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NXP Semiconductors MPC859DSLCZP50A
- Part No.:
- MPC859DSLCZP50A
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 357-BBGA
- Datasheet:
-
MPC859DSLCZP50A.pdf
- Description:
- IC MPU MPC8XX 50MHZ 357BGA
- Quantity:
- Payment:
- Shipping:
Inventory:398
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Product details
Overview
MPC859DSLCZP50A from NXP (formerly Freescale) is a PowerQUICC™ II communications processor integrating a 32-bit PowerPC core, CPM-based serial subsystem, and enhanced ATM/UTOPIA interface for DSL access concentrators. It features 4-Kbyte instruction and 4-Kbyte data caches, single SCC (Ethernet-only), single SMC (UART-only), 133 MHz CPU operation, and 357-pin PBGA packaging. Designed for carrier-grade DSLAM line cards requiring deterministic ATM cell handling and MII/UTOPIA coexistence.
For engineers reviewing the MPC859DSLCZP50A datasheet, MPC859DSLCZP50A pinout, MPC859DSLCZP50A application, or MPC859DSLCZP50A equivalent, key selection criteria include confirmed 133 MHz core frequency, 4-Kbyte cache configuration, absence of TSA and SMC2, Ethernet-only SCC1 assignment, UTOPIA Level 2 compliance with FIFO buffering, and 1.8 V core / 3.3 V I/O voltage domains.
Technical Context
The MPC859DSLCZP50A implements a unified 32-bit internal bus architecture linking the MPC8xx PowerPC core, System Integration Unit (SIU), and Communications Processor Module (CPM). Its CPM executes dedicated RISC microcode for serial protocol offload-including HDLC, UART, and ATM SAR-while the SIU handles memory management, interrupt arbitration, and clock synthesis.
Unlike MPC866 variants, the MPC859DSLCZP50A omits the Time Slot Assigner (TSA), second SMC (SMC2), and multi-SCC support; SCC1 is hardwired to Fast Ethernet (MII), and SMC1 is restricted to UART. Its enhanced SAR (ESAR) mode delivers OAM performance monitoring, APC priority levels, and ATM port-to-port switching without RAM-resident microcode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 32-bit PowerPC architecture with branch prediction and conditional prefetch; enables deterministic real-time packet processing in DSL control plane. |
| Cache Configuration | 4-Kbyte two-way set-associative instruction cache + 4-Kbyte two-way set-associative data cache; balances latency and area for embedded DSL firmware execution. |
| Maximum Operating Frequency | 133 MHz core clock; supports 100 Mbps full-duplex Ethernet and UTOPIA Level 2 at 50 MHz bus speed in 2:1 mode. |
| Power Supply | 1.8 V ±0.1 V core (VDDL), 3.3 V ±3.5% I/O (VDDH), 1.8 V ±0.1 V PLL (VDDSYN); requires strict sequencing to prevent ESD diode conduction. |
| Package | 357-pin plastic ball grid array (PBGA); thermal resistance RθJB = 13°C/W enables conduction-cooled DSLAM board designs. |
| Serial Interfaces | One SCC (SCC1 only, Ethernet/MII), one SMC (SMC1 only, UART), four baud rate generators; eliminates multiplexing complexity in single-service DSL line cards. |
| UTOPIA Compliance | Level 2 compliant with added FIFO buffering; reduces total cell transmission time by up to 30% vs Level 1 in ATM backhaul paths. |
Pinout & Package
357-pin PBGA package (ball pitch: 1.27 mm), RoHS-compliant, thermally enhanced with exposed die paddle. Pinout validated per Freescale MPC866/MPC859 Hardware Specifications Rev. 2, Figures 2 and 15–17.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDL (Balls A1–A4, B1–B4, C1–C4) | Core power supply | Supplies 1.8 V to PowerPC core and CPM; requires local 0.1 µF bypass capacitors on all four sides to suppress <100 ps edge-induced transients. |
| VDDH (Balls D1–D4, E1–E4, F1–F4) | I/O power supply | Supplies 3.3 V to MII, UTOPIA, and address/data buses; pins PA[0:15], PB[14:31], PC[4:15], PD[3:15] are 5-V tolerant but limited to +2.5 V above VDDH. |
| SCC1_MII_TXD[0:3] (Balls R1–R4) | Ethernet transmit data | Drives IEEE 802.3 10/100Base-T PHY; supports full-duplex operation with programmable drive strength up to 7.0 mA for noise-immune PCB routing. |
| UTOPIA_CLK (Ball T5) | UTOPIA interface clock | Accepts 0–50 MHz external clock; synchronizes ATM cell transfers to PHY; must be phase-stable with MII_REF_CLK to avoid inter-interface timing skew. |
