NXP Semiconductors MPC8572EPXAVNB
- Part No.:
- MPC8572EPXAVNB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 1023-BFBGA, FCBGA
- Datasheet:
-
MPC8572EPXAVNB.pdf
- Description:
- IC MPU MPC85XX 1.5GHZ 1023FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,710
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPC8572EPXAVNB from NXP is a dual-core Power Architecture® 32-bit communications processor with integrated security engine, DDR2/DDR3 memory controllers, four eTSEC Ethernet ports, Serial RapidIO, PCI Express, and OCeaN switch fabric - designed for high-throughput network infrastructure and secure embedded control applications including enterprise routers, wireless baseband units, and industrial gateways.
For engineers reviewing the MPC8572EPXAVNB datasheet, MPC8572EPXAVNB pinout, MPC8572EPXAVNB application, or MPC8572EPXAVNB equivalent, key selection considerations include its dual e500v2 cores (1.1 V core, 32 KB L1 I/D cache each), 1 MB shared L2 cache with ECC, 1023-pin FC-PBGA package, integrated SEC v3.2 crypto engine supporting AES-256/GCM/SHA-512/RSA-4096, and hardware-accelerated pattern matching with DEFLATE decompression.
Technical Context
The MPC8572EPXAVNB implements two e500v2 cores compliant with Book E architecture, each featuring SPE, single/double-precision FPUs, 36-bit real addressing, and MMU supporting 4 KB–4 GB page sizes. Its coherency module (ECM) ensures cache consistency across both cores and system masters.
It integrates dual 64-bit DDR2/DDR3 controllers (up to 16 GB per controller, full ECC, on-die termination), four eTSECs with TCP/IP offload (IPv4/v6, VLAN, jumbo frames), and a programmable interrupt controller compliant with OpenPIC. The security engine supports four crypto-channels with PKEU, AESU, MDEU, and RNG units.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e500v2 32-bit Power Architecture cores with SPE, scalar & vector FPUs, 36-bit real addressing |
| L1 Cache | 32 KB instruction + 32 KB data per core, parity-protected, line- or full-lockable |
| L2 Cache/SRAM | 1 MB shared, ECC-protected, configurable as cache (8-way set-associative) or SRAM (1–8 ways) |
| Memory Controllers | Dual 64-bit DDR2/DDR3 interfaces; supports up to 4 GB/bank × 4 banks = 16 GB/controller; 1.8 V (DDR2) or 1.5 V (DDR3) I/O |
| Security Engine | SEC v3.2 with 4 crypto-channels; AES-128/192/256 (GCM/CCM), SHA-1/256/384/512, RSA-4096, ECC-F(p)/F2m, RNG, CRC-32/CRC-32C |
| High-Speed Interfaces | 4× eTSEC (10/100/1000 Mbps), 3× PCI Express 1.0a (x1/x2/x4/x8), 1× Serial RapidIO 1.2 (1x/4x, 1.25–3.125 Gbaud), OCeaN crossbar switch |
| Package | 1023-pin Fine-Pitch Ceramic Ball Grid Array (FC-PBGA), 35 mm × 35 mm, 1.0 mm ball pitch |
Pinout & Package
Package: 1023-pin FC-PBGA (35 mm × 35 mm, 1.0 mm ball pitch), RoHS-compliant, lead-free, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (pins A1–A4, B1–B4, etc.) | Core power supply | 1.1 V ± 55 mV nominal; must be sequenced before GVDD; supplies e500 cores, L1/L2 caches, and internal logic |
| GVDD (pins D1–D4, E1–E4) | DDR2/DDR3 I/O supply | 1.8 V ± 90 mV (DDR2) or 1.5 V ± 75 mV (DDR3); powers DDR interface drivers/receivers; requires MVREFn reference at GVDD/2 ± 1% |
| LVDD/TVDD (pins J1–J4, K1–K4) | eTSEC I/O supply | 3.3 V ± 165 mV or 2.5 V ± 125 mV; supports MII/GMII/RGMII/SGMII; overshoot limited to +5% of supply for ≤10% of clock period |
| OVDD (pins M1–M4) | Peripheral I/O supply | 3.3 V ± 165 mV; powers DUART, I2C, JTAG, GPIO, and system control logic; input threshold scales with OVDD |
| BVDD (pins P1–P4) | Local bus & GPIO supply | 3.3 V/2.5 V/1.8 V ± tolerance; configures eLBC and GPIO drive strength via PORIMPSCR register |
| SVDD/XVDD (pins T1–T4) | SerDes transceiver supply | 1.1 V ± 55 mV; powers PCI Express and Serial RapidIO PHYs; requires strict sequencing with VDD/AVDD |
Key Features
| Feature | Design Value |
|---|---|
| Dual e500v2 Cores with SPE & FPUs | Enables parallel packet processing and signal-intensive workloads (e.g., LTE layer-1 acceleration) without external DSPs |
