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NXP Semiconductors MPC8560VT833LC
- Part No.:
- MPC8560VT833LC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 783-BFBGA, FCBGA
- Datasheet:
-
MPC8560VT833LC.pdf
- Description:
- IC MPU MPC85XX 833MHZ 783FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,614
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Product details
Overview
MPC8560VT833LC from NXP (formerly Freescale) is a PowerQUICC III integrated communications processor featuring an e500 core, 256 KB L2 cache/SRAM, dual 10/100/1000 Mbps Ethernet controllers (TSEC), DDR-1 SDRAM controller (64-bit, up to 333 MHz), PCI/PCI-X (64-bit, 133 MHz), and 8-bit RapidIO interface - deployed in carrier-grade networking infrastructure, wireless baseband units, and telecom edge routers.
For engineers reviewing the MPC8560VT833LC datasheet, MPC8560VT833LC pinout, MPC8560VT833LC application, or MPC8560VT833LC equivalent, key selection criteria include its 833 MHz e500 core frequency, 783-pin FC-PBGA package, 1.2 V core supply with 2.5 V/3.3 V I/O domains, integrated CPM for legacy serial protocols (HDLC, SCC/FCC), and OCeaN packet switch for on-die traffic arbitration.
Technical Context
The MPC8560VT833LC implements a Book E–enhanced 32-bit e500 core with 32 KB L1 instruction and 32 KB L1 data caches (parity-protected), MMU optimized for embedded real-time OS, and performance monitor facility supporting 8 configurable 32-bit counters. Its coherency module enables cache snooping across local bus, PCI, and RapidIO masters.
System-level integration includes a programmable interrupt controller compliant with OpenPIC architecture (16 priority levels, 12 external IRQs), boot sequencer loading configuration via I²C from serial ROM, and dual TSECs with RGMII/RTBI/GMII/TBI support plus 9.6 KB jumbo frame handling - all synchronized to a 166 MHz SYSCLK input with ±150 ps jitter tolerance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| e500 Core Frequency | 833 MHz - delivers deterministic real-time throughput for packet forwarding and control-plane processing in telecom infrastructure. |
| L2 Cache/SRAM | 256 KB configurable as full cache, full SRAM, or split mode - enables low-latency buffer management for protocol stacks and DMA descriptors. |
| DDR SDRAM Interface | 64-bit, DDR-1, up to 333 MHz data rate - supports four banks, up to 1 Gbyte per bank, with full ECC and auto-refresh for carrier-grade reliability. |
| Ethernet Controllers | Dual TSECs compliant with IEEE 802.3/802.3u/802.3z/802.3ab - each supports MII, GMII, TBI, RGMII, RTBI, and 2 KB FIFOs for wire-speed 1 Gbps operation. |
| PCI/PCI-X Support | 64-bit, 133 MHz PCI-X 1.0 and PCI 2.2 compatible - enables high-bandwidth host-to-peripheral bridging with memory prefetching and posted writes. |
| RapidIO Interface | 8-bit, source-synchronous DDR LVDS - supports 125 MHz clock, 256-byte payloads, atomic operations, and four priority levels for inter-processor communication. |
| Package | 783-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA) - 27 mm × 27 mm footprint with thermal lid, designed for forced-air-cooled telecom modules. |
| Power Supply | 1.2 V ±60 mV core (VDD), 2.5 V DDR I/O (GVDD), 3.3 V or 2.5 V Ethernet I/O (LVDD), 3.3 V system I/O (OVDD) - multi-rail sequencing required for reliable startup. |
Pinout & Package
Package: 783-pin FC-PBGA (27 mm × 27 mm, 1.27 mm pitch), thermally enhanced with integrated heat spreader. Pinout organized into functional banks: DDR address/data/control, PCI/PCI-X, RapidIO differential pairs, TSEC MII/GMII/RGMII interfaces, CPM serial I/O (SCC/FCC/MCC), JTAG, I²C, and power/ground distribution across multiple planes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD[0:15] | Core power supply | 16 dedicated 1.2 V inputs feeding e500 core and L1/L2 cache logic - require low-ESR decoupling within 10 mm of package edge. |
| GVDD[0:7] | DDR I/O supply | 8 pins for 2.5 V SSTL2-compliant DDR interface - must be ramped after VDD and before OVDD/LVDD per sequencing spec. |
| LVDD[0:3] | Ethernet PHY I/O supply | 4 pins supporting either 2.5 V or 3.3 V for TSEC RGMII/RTBI/GMII - voltage selection configures I/O threshold and drive strength. |
| OVDD[0:11] | System I/O supply | 12 pins for 3.3 V logic (PCI, CPM, Local Bus, JTAG, I²C) - shared rail with configurable slew rate via PORIMPSCR register. |
| SYSCLK | System clock input | Single-ended 166 MHz reference - requires AC-coupled 50 Ω termination and <±150 ps jitter for stable CCB and core PLL lock. |
| HRESET | Hardware reset input | Asynchronous active-low signal - must be asserted ≥100 μs; release timing triggers PLL lock (≤100 μs) and DDR initialization sequence. |
