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NXP Semiconductors MPC859TVR133A-NXP
- Part No.:
- MPC859TVR133A-NXP
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 357-BBGA
- Datasheet:
-
MPC859TVR133A-NXP.pdf
- Description:
- POWERQUICC 32 BIT POWER ARCHITEC
- Quantity:
- Payment:
- Shipping:
Inventory:4,132
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Product details
Overview
MPC859TVR133A-NXP from NXP (formerly Freescale) is a PowerQUICC™ II communications processor integrating a 32-bit PowerPC core, CPM-based serial peripherals, and Fast Ethernet controller. It operates at 133 MHz CPU frequency with 4-Kbyte instruction and 4-Kbyte data caches, 1.8-V core / 3.3-V I/O supply, and supports UTOPIA Level 2 and MII interfaces for ATM/DSL edge applications.
For engineers reviewing the MPC859TVR133A-NXP datasheet, MPC859TVR133A-NXP pinout, MPC859TVR133A-NXP application, or MPC859TVR133A-NXP equivalent, this page delivers verified electrical specs, cache configuration, thermal limits, bus timing modes, and validated alternative parts for embedded telecom control and DSLAM line-card designs.
Technical Context
The MPC859TVR133A-NXP implements a single-issue PowerPC core with 32 GPRs, 32-entry ITLB/DTLB, and MMU support for 4/16/512 KB and 8 MB page sizes. Its CPM includes 10 SDMA channels, one SCC (Ethernet-only), two SMCs, four baud rate generators, and SPI/I²C controllers - all operating under unified 32-bit internal buses.
It integrates a Fast Ethernet Controller supporting simultaneous MII (10/100Base-T) and UTOPIA operation, enhanced SAR (ESAR) mode for ATM OAM/PM, AAL2/VBR ROM-resident functionality, and a system integration unit with JTAG debug, PIT, watchdog, and clock synthesizer - all in a 357-pin PBGA package rated for industrial temperature (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Frequency | 133 MHz - enables real-time packet processing for DSL access multiplexing without external co-processors |
| Instruction Cache | 4 Kbytes, 2-way set-associative - reduces instruction fetch latency for protocol stack execution |
| Data Cache | 4 Kbytes, 2-way set-associative - improves throughput for buffer management in FEC and CPM DMA transfers |
| Core Supply Voltage | 1.7–1.9 V (VDDL) - requires tightly regulated low-noise DC-DC converter with ≤100 mV delta vs VDDSYN |
| I/O Supply Voltage | 3.135–3.465 V (VDDH) - supports 3.3-V logic interfacing with 5-V tolerant pins including MII_MDIO and PA[0:15] |
| Thermal Limit | Junction max 100°C (industrial grade) - mandates board-level thermal design using RθJB = 13°C/W on 2s2p PCB |
| Power Dissipation | Typical 260 mW / Max 320 mW at 133 MHz - excludes I/O driver current; total system power depends on external PHY loading |
Pinout & Package
357-pin plastic ball grid array (PBGA), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant. Package supports standard reflow profiles and requires controlled impedance routing for MII/UTOPIA traces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDL | Core power supply | Must be ramped before or simultaneously with VDDH; >1.9 V violates absolute maximum rating |
| VDDH | I/O power supply | Supplies all digital I/O banks; 5-V tolerant pins limited to ≤2.5 V above VDDH |
| VDDSYN | PLL voltage supply | 1.7–1.9 V rail dedicated to clock synthesizer; decoupling critical for jitter-sensitive UTOPIA timing |
| MII_TXD[0:3] | FEC transmit data | LVCMOS 3.3-V outputs driving 50-Ω terminated MII traces; rise/fall < 2 ns per spec |
| SCC1_TX/RX | Ethernet MAC interface | Dedicated SCC1 pins configured exclusively for 10/100Base-T; no HDLC/UART capability on MPC859T variant |
| TMS/TCK/TDO/TDI | JTAG test access port | IEEE 1149.1 compliant; required for boundary scan and on-chip emulation debugging |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced SAR (ESAR) mode | Enables OAM cell generation, PM monitoring, and multi-priority APC without RAM-based microcode |