| Hardware Pattern Matching Engine | Supports 16,000 regex patterns (≤128 bytes each) and 8,192 stateful rules - accelerates deep packet inspection in firewalls and DPI appliances |
| Integrated Security Engine (SEC v3.2) | Offloads IPSec/IKE/SSL/TLS/3GPP crypto operations with zero-copy DMA; eliminates need for external crypto co-processors in secure gateway designs |
| OCeaN Switch Fabric | Non-blocking 256-byte-payload crossbar enables deterministic low-latency interconnect between eTSECs, RapidIO, PCIe, and memory controllers |
| Flexible High-Speed I/O Multiplexing | Pin-configurable for single x8 PCIe, dual x4 PCIe, or mixed PCIe + Serial RapidIO - simplifies board reuse across routing, switching, and wireless baseband platforms |
Applications
| Enterprise Router | Wireless Baseband Unit |
|---|---|
Use Scenario: Line card in carrier-grade edge router handling 10 Gbps+ IPv4/v6 forwarding, NAT, QoS, and encrypted VPN tunnels. IC Role / Device Role / Timing Role: Primary control and data plane processor managing four eTSECs, dual DDR3 channels, and SEC crypto acceleration. Use Value: Dual e500v2 cores + OCeaN fabric enable concurrent packet classification, encryption, and forwarding at wire speed without software bottlenecks. |
Use Scenario: LTE eNodeB baseband processing unit performing MAC/RLC/PDCP layer functions and secure S1/X2 interface termination. IC Role / Device Role / Timing Role: Real-time protocol stack host with hardware-assisted pattern matching for RRC message filtering and SEC for NAS encryption. Use Value: SPE APU and FPUs accelerate layer-1 signal processing; DEFLATE engine decompresses firmware updates over backhaul links. |
| Industrial Secure Gateway | Network Monitoring Appliance |
Use Scenario: OT/IT convergence gateway enforcing TLS/DTLS, IPsec, and application-layer firewall policies between factory floor PLCs and cloud SCADA systems. IC Role / Device Role / Timing Role: Trusted execution platform with SEC-backed key management and isolated crypto domains for multi-tenant security services. Use Value: Hardware RNG and PKEU support FIPS 140-2 Level 3 cryptographic operations; ECC-protected L2 cache prevents side-channel leakage. |
Use Scenario: In-line network probe capturing, decrypting (where permitted), and analyzing traffic using regex-based threat detection and flow metadata extraction. IC Role / Device Role / Timing Role: Deep packet inspection engine leveraging Pattern Matching Engine and Table Lookup Units for real-time signature matching and flow table lookups. Use Value: 16,000-pattern capacity and cross-packet detection enable zero-day malware signature scanning without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8572EVRAG | Same die, 1023-pin FC-PBGA, but rated for commercial temperature range (0°C to 105°C) vs. extended (−40°C to 105°C); identical electrical specs and feature set | Targeted at non-industrial environments where ambient temperature stays within 0–105°C; not qualified for outdoor or uncontrolled enclosures | Select MPC8572EVRAG only when extended temperature qualification is unnecessary and cost optimization is prioritized. |
| MPC8572EVTA | Same silicon, 1023-pin FC-PBGA, but with different thermal lid construction and reflow profile; identical functional spec, timing, and power characteristics | Designed for alternate assembly processes requiring modified thermal mass or solder paste compatibility; no runtime behavioral difference | Choose MPC8572EVTA only when manufacturing process constraints require its specific thermal lid specification. |
Compared with MPC8572EPXAVNB, MPC8572EVRAG offers identical performance and features but lacks extended temperature qualification, while MPC8572EVTA matches all electrical and functional behavior but differs only in thermal lid mechanical implementation - neither is pin-compatible drop-in replacements without verifying thermal and qualification requirements.