Key Features
| Feature | Design Value |
|---|---|
| OCeaN Packet Switch | Four-port crossbar with priority-based reordering and starvation avoidance - enables concurrent traffic routing between TSEC, RapidIO, PCI, and CPM without CPU intervention. |
| CPM Subsystem | 333 MHz RISC engine with three FCCs (HDLC/UTOPIA), four SCCs (UART/HDLC/BISYNC), two MCCs (256-channel TDM), and SPI/I²C - offloads serial protocol processing from e500 core. |
| ATMU Configuration | Eight local access windows + inbound/outbound translation for PCI/RapidIO - allows flexible memory mapping of peripherals, flash, and external FPGAs into coherent address space. |
| Integrated DMA Controller | Four-channel scatter-gather engine with striding, misaligned transfers, and snoop/no-snoop coherency - accelerates packet buffering and descriptor chaining across DDR, L2, and peripheral registers. |
| Boot Sequencer | I²C-based serial ROM loader with CRC-verified preamble and extended addressing - enables secure, field-upgradable firmware initialization without external boot PROM. |
| Power Management | Doze/nap/sleep modes with dynamic block gating - reduces idle power by >40% while preserving DDR self-refresh and interrupt wake capability. |
Applications
| Wireless Base Station Controller | Carrier Ethernet Aggregation Router |
|---|---|
Use Scenario: Centralized control unit in LTE macrocell BTS managing fronthaul (CPRI over RapidIO) and backhaul (10G Ethernet via PCI-X add-in card). IC Role / Device Role / Timing Role: MPC8560VT833LC serves as primary control processor running Linux BSP, orchestrating packet classification, QoS scheduling, and alarm reporting via CPM UART/SCC links to RF units. Use Value: Integrated OCeaN switch and dual TSECs eliminate external packet buffer RAM and PHY glue logic, reducing BOM cost by $12–$18 per unit at volume. |
Use Scenario: Edge aggregation node consolidating 48× 1 GbE access ports into dual 10 GbE uplinks using MPLS-TP OAM and IEEE 1588 PTP timestamping. IC Role / Device Role / Timing Role: MPC8560VT833LC executes control-plane software (e.g., Quagga/BGP) while offloading forwarding lookups to external TCAM via PCI-X, with TSECs handling precise 1588 timestamp insertion. Use Value: 256 KB L2 SRAM configured as packet descriptor pool enables 64K concurrent flows with zero external SRAM, cutting PCB layer count by two layers. |
| DSLAM Line Card Processor | Industrial Protocol Gateway |
Use Scenario: Line card in multi-service DSLAM handling ADSL2+/VDSL2 framing, ATM segmentation, and IP routing for 256 subscriber lines. IC Role / Device Role / Timing Role: MPC8560VT833LC runs real-time ADSL firmware on e500 core while CPM FCCs manage UTOPIA-8 PHY interfaces and MCCs handle TDM voice channel multiplexing. Use Value: Dual TSECs with jumbo frame support enable efficient G.fast backhaul encapsulation, improving spectral efficiency by 18% vs. legacy MPC8260-based designs. |
Use Scenario: Field gateway converting Modbus RTU (RS-485) and PROFIBUS DP to MQTT over cellular/Wi-Fi for IIoT cloud connectivity. IC Role / Device Role / Timing Role: MPC8560VT833LC acts as protocol translator with SCCs handling serial fieldbus physical layer and TSECs managing encrypted TLS tunnels to AWS IoT Core. Use Value: Integrated I²C and GPIO allow direct connection to secure element (ATECC608A) for hardware-rooted device identity, meeting IEC 62443-3-3 SL2 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548CZQAGD | Same e500 core, 1.3 GHz max, but lacks RapidIO; replaces OCeaN with simpler crossbar; 667 MHz version only. | Better suited for PCI-only backplane systems without inter-processor fabric; lower power at same throughput due to 90 nm process. | Select when RapidIO is unused and cost-sensitive PCIe expansion is preferred over high-speed chip-to-chip interconnect. |
| P1022NSE | e5500 dual-core, 1.2 GHz, DDR3 support, SATA, USB 2.0 - no CPM or UTOPIA; uses newer QorIQ architecture. | Targets next-gen control planes requiring SMP Linux, virtualization, and storage I/O - not drop-in compatible with legacy PowerQUICC software. | Choose for new designs needing multi-core scalability and modern peripherals; requires full BSP porting effort. |
Compared with MPC8560VT833LC, MPC8548CZQAGD offers higher clock speed but sacrifices RapidIO and OCeaN switching, while P1022NSE provides dual-core performance and DDR3 but abandons CPM-based serial protocol acceleration - making MPC8560VT833LC irreplaceable for legacy telecom hardware maintenance and UTOPIA/HDLC-dependent deployments.
