NXP Semiconductors MPC8572ECLVJAULE

Overview

MPC8572ECLVJAULE from NXP is a dual-core Power Architecture® e500-based integrated communications processor with two 32-bit Book E-enhanced cores, 1 Mbyte shared L2 cache/SRAM with full ECC, dual 64-bit DDR2/DDR3 memory controllers (supporting up to 16 Gbytes per controller), four enhanced three-speed Ethernet controllers (eTSECs), integrated security engine (SEC) with AES/SHA/RSA acceleration, and Serial RapidIO® 1.2 + PCI Express 1.0a interfaces - deployed in carrier-grade networking, secure gateways, and industrial control systems.

For engineers reviewing the MPC8572ECLVJAULE datasheet, MPC8572ECLVJAULE pinout, MPC8572ECLVJAULE application, or MPC8572ECLVJAULE equivalent, key selection considerations include dual-core deterministic real-time performance, hardware-accelerated IPsec/SSL/TLS offload, DDR3-1333 support with on-die termination, 1023-pin FC-PBGA package thermal profile, and SEC crypto-channel concurrency for high-throughput encrypted traffic processing.

Technical Context

The MPC8572ECLVJAULE implements two identical e500v2 cores with independent 32-Kbyte L1 instruction and data caches (parity-protected), SPE and double-precision floating-point APUs, and a unified 36-bit real address space managed by an embedded MMU supporting 4-Kbyte to 4-Gbyte page sizes. Its coherency is maintained via the e500 Coherency Module (ECM).

Memory subsystem includes dual 64-bit DDR2/DDR3 controllers with full ECC, programmable timing, up to 32 open pages, and battery-backed memory support; the 1-Mbyte L2 cache/SRAM operates in flexible configuration modes (cache-only, SRAM-only, or hybrid), with eight-way set-associative organization, line-level locking, and stashing capability for external masters.

Key Specifications

Pinout & Package

The MPC8572ECLVJAULE is housed in a 1023-pin FC-PBGA package (35 mm × 35 mm, 1.0 mm ball pitch) with thermal lid and defined power/ground ball mapping per NXP MPC8572EEC Rev. 7 Section 18. Pin functions are multiplexed across high-speed serial, memory, and peripheral interfaces; exact terminal assignment requires reference to the official pinout diagram (Figure 18-1, MPC8572EEC Rev. 7).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core communications processor applications.

Compared with MPC8572ECLVJALUE and MPC8572EVRAG, the MPC8572ECLVJAULE provides identical core functionality and performance but ensures RoHS compliance, MSL 4 handling robustness, and documented Pb-free reflow compatibility - critical for volume manufacturing in regulated markets.

Availability

MPC8572ECLVJAULE is available at Aetrix Electronics and suitable for secure networking equipment, industrial protocol gateways, carrier media servers, and ruggedized wireless backhaul systems requiring stable component supply across long product lifecycles.

Supply support for MPC8572ECLVJAULE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and communications markets.

The MPC8572ECLVJAULE belongs to NXP's PowerQUICC III family - designed specifically for high-performance, secure, and scalable communications processing in carrier-grade infrastructure where deterministic real-time response, hardware crypto acceleration, and multi-protocol I/O concurrency are mandatory.

FAQ

What is the maximum DDR3 data rate supported by the MPC8572ECLVJAULE?

The MPC8572ECLVJAULE supports DDR3-1333 (667 MHz clock, 1333 MT/s) with full ECC, on-die termination, and programmable timing parameters. It achieves this using its dual 64-bit DDR3 controllers, each capable of 10.6 GB/s peak bandwidth. The MPC8572ECLVJAULE datasheet (Section 6) confirms support for 1.5-V DDR3 operation with auto-refresh, self-refresh sleep mode, and registered DIMM compatibility - all validated under TJ = 105°C and GVDD = 1.5 V ± 75 mV.

Does the MPC8572ECLVJAULE include hardware cryptographic acceleration?

Yes, the MPC8572ECLVJAULE integrates a dedicated Security Engine (SEC) with four concurrent crypto-channels supporting AES-128/192/256 (GCM, CCM, CTR), SHA-1/256/384/512, RSA-4096, ECC, HMAC, and CRC-32/CRC-32C. This allows the MPC8572ECLVJAULE to sustain >1 Gbps encrypted throughput while freeing both e500 cores for application-layer tasks - a capability confirmed in Section 4 of the MPC8572EEC Rev. 7 specification.

What package type and pin count does the MPC8572ECLVJAULE use?

The MPC8572ECLVJAULE uses a 1023-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA) package measuring 35 mm × 35 mm with 1.0 mm ball pitch and integrated thermal lid. This package is defined in Section 18 of the MPC8572EEC Rev. 7 document and supports JEDEC-standard reflow profiles for Pb-free assembly. Pin assignments are fully documented in Figure 18-1, including dedicated VDD, GVDD, LVDD, and OVDD power balls grouped for low-noise distribution.

Can the MPC8572ECLVJAULE operate in both PCI Express root complex and endpoint modes?

Yes, each of the three PCI Express 1.0a controllers on the MPC8572ECLVJAULE can be independently configured as either root complex or endpoint via configuration space registers. This flexibility is specified in Section 16 of the MPC8572EEC Rev. 7 document and enables the MPC8572ECLVJAULE to serve as host processor in switch fabrics or as intelligent endpoint in modular line cards - with full x1/x2/x4/x8 link width auto-negotiation and 256-byte maximum payload size.

What is the junction temperature rating for the MPC8572ECLVJAULE?

The MPC8572ECLVJAULE has a rated junction temperature range of 0°C to +105°C, as specified in Table 2 (Recommended Operating Conditions) of the MPC8572EEC Rev. 7 datasheet. Thermal design must maintain TJ ≤ 105°C under worst-case load, verified using the device's on-die diode sensor and thermal resistance values (θJA = 11.5°C/W typical, θJC = 0.5°C/W) provided in Section 20. Operation outside this range may cause permanent damage or functional failure.