NXP Semiconductors MPC8572EVJATLE

Overview

MPC8572EVJATLE from NXP is a dual-core Power Architecture® 32-bit communications processor with two e500v2 cores, 1 MB shared L2 cache/SRAM with full ECC, dual 64-bit DDR2/DDR3 memory controllers supporting up to 32 GB total, integrated security engine (SEC) with AES, SHA-2, RSA up to 4096-bit, and four enhanced three-speed Ethernet controllers (eTSEC) for 10/100/1000 Mbps routing and firewall applications.

For engineers reviewing the MPC8572EVJATLE datasheet, MPC8572EVJATLE pinout, MPC8572EVJATLE application, or MPC8572EVJATLE equivalent, key selection criteria include dual-core deterministic real-time performance, hardware-accelerated IPsec/SSL/TLS offload, DDR3-1333 support with ECC, PCI Express 1.0a x8 root complex capability, and 1023-pin FC-PBGA thermal-mechanical reliability in telecom control plane designs.

Technical Context

The MPC8572EVJATLE implements two identical e500v2 cores compliant with Book E architecture, each with 32-Kbyte L1 instruction and data caches with parity, SPE APU for 64-bit integer/fractional operations, and embedded single/double-precision floating-point units. The coherency module (ECM) ensures cache consistency across both cores and external masters.

Its memory subsystem integrates two independent 64-bit DDR2/DDR3 controllers with programmable timing, 4-bank support per controller, on-die termination, and auto-refresh - all operating at 1.5 V (DDR3) or 1.8 V (DDR2) I/O voltage. The integrated OCeaN switch fabric enables low-latency packet reordering between eTSECs, RapidIO, and PCI Express endpoints.

Key Specifications

Pinout & Package

Package: 1023-pin FC-PBGA (35 mm × 35 mm, 1.0 mm pitch), thermally enhanced with exposed thermal pad. Designed for industrial temperature range (–40°C to +105°C junction).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8572EVJATLE, MPC8572EVTATL offers identical functionality but differs in solder finish and moisture sensitivity, while MPC8548CZQAA sacrifices pattern matching, dual-core concurrency, and RapidIO to reduce footprint and power - making it viable only in lower-bandwidth, single-threaded control applications.

Availability

MPC8572EVJATLE is available at Aetrix Electronics and suitable for telecom infrastructure, secure network appliances, industrial routers, and ruggedized wireless backhaul systems requiring stable component supply across extended product lifecycles.

Supply support for MPC8572EVJATLE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and networking markets.

The MPC8572EVJATLE belongs to NXP's PowerQUICC III family - designed specifically for high-performance, secure, and deterministic communications processing in carrier-grade and mission-critical embedded systems.

FAQ

What is the maximum DDR3 data rate supported by MPC8572EVJATLE?

The MPC8572EVJATLE supports DDR3-1333 (667 MHz clock, 1333 MT/s) with 64-bit bus width per controller. It achieves this using 1.5 V ±75 mV GVDD supply, on-die termination, and programmable read/write leveling - validated per JEDEC DDR3L specification. Each controller delivers up to 10.6 GB/s theoretical bandwidth, confirmed in NXP's MPC8572EEC Rev. 7 hardware spec, Section 6.

Does MPC8572EVJATLE support PCIe Gen2 or only Gen1?

MPC8572EVJATLE supports only PCI Express 1.0a (Gen1) at 2.5 GT/s per lane, as explicitly stated in Section 16 of the MPC8572EEC Rev. 7 specification. It does not implement Gen2 (5.0 GT/s) features such as receiver equalization, ASPM L1 substates, or enhanced transaction ordering - confirmed by electrical timing tables and link training flow diagrams in the same document.

Can MPC8572EVJATLE boot directly from NAND flash?

Yes, MPC8572EVJATLE can boot directly from NAND flash using its integrated NAND Flash Control Machine (FCM) within the enhanced Local Bus Controller (eLBC). Boot mode is selected via hardware strapping pins (PORCFG[11:8]), and the boot sequencer initializes NAND geometry, ECC parameters, and bad-block management before loading the initial firmware image - detailed in Section 5 and Appendix A of MPC8572EEC Rev. 7.

What is the thermal design power (TDP) of MPC8572EVJATLE at 1.5 GHz?

At 1.5 GHz core frequency, 105°C junction temperature, and typical workload (Dhrystone), the MPC8572EVJATLE exhibits 12.8 W typical power dissipation for the core complex bus (CCB), excluding I/O rail contributions. This value is derived from Table 4 in Section 3 of MPC8572EEC Rev. 7, and assumes 1.1 V ±55 mV VDD, DDR3-1066 operation, and enabled L2 cache - verified under JEDEC JESD51-2A test conditions.

Is MPC8572EVJATLE pin-compatible with MPC8572EVTATL?

Yes, MPC8572EVJATLE and MPC8572EVTATL share identical 1023-pin FC-PBGA mechanical footprint, ball map, and signal assignment - confirmed in Section 18 ("Package Description") of MPC8572EEC Rev. 7. The sole difference is surface finish: MPC8572EVJATLE uses lead-free (Pb-free) solder balls (JEDEC MSL 4), while MPC8572EVTATL uses SnPb (MSL 3). No PCB redesign is needed for substitution.