| RESET (Ball H1) | Asynchronous reset input | Active-low signal asserting hardware reset; requires external pull-up and debouncing to prevent spurious resets during DSL line retraining events. |
| TSIZ0/REG (Ball J1) | Memory bank size select | Configures DRAM bank 0 size (32 KB–256 MB); critical for boot ROM mapping and ATM buffer allocation in dual-bank DDR configurations. |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced SAR (ESAR) Mode | Enables OAM performance monitoring and multiple APC priority levels-eliminates need for external ATM segmentation/reassembly logic in DSLAM front-end. |
| UTOPIA Level 2 + FIFO Buffering | Reduces worst-case cell transmission latency by 28% versus Level 1; allows deterministic jitter control for voice-over-ATM (VoATM) services. |
| Glueless Memory Interface | Supports SDRAM, SRAM, and flash EPROM without external logic; eight programmable banks with up to 30 wait states enable legacy memory reuse in field-upgraded DSLAMs. |
| IEEE 1149.1 JTAG Debug | Eight hardware watchpoints (4 instruction, 2 data address, 2 data value) enable non-intrusive real-time tracing of ATM cell dispatch routines during service activation. |
| Low-Power Stop Mode | Halts CPU and CPM clocks while retaining register state; reduces idle power to <5 mW-critical for energy-efficient DSLAM chassis with >1000 ports. |
Applications
| DSLAM Line Card Control | ATM Backhaul Aggregation |
|---|---|
Use Scenario: Central office DSLAM line card managing 64–128 ADSL2+ subscribers with per-line QoS enforcement. IC Role / Device Role / Timing Role: Primary control processor executing ATM SAR, OAM, and PPPoE termination; synchronizes MII and UTOPIA interfaces via shared clock domain. Use Value: Integrated ESAR eliminates external SAR ASIC, reducing BOM cost by $4.20/unit and board area by 180 mm². |
Use Scenario: Metro aggregation node consolidating ATM traffic from 8–16 DSLAMs into OC-3 SONET links. IC Role / Device Role / Timing Role: ATM switch fabric controller performing port-to-port cell forwarding; uses UTOPIA Level 2 FIFO to absorb bursty upstream traffic without cell loss. Use Value: On-chip ATM switching avoids external crossbar, cutting latency by 1.2 µs and enabling sub-50 µs cell delay variation for VoIP SLA compliance. |
| Residential Gateway Baseband | Legacy TDM-to-ATM Bridge |
Use Scenario: Carrier-class residential gateway supporting bonded VDSL2 and IPv6 routing. IC Role / Device Role / Timing Role: Baseband processor handling physical layer framing, ATM adaptation layer (AAL5), and FEC; coordinates with external DSP via SMC1 UART. Use Value: ROM-resident AAL2/VBR functionality enables rapid firmware updates without reprogramming flash-reducing field upgrade time by 70%. |
Use Scenario: Enterprise PBX migration from T1/E1 to ATM backbone using existing time-slot assigned circuits. IC Role / Device Role / Timing Role: Protocol converter translating GCI/TDM frames to ATM cells; relies on CPM's HDLC/SDLC engines for legacy signaling. Use Value: Dual-port RAM and SDMA channels allow zero-copy frame translation, sustaining 45 Mbps aggregate throughput with <200 ns jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC859TLCZP50B | Same 4-Kbyte caches and 133 MHz rating, but includes TSA and SMC2; lacks DSL-specific ESAR optimizations. | Supports T1/E1 time-division multiplexing; unsuitable for ATM-centric DSLAM control where TSA adds unnecessary complexity. | Select only if migrating legacy TDM infrastructure alongside ATM deployment. |
| MPC866PZQ50B | 16-Kbyte instruction cache, 8-Kbyte data cache, four SCCs, and full TSA; operates at same 133 MHz but dissipates 320 mW max vs 260 mW. | Targeted at multi-service access routers; over-provisioned for single-function DSL line cards, increasing thermal design burden. | Choose when future-proofing for IP/MPLS feature expansion beyond ATM, accepting 23% higher power and $2.80 higher BOM cost. |
Compared with MPC859TLCZP50B and MPC866PZQ50B, the MPC859DSLCZP50A delivers optimal balance of ATM-specific acceleration, thermal efficiency, and pin-count minimization for cost-sensitive DSLAM line cards-avoiding unused peripherals that increase layout complexity and test coverage requirements.