Availability
MPC8560VT833LC is available at Aetrix Electronics and suitable for carrier-grade networking infrastructure, wireless base station control units, and industrial protocol gateways requiring stable component supply across extended product lifecycles.
Supply support for MPC8560VT833LC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, with deep heritage in Power Architecture technology.
The MPC8560VT833LC belongs to the PowerQUICC III family - engineered specifically for high-reliability communications infrastructure where deterministic real-time performance, multi-protocol serial I/O, and integrated packet switching are critical.
FAQ
What is the maximum DDR-1 SDRAM data rate supported by the MPC8560VT833LC?
The MPC8560VT833LC supports a maximum DDR-1 SDRAM data rate of 333 MHz, corresponding to a 166 MHz clock with double-data-rate transfers. This enables sustained bandwidth of 5.3 GB/s across its 64-bit interface, sufficient for line-rate packet buffering in 10 Gbps-class aggregation nodes. The DDR controller includes full ECC, page-mode optimization (up to 16 open pages), and registered DIMM support - all verified in the MPC8560VT833LC hardware specifications Rev. 4.2.
Does the MPC8560VT833LC include hardware support for IEEE 1588 Precision Time Protocol?
The MPC8560VT833LC does not integrate dedicated IEEE 1588 hardware timestamping logic. However, its dual TSEC Ethernet controllers support precise packet timestamping in software via the e500 core's timebase register and external 1588 grandmaster synchronization over UDP/IP - a method validated in Freescale's AN3647 application note. For hardware-accelerated 1588, designers must use external PHYs like the Marvell 88E1111 with PTP engines, interfaced via the MPC8560VT833LC's RGMII ports.
What is the recommended power-up sequencing order for the MPC8560VT833LC?
The MPC8560VT833LC requires strict power sequencing: VDD and AVDD must ramp first (to 90% of target), followed by GVDD, LVDD, and OVDD simultaneously. Violating this order risks latch-up or undefined reset behavior. The core supply must be 1.2 V ±60 mV (833 MHz grade), while GVDD is fixed at 2.5 V for DDR and LVDD selectable between 2.5 V and 3.3 V for TSEC interfaces - all specified in Section 2.1.2 of the MPC8560VT833LC hardware specs.
Can the MPC8560VT833LC's L2 cache be used as general-purpose SRAM without cache coherency overhead?
Yes - the MPC8560VT833LC's 256 KB L2 memory can be fully configured as non-cacheable, memory-mapped SRAM (single 256 KB block or two 128 KB blocks). In this mode, it operates with byte-accessible ECC protection and supports read-modify-write for sub-cache-line accesses. This configuration eliminates cache coherency traffic and is commonly used for descriptor tables, packet buffers, and CPM DPRAM shadowing - detailed in Section 1.1.3 of the MPC8560VT833LC reference manual.
Is the MPC8560VT833LC pin-compatible with other MPC8560 speed grades like MPC8560VX833LB?
No - the MPC8560VT833LC is not pin-compatible with MPC8560VX833LB or other variants. While all MPC8560 devices use the 783-pin FC-PBGA package, the 'T' suffix denotes thermal-enhanced construction with different thermal pad layout and solder mask design, and the 'X'/'V' suffixes indicate distinct internal bonding and power delivery optimizations. Board-level interchangeability requires validation of power integrity, thermal dissipation, and signal integrity per Freescale's AN3512 layout guidelines for the MPC8560VT833LC.
MPC8560VT833LC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 783-BFBGA, FCBGA
- Series:
- MPC85xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 833MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DDR, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 783-FCPBGA (29x29)
- Additional Interfaces:
- I2C, PCI, RapidIO, SPI, TDM, UART
MPC8560VT833LC FAQ
1.How can I place an order for MPC8560VT833LC through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8560VT833LC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8560VT833LC reliable?
The price and inventory of MPC8560VT833LC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8560VT833LC is usually 5 days.
3.What payment methods are accepted for MPC8560VT833LC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8560VT833LC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8560VT833LC?
MPC8560VT833LC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8560VT833LC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8560VT833LC?
For technical support, including MPC8560VT833LC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8560VT833LC requirements.
6.How does Aetrix verify that MPC8560VT833LC is sourced from the original manufacturer or authorized distributors?
All MPC8560VT833LC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8560VT833LC meets industry standards.
7.What is the process for return or replacement of MPC8560VT833LC?
All MPC8560VT833LC units undergo pre-shipment inspection (PSI). If there is an issue with MPC8560VT833LC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8560VT833LC part is unused and in its original packaging.
Return procedure for MPC8560VT833LC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC8560VT833LC Tags
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