NXP Semiconductors MPC8569VTANKGB

Overview

MPC8569VTANKGB from NXP Semiconductors (formerly Freescale) is a high-performance PowerQUICC III integrated communications processor featuring a 32-bit e500v2 core operating up to 1.33 GHz, dual DDR2/DDR3 memory controllers with full ECC support, integrated QUICC Engine for multi-protocol communications, and hardware-accelerated security engine supporting IPsec, SSL/TLS, and IEEE 802.1ae. It targets carrier-grade networking equipment including edge routers and secure gateways.

For engineers reviewing the MPC8569VTANKGB datasheet, MPC8569VTANKGB pinout, MPC8569VTANKGB application, or MPC8569VTANKGB equivalent, key selection considerations include its 783-pin FC-PBGA package, dual DDR3 interface with 800 MT/s data rate, four Gigabit Ethernet ports via QUICC Engine, hardware crypto acceleration across PKEU/AESU/MDEU/RNG, and 1.0–1.1 V core voltage operation.

Technical Context

The MPC8569VTANKGB implements a superscalar e500v2 core with 36-bit physical addressing, double-precision floating-point APU, and MMU-enabling real-time deterministic execution in telecom control planes. Its on-chip coherency module ensures cache consistency between L1 (32 KB I/D) and unified 512 KB 8-way L2 cache.

Two independent DDR2/DDR3 controllers support 64-bit or dual 32-bit configurations at up to 400 MHz clock (800 MT/s), with full ECC for single-bit correction/double-bit detection and dynamic MCKE-based power-down. The QUICC Engine block integrates four 32-bit RISC cores managing up to four Gigabit Ethernet (SGMII-capable), eight 10/100-Mbps Ethernet, and 16 T1/E1 TDM links.

Key Specifications

Pinout & Package

783-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA), 29 mm × 29 mm body, 1.27 mm ball pitch, RoHS-compliant. Thermal lid enhances heat dissipation in high-throughput routing applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8568EVTANKGB, MPC8569VTANKGB adds hardware crypto acceleration enabling embedded IPsec without performance penalty; compared with LX2160A, it retains legacy Power Architecture toolchain and QUICC Engine's deterministic TDM/Ethernet offload-but lacks modern ARM scalability and DDR4 support.

Availability

MPC8569VTANKGB is available at Aetrix Electronics and suitable for carrier-grade edge routers, secure industrial gateways, multi-service access nodes, and time-sensitive networking bridges requiring stable component supply across extended product lifecycles.

Supply support for MPC8569VTANKGB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and communications infrastructure markets.

The MPC8569VTANKGB belongs to the PowerQUICC III family-designed specifically for highly integrated, low-latency communications processing in carrier and enterprise edge equipment where deterministic real-time performance and hardware-accelerated security are critical.

FAQ

What is the maximum DDR3 data rate supported by the MPC8569VTANKGB?

The MPC8569VTANKGB supports DDR3 operation at up to 400 MHz clock frequency, delivering an effective data rate of 800 MT/s per channel. This is confirmed in Section 2.4 of the official hardware specifications document (MPC8569EEC Rev. 2), which specifies timing parameters for 800 MT/s operation with 64-bit or dual 32-bit bus configurations and full ECC functionality. The MPC8569VTANKGB achieves this using source-synchronous strobes (MDQS) and programmable read/write leveling.

Does the MPC8569VTANKGB include a built-in security engine, and what algorithms does it accelerate?

Yes, the MPC8569VTANKGB includes an integrated Security Engine (SEC) optimized for IPsec, IKE, SSL/TLS, iSCSI, SRTP, IEEE 802.11i, 802.16, 802.1ae (MACSec), 3GPP, A5/3, and GEA3. It features dedicated cryptographic execution units for PKEU, DEU, AESU, AFEU, MDEU, KEU, CRCU, RNG, and SEU-SNOW-as documented in the MPC8569EEC Rev. 2 specification. The MPC8569VTANKGB uses four crypto-channels with multi-command descriptor chains to sustain line-rate encryption at 1 Gbps.

How many Gigabit Ethernet interfaces does the MPC8569VTANKGB support, and how are they implemented?

The MPC8569VTANKGB supports up to four Gigabit Ethernet interfaces, all implemented within the QUICC Engine block-not the main e500v2 core. Two of these can operate in SGMII mode, and all are managed by QUICC Engine's four 32-bit RISC cores. This architecture offloads MAC/PHY framing, checksum calculation, and buffer management from the main CPU, enabling deterministic real-time handling. The MPC8569VTANKGB pinout includes dedicated SGMII differential pairs (e.g., SD_TX[0]/SD_RX[0]) and MII/RMII signals routed to UCC peripherals.

What package type and thermal characteristics apply to the MPC8569VTANKGB?

The MPC8569VTANKGB uses a 783-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA) package measuring 29 mm × 29 mm with 1.27 mm ball pitch. Its thermal design is specified with ΨJB = 1.2 °C/W and ΨJT = 0.6 °C/W (per Section 3.2 of MPC8569EEC Rev. 2), and it requires a heatsink for operation above 75°C ambient in sustained 1.33 GHz operation. The "TANK" suffix denotes enhanced thermal lid construction, critical for telecom applications with limited airflow.

Is the MPC8569VTANKGB pin-compatible with other PowerQUICC III processors like the MPC8548?

No, the MPC8569VTANKGB is not pin-compatible with the MPC8548 or other PowerQUICC III variants. It uses a unique 783-pin FC-PBGA footprint with distinct signal assignments-including dual DDR3 interfaces, expanded QUICC Engine I/O (QE_PA/PB/PC/PD/PE/PF), and additional SerDes lanes-documented in Table 1 of the MPC8569EEC Rev. 2 pinout listing. Board-level migration from MPC8548 to MPC8569VTANKGB requires complete PCB redesign due to incompatible ball map, power rail distribution, and routing topology.