NXP Semiconductors MPC8560CVT667JB

Overview

MPC8560CVT667JB from NXP (formerly Freescale) is a PowerQUICC III integrated communications processor featuring an e500 core, 667 MHz core frequency, 256 KB L2 cache/SRAM, dual 10/100/1000 Mbps Ethernet controllers (TSEC), DDR-1 SDRAM controller (64-bit, up to 333 MHz), PCI/PCI-X and RapidIO interfaces, and CPM subsystem for telecom protocol offload - deployed in carrier-grade wireless base stations and enterprise routing platforms.

For engineers reviewing the MPC8560CVT667JB datasheet, MPC8560CVT667JB pinout, MPC8560CVT667JB application, or MPC8560CVT667JB equivalent, key selection considerations include its 667 MHz e500 core speed, 783-pin FC-PBGA package, 1.2 V core supply with 2.5 V/3.3 V I/O domains, DDR-1 memory interface timing, and dual TSEC support for IEEE 802.3ab/z-compliant Gigabit Ethernet.

Technical Context

The MPC8560CVT667JB implements a Book E–enhanced 32-bit e500 core with 32 KB L1 instruction and 32 KB L1 data caches (parity-protected), MMU optimized for embedded networking, and performance monitor facility. Its CPM subsystem operates at up to 333 MHz and handles HDLC, ATM (via UTOPIA), TDM, and serial protocols using FCCs, SCCs, MCCs, and time-slot assigner logic.

It integrates a 256 KB L2 cache/SRAM configurable as full cache, full SRAM, or split mode with full ECC on 64-bit boundaries; a DDR-1 SDRAM controller supporting four banks up to 1 Gbyte each; and OCeaN packet switch fabric enabling priority-based, starvation-avoiding crossbar switching of up to 256-byte payloads between internal blocks.

Key Specifications

Pinout & Package

Package: 783-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA), 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil and thermal via design per JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8560CVT667JB, MPC8560CVT800JB offers higher deterministic throughput at cost of thermal headroom, while MPC8548CZQ800B trades RapidIO and DDR-1 compatibility for cryptographic acceleration and DDR2 support - making it unsuitable as drop-in replacement in existing PowerQUICC III RapidIO-based infrastructure.

Availability

MPC8560CVT667JB is available at Aetrix Electronics and suitable for carrier-grade wireless infrastructure, enterprise routing platforms, and telecom media gateways requiring stable component supply across extended product lifecycles.

Supply support for MPC8560CVT667JB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in secure connectivity solutions for automotive, industrial, and networking applications, formed from the spin-off of Freescale Semiconductor in 2015.

The MPC8560CVT667JB belongs to the PowerQUICC III family, designed specifically for high-performance, integrated communications processing in carrier-class networking equipment where deterministic real-time control, multi-protocol offload, and scalable interconnect are critical.

FAQ

What is the core architecture and clock speed of the MPC8560CVT667JB?

The MPC8560CVT667JB features a Book E–enhanced 32-bit e500 core operating at 667 MHz. It includes 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection, a memory management unit optimized for embedded networking, and hardware debug support. This configuration delivers deterministic real-time performance for control-plane software in telecom infrastructure, and the MPC8560CVT667JB's core frequency is fixed by its internal PLL ratio settings per the reference manual.

Does the MPC8560CVT667JB support DDR2 memory?

No, the MPC8560CVT667JB supports only DDR-1 SDRAM, not DDR2. Its DDR memory controller is specified for DDR-1 operation with 64-bit data width, up to 333 MHz data rate, four banks, and full ECC support. DDR2 capability was introduced in later PowerQUICC III derivatives like the MPC8548, but the MPC8560CVT667JB's memory interface is strictly DDR-1 compliant per its hardware specifications.

What package type and pin count does the MPC8560CVT667JB use?

The MPC8560CVT667JB uses a 783-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA) package measuring 35 mm × 35 mm with 1.0 mm ball pitch. This package is thermally enhanced with an exposed thermal pad on the underside and is RoHS-compliant. Pinout validation confirms dedicated VDD, GVDD, LVDD, and OVDD power domains, and the MPC8560CVT667JB's pin assignments match Freescale's official "Package and Pin Listings" section in Rev. 4.2 documentation.

Can the MPC8560CVT667JB operate with a 133 MHz PCI-X interface?

Yes, the MPC8560CVT667JB's PCI/PCI-X controller supports 64-bit PCI-X operation at up to 133 MHz, compliant with PCI-X 1.0 specification. It operates in both host and agent modes, supports 64-bit dual address cycles, multiple split transactions, and memory prefetching. The MPC8560CVT667JB achieves this while maintaining full coherency enforcement and posting capabilities - critical for attaching high-throughput network acceleration peripherals.

What is the function of the OCeaN switch fabric in the MPC8560CVT667JB?

OCeaN (On-Chip Accelerated Network) is a four-port crossbar packet switch inside the MPC8560CVT667JB that enables non-blocking, priority-based data movement between major internal blocks - including TSECs, DDR controller, RapidIO, and PCI. It implements starvation avoidance algorithms and reorders packets to bypass blocked paths, allowing the MPC8560CVT667JB to sustain high throughput across multiple concurrent traffic flows without CPU involvement.