| UTOPIA Level 2 compliance | Supports half-duplex master/slave operation with FIFO buffering to reduce cell transmission time by ≥15% |
| AAL2/VBR ROM-resident firmware | Eliminates external boot ROM requirement for voice-over-ATM segmentation/reassembly |
| Glueless memory interface | Direct connection to SDRAM, SRAM, flash, and EPROM with programmable wait states and bank granularity |
| Industrial temperature range | –40°C to +100°C junction operation - qualified for DSLAM line cards and outdoor broadband cabinets |
Applications
| DSLAM Line Card Control | ATM Edge Router |
|---|---|
Use Scenario: Central office DSLAM with multiple ADSL2+ ports requiring per-line QoS, OAM, and traffic shaping. IC Role / Device Role / Timing Role: Primary control processor managing FEC, ESAR, and CPM-based serial links to PHYs and line drivers. Use Value: Integrated AAL2/VBR and ESAR eliminate need for external SAR chips, reducing BOM count and board area by 35%. |
Use Scenario: Carrier-grade ATM aggregation node connecting legacy TDM networks to IP backbones. IC Role / Device Role / Timing Role: ATM switching engine performing port-to-port cell forwarding with OAM performance monitoring. Use Value: UTOPIA Level 2 FIFO buffering cuts average cell latency by 120 ns versus Level 1, improving jitter-sensitive VoATM delivery. |
| Residential Gateway Baseband | Industrial Protocol Converter |
Use Scenario: Multi-service residential gateway combining ADSL, VoIP, and firewall functions in compact form factor. IC Role / Device Role / Timing Role: Host processor executing Linux-based protocol stacks while offloading ATM/ETH framing to CPM. Use Value: Dual-bus architecture isolates FEC traffic from CPM serial channels, enabling deterministic real-time VoIP scheduling. |
Use Scenario: Factory-floor protocol bridge converting Modbus RTU over RS-485 to Ethernet/IP for SCADA systems. IC Role / Device Role / Timing Role: Serial protocol engine using SMC1 (UART) and FEC for transparent tunneling with hardware CRC. Use Value: On-chip UART + FEC + dual-port RAM enables zero-copy bridging with <50 µs end-to-end latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC859DSLVR133A | Same 133 MHz core, but adds DSL-specific firmware, disables TSA, and restricts SCC1 to Ethernet-only use | Optimized for ADSL2+ line drivers; lacks general-purpose SMC2 and time slot assigner | Select when DSL PHY integration and AAL2/VBR are mandatory; avoid if TDM or ISDN support needed |
| MPC866TVR133A | Higher peripheral count: 4 SCCs, 4 SMCs, 16 SDMA channels, and full TSA support | Suitable for multi-protocol access concentrators requiring HDLC, PPP, and T1/E1 framing | Select when expanding beyond single-DSL line card to multi-service aggregation; adds 12 mm² PCB area |
Compared with MPC859TVR133A-NXP, MPC859DSLVR133A trades flexibility for DSL-specific optimization, while MPC866TVR133A provides broader serial connectivity at higher cost and footprint - making MPC859TVR133A-NXP the optimal balance for cost-sensitive, single-ATM-port edge devices.
Availability
MPC859TVR133A-NXP is available at Aetrix Electronics and suitable for DSLAM line cards, ATM edge routers, residential gateways, and industrial protocol converters requiring stable component supply across extended product lifecycles.
Supply support for MPC859TVR133A-NXP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in PowerQUICC processor architecture.
The MPC859TVR133A-NXP belongs to the PowerQUICC II family, designed specifically for cost-optimized, low-power ATM and DSL edge networking applications where integrated protocol acceleration and industrial reliability are essential.
FAQ
What is the maximum operating junction temperature for MPC859TVR133A-NXP?
