBGA357 package. It delivers 50 MHz CPU operation, 4 KB instruction/4 KB data cache, IEEE 802.3-compliant 10/100 Mbps Ethernet via SCC, and UTOPIA-level ATM support - deployed in telecom access equipment, industrial gateways, and legacy networking infrastructure.

For engineers reviewing the MPC855TZQ50D4-NXP datasheet, MPC855TZQ50D4-NXP pinout, MPC855TZQ50D4-NXP application, or MPC855TZQ50D4-NXP equivalent, key selection considerations include its 50 MHz clock rating, 3.3 V core/I/O supply with 5 V-tolerant inputs (except EXTAL/EXTCLK), 357-pin PBGA ZQ package, and dual-domain memory controller supporting DRAM, SRAM, Flash, and PCMCIA sockets.

Technical Context

The MPC855TZQ50D4-NXP implements a superscalar Power Architecture™ CPU core with MMU, 32 GPRs, branch prediction, and physically addressed caches - paired with an enhanced CPM derived from the MC68360 QUICC, now including I²C and expanded DMA channels. Its bus architecture supports dynamic 8/16/32-bit data width and 32-bit addressing at up to 66 MHz bus speed (with 50 MHz CPU requiring 1:1 mode).

System integration includes SIU with real-time clock, watchdog, PIT, JTAG debug interface, and clock synthesizer; four SCCs supporting HDLC/SDLC/UART/IrDA/BISYNC; two SMCs; SPI; I²C; TSA for TDM routing; and PCMCIA socket controller compliant with Release 2.1 - all operating within 0°C to 95°C junction temperature limits under 3.135–3.465 V supply at >40 MHz.

Key Specifications

Pinout & Package

Package: Plastic Ball Grid Array (PBGA), 357 balls, 25 mm × 25 mm footprint, 1.27 mm ball pitch, ZQ designation per Freescale Case No. 5058 (1103D-02). Thermal pad not electrically connected; bottom-side ground balls provide mechanical and thermal anchoring.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860TZP50D4, the MPC855TZQ50D4-NXP offers identical serial peripheral count and ATM capability but trades cache size for ZQ package compatibility; versus MPC855TZQ50D4, it reflects NXP's post-acquisition branding with no electrical or functional change - making it the preferred sourcing identifier for new designs requiring long-term traceability.

Availability

MPC855TZQ50D4-NXP is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, legacy telecom edge routers, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MPC855TZQ50D4-NXP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and communication markets.

The MPC855TZQ50D4-NXP belongs to the PowerQUICC™ family - designed specifically for cost-sensitive, high-reliability communications infrastructure where integrated CPU+CPM architecture reduces system complexity and power consumption in fixed-function networking gear.

FAQ

What is the maximum operating frequency of the MPC855TZQ50D4-NXP CPU core?

The MPC855TZQ50D4-NXP CPU core operates at a guaranteed maximum frequency of 50 MHz. This is specified in the "DC Characteristics" section of the MPC860 Hardware Specifications Rev. 10, where Table 5 lists "D.4" die revision at 50 MHz (1:1 mode) with typical power dissipation of 656 mW. Bus operation may run at 66 MHz only in 2:1 mode - not applicable to this 50 MHz-rated variant.

Does the MPC855TZQ50D4-NXP support IEEE 802.3 10/100 Mbps Ethernet?

Yes, the MPC855TZQ50D4-NXP supports IEEE 802.3-compliant 10/100 Mbps Ethernet through its Serial Communications Controllers (SCCs), specifically SCC1–SCC4. As stated in the "Features" section of the MPC860 Hardware Specifications Rev. 10, Ethernet/IEEE 802.3 is optional on all four SCCs and fully supported at 10 Mbps; 100 Mbps operation requires external PHY and proper MII signal routing, consistent with MPC860 family implementation.

What package type and pin count does the MPC855TZQ50D4-NXP use?

The MPC855TZQ50D4-NXP uses a 357-ball Plastic Ball Grid Array (PBGA) package with ZQ designation (Case No. 5058, 1103D-02), measuring 25 mm × 25 mm with 1.27 mm ball pitch. This is confirmed in Table 3 ("Package Description") of the MPC860 Hardware Specifications Rev. 10, which explicitly maps ZQ/VR to "PBGA 357 25*25*1.2P1.27".

Is the MPC855TZQ50D4-NXP pin-compatible with other MPC860 family members?

The MPC855TZQ50D4-NXP shares the same ZQ 357-ball PBGA footprint and pinout as other MPC860 family variants rated for 50 MHz operation, including MPC860T and MPC860DP in ZQ packages. Pin compatibility is validated by identical mechanical data in Table 3 and consistent signal naming across Tables 6–7 in the MPC860 Hardware Specifications Rev. 10 - though cache size, ATM enablement, and SCC configuration may differ functionally.

What is the recommended power supply voltage range for MPC855TZQ50D4-NXP at 50 MHz operation?

At 50 MHz operation, the MPC855TZQ50D4-NXP requires VDDH, VDDL, and VDDSYN supplies within 3.135 V to 3.465 V, as specified in Table 6 ("DC Electrical Specifications") of the MPC860 Hardware Specifications Rev. 10. This tighter tolerance (vs. 3.0–3.6 V at ≤40 MHz) ensures stable PLL lock and cache coherency at higher clock rates.