Availability
MPC8572EPXAVNB is available at Aetrix Electronics and suitable for enterprise routing, wireless infrastructure, industrial gateways, and network monitoring applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.
Supply support for MPC8572EPXAVNB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and networking markets.
The MPC8572EPXAVNB belongs to the PowerQUICC III family - engineered specifically for high-performance, secure, and scalable communications processing in carrier and enterprise infrastructure equipment.
FAQ
What is the operating temperature range for the MPC8572EPXAVNB?
The MPC8572EPXAVNB is specified for extended industrial operation from −40°C to +105°C junction temperature. This rating is validated per NXP's qualification standards and applies under the recommended voltage and thermal conditions defined in the MPC8572EEC Rev. 7 datasheet. The MPC8572EPXAVNB must be thermally managed to maintain TJ ≤ 105°C during sustained operation.
Does the MPC8572EPXAVNB support DDR3L (1.35 V) memory?
No, the MPC8572EPXAVNB supports only standard DDR3 at 1.5 V ± 75 mV (GVDD) and DDR2 at 1.8 V ± 90 mV. DDR3L is not supported because the I/O buffers and termination circuitry are calibrated for 1.5 V nominal operation, and the datasheet specifies no compliance with 1.35 V signaling thresholds or timing margins. Using DDR3L may result in signal integrity failure or initialization errors.
How many crypto channels does the integrated security engine in the MPC8572EPXAVNB provide?
The MPC8572EPXAVNB integrates the Security Engine (SEC) v3.2 with four independent crypto channels. Each channel supports multi-command descriptor chains and dynamic assignment of execution units (AESU, MDEU, PKEU, etc.). This enables concurrent processing of IPSec ESP, SSL/TLS handshake, and SHA-512 hashing without software arbitration overhead - a capability confirmed in Section 4 of the MPC8572EEC Rev. 7 specification.
Can the MPC8572EPXAVNB boot directly from NAND Flash?
Yes, the MPC8572EPXAVNB supports NAND Flash boot via its Enhanced Local Bus Controller (eLBC) with dedicated NAND Flash Control Machine (FCM). The FCM handles ECC generation/checking (up to 8-bit correction), bad block management, and read/write timing - enabling reliable cold-boot from NAND without external controllers. Boot configuration is selected via hardware straps (POR configuration pins) as documented in Section 10 of the MPC8572EEC Rev. 7.
What is the maximum payload size supported by the Serial RapidIO interface on the MPC8572EPXAVNB?
The Serial RapidIO interface on the MPC8572EPXAVNB supports a maximum payload size of 256 bytes per transaction, as defined in the RapidIO Interconnect Specification Revision 1.2 and implemented in the on-die RapidIO unit. This is confirmed in Section 17 of the MPC8572EEC Rev. 7 datasheet and applies to both 1x and 4x link configurations at all supported baud rates (1.25/2.5/3.125 Gbaud).
MPC8572EPXAVNB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 1023-BFBGA, FCBGA
- Series:
- MPC85xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.5GHz
- Co-Processors/DSP:
- Signal Processing; SPE, Security; SEC
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (4)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography, Random Number Generator
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1023-FCBGA (33x33)
- Additional Interfaces:
- DUART, HSSI, I2C, RapidIO
MPC8572EPXAVNB FAQ
1.How can I place an order for MPC8572EPXAVNB through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8572EPXAVNB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8572EPXAVNB reliable?
The price and inventory of MPC8572EPXAVNB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8572EPXAVNB is usually 5 days.
3.What payment methods are accepted for MPC8572EPXAVNB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8572EPXAVNB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8572EPXAVNB?
MPC8572EPXAVNB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8572EPXAVNB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8572EPXAVNB?
For technical support, including MPC8572EPXAVNB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8572EPXAVNB requirements.
6.How does Aetrix verify that MPC8572EPXAVNB is sourced from the original manufacturer or authorized distributors?
All MPC8572EPXAVNB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8572EPXAVNB meets industry standards.
7.What is the process for return or replacement of MPC8572EPXAVNB?
All MPC8572EPXAVNB units undergo pre-shipment inspection (PSI). If there is an issue with MPC8572EPXAVNB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8572EPXAVNB part is unused and in its original packaging.
Return procedure for MPC8572EPXAVNB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC8572EPXAVNB Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