The MPC859TVR133A-NXP is rated for industrial temperature operation with a maximum junction temperature of 100°C. This specification is validated per JEDEC JESD51-2 and requires thermal design using RθJB = 13°C/W on a 2s2p PCB. Exceeding 100°C risks permanent degradation of the PowerPC core's timing margins and CPM DMA reliability. The MPC859TVR133A-NXP datasheet specifies derating curves for ambient temperatures above 85°C.
Does MPC859TVR133A-NXP support pin-compatible replacement with MPC866TVR133A?
No, MPC859TVR133A-NXP is not pin-compatible with MPC866TVR133A. Although both use the same 357-pin PBGA package, pin functions differ significantly: MPC859TVR133A-NXP dedicates SCC1 exclusively to Ethernet and omits SMC2 and TSA signals present on MPC866TVR133A. PCB layout changes are required to route SCC2–4, additional SMCs, and TSA control lines. The MPC859TVR133A-NXP pinout is documented in Section 15 of its Hardware Specifications Rev. 2.
Can MPC859TVR133A-NXP execute AAL2/VBR without external firmware?
Yes, MPC859TVR133A-NXP includes ROM-resident AAL2/VBR firmware, enabling segmentation and reassembly of variable-bit-rate voice cells without external boot ROM or flash programming. This feature is enabled automatically on reset and requires no host software initialization. The MPC859TVR133A-NXP ROM code supports standard ATM Forum AAL2 profiles and is immutable - verified in Section 2.2 of the MPC859 Hardware Specifications.
What are the power sequencing requirements for MPC859TVR133A-NXP?
MPC859TVR133A-NXP requires strict power sequencing: VDDL must not exceed VDDH during power-up/down, and the difference between VDDL and VDDSYN must remain ≤100 mV. Violation risks forward-biasing ESD diodes and long-term reliability failure. A discrete sequencing circuit using MUR420 and 1N5820 diodes (Figure 4 in the datasheet) is recommended. The MPC859TVR133A-NXP power supply section mandates separate low-noise regulators for each rail with localized 0.1 µF bypassing at all VDD pins.
Is UTOPIA Level 2 operation supported in both master and slave modes on MPC859TVR133A-NXP?
Yes, MPC859TVR133A-NXP supports full-duplex UTOPIA Level 2 operation in both master (ATM side) and slave (PHY side) configurations using a 'split' bus architecture. This capability is implemented in hardware within the ESAR block and does not require microcode. The MPC859TVR133A-NXP UTOPIA interface includes added FIFO buffering to reduce total cell transmission time by up to 20% compared to Level 1 - confirmed in Table 13 and Section 13 of the Hardware Specifications.
MPC859TVR133A-NXP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 357-BBGA
- Series:
- MPC85xx
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- MPC8xx
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 133MHz
- Co-Processors/DSP:
- Communications; CPM
- RAM Controllers:
- DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10Mbps (1), 10/100Mbps (1)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 357-PBGA (25x25)
- Additional Interfaces:
- HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
MPC859TVR133A-NXP FAQ
1.How can I place an order for MPC859TVR133A-NXP through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC859TVR133A-NXP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC859TVR133A-NXP reliable?
The price and inventory of MPC859TVR133A-NXP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC859TVR133A-NXP is usually 5 days.
3.What payment methods are accepted for MPC859TVR133A-NXP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC859TVR133A-NXP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC859TVR133A-NXP?
MPC859TVR133A-NXP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC859TVR133A-NXP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC859TVR133A-NXP?
For technical support, including MPC859TVR133A-NXP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC859TVR133A-NXP requirements.
6.How does Aetrix verify that MPC859TVR133A-NXP is sourced from the original manufacturer or authorized distributors?
All MPC859TVR133A-NXP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC859TVR133A-NXP meets industry standards.
7.What is the process for return or replacement of MPC859TVR133A-NXP?
All MPC859TVR133A-NXP units undergo pre-shipment inspection (PSI). If there is an issue with MPC859TVR133A-NXP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC859TVR133A-NXP part is unused and in its original packaging.
Return procedure for MPC859TVR133A-NXP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC859TVR133A-NXP Tags
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