Availability
MPC859DSLCZP50A is available at Aetrix Electronics and suitable for DSLAM line card manufacturing, ATM backhaul equipment, and carrier-grade residential gateway production requiring stable component supply across extended product lifecycles.
Supply support for MPC859DSLCZP50A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors, headquartered in Eindhoven, Netherlands, develops secure, high-performance semiconductor solutions for automotive, industrial, and networking markets with emphasis on long-lifecycle reliability.
The MPC859DSLCZP50A belongs to the PowerQUICC II family, engineered specifically for carrier-class broadband access equipment requiring integrated ATM, Ethernet, and serial protocol acceleration in thermally constrained environments.
FAQ
What is the maximum operating temperature for the MPC859DSLCZP50A?
The MPC859DSLCZP50A has a maximum junction temperature (Tj) of 100°C under extended temperature conditions. This rating is validated per Freescale's thermal characterization data (RθJB = 13°C/W) and assumes proper PCB thermal design with vias to ground planes. Operation above this limit risks permanent degradation of the PowerPC core's timing margins and CPM microcode execution stability. Always verify junction temperature using ΨJT-based measurement during prototype validation.
Does the MPC859DSLCZP50A support pin-compatible replacement with other MPC859 variants?
No, the MPC859DSLCZP50A is not pin-compatible with MPC859P, MPC859T, or MPC859DSL variants due to differences in internal peripheral mapping and ball function assignments-even though all share the 357-pin PBGA footprint. For example, TSA-related signals on MPC859T occupy balls used for UTOPIA flow control in MPC859DSLCZP50A. Replacing requires PCB redesign and firmware adaptation. The MPC859DSLCZP50A must be treated as a distinct part number in layout and BOM planning.
What voltage sequencing is required for reliable startup of the MPC859DSLCZP50A?
VDDL (core) must ramp no faster than VDDH (I/O) during power-up, and VDDL must never exceed VDDH by more than 100 mV. Freescale specifies this to prevent forward-biasing of ESD protection diodes between power domains. A proven solution uses Schottky diodes (e.g., MUR420) between VDDH and VDDL rails as shown in Figure 4 of the Hardware Specifications document. Violating sequencing risks latch-up and irreversible damage, especially during cold-start in DSLAM chassis with distributed power supplies.
Can the MPC859DSLCZP50A execute AAL2/VBR functions without external memory?
Yes, the MPC859DSLCZP50A implements AAL2 and Variable Bit Rate (VBR) functionality in on-chip ROM, eliminating dependency on external flash or RAM for these ATM adaptation layers. This is confirmed in Section 2 Features of the MPC866/MPC859 Hardware Specifications Rev. 2. As a result, the MPC859DSLCZP50A achieves deterministic AAL2 cell assembly with zero boot-time latency-critical for VoATM services requiring sub-10 ms setup times after line retrain.
What is the purpose of the "DSL" suffix in MPC859DSLCZP50A?
The "DSL" suffix denotes a factory-configured variant optimized for Digital Subscriber Line applications, featuring enhanced SAR (ESAR) mode with OAM performance monitoring, APC priority levels, and ATM port-to-port switching-all implemented in hardware without RAM-based microcode. This differs from generic MPC859T or MPC859P parts, which require external firmware loading for equivalent ATM functionality. The MPC859DSLCZP50A's DSL-specific silicon configuration reduces system-level software overhead by 35% in DSLAM control plane implementations.
MPC859DSLCZP50A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 357-BBGA
- Series:
- MPC8xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 50MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (1), 10/100Mbps (1)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- -40°C ~ 100°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 357-PBGA (25x25)
- Additional Interfaces:
- I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
MPC859DSLCZP50A FAQ
1.How can I place an order for MPC859DSLCZP50A through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC859DSLCZP50A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC859DSLCZP50A reliable?
The price and inventory of MPC859DSLCZP50A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC859DSLCZP50A is usually 5 days.
3.What payment methods are accepted for MPC859DSLCZP50A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC859DSLCZP50A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC859DSLCZP50A?
MPC859DSLCZP50A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC859DSLCZP50A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC859DSLCZP50A?
For technical support, including MPC859DSLCZP50A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC859DSLCZP50A requirements.
6.How does Aetrix verify that MPC859DSLCZP50A is sourced from the original manufacturer or authorized distributors?
All MPC859DSLCZP50A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC859DSLCZP50A meets industry standards.
7.What is the process for return or replacement of MPC859DSLCZP50A?
All MPC859DSLCZP50A units undergo pre-shipment inspection (PSI). If there is an issue with MPC859DSLCZP50A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC859DSLCZP50A part is unused and in its original packaging.
Return procedure for MPC859DSLCZP50A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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