NXP Semiconductors MPC860DEVR80D4

Overview

MPC860DEVR80D4 from NXP (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core and a RISC-based Communications Processor Module (CPM) in a single PBGA357 package. It delivers 80 MHz CPU operation, 4 KB instruction/4 KB data cache, IEEE 802.3u-compliant 10/100 Mbps Ethernet via SCCs, and UTOPIA-level ATM support - deployed in carrier-grade DSLAMs, enterprise routers, and industrial protocol gateways requiring deterministic real-time packet processing.

For engineers reviewing the MPC860DEVR80D4 datasheet, MPC860DEVR80D4 pinout, MPC860DEVR80D4 application, or MPC860DEVR80D4 equivalent, key selection criteria include its dual-bus architecture (CPU + CPM), 32-bit DRAM controller with eight banks, 4× SCCs supporting HDLC/UART/Ethernet, I²C and SPI interfaces, and extended temperature support (–40°C to 95°C junction).

Technical Context

The MPC860DEVR80D4 implements a split-processor architecture: a 32-bit Power Architecture™ CPU core with MMU, instruction/data caches, and branch prediction handles host-level tasks, while the independent CPM executes time-critical communication protocols (HDLC, UART, Ethernet MAC, ATM cell processing) without CPU intervention. Its memory controller supports dynamic bus sizing (8/16/32-bit), up to 256 MB per bank, and glueless interfacing to DRAM, SRAM, Flash, and PCMCIA.

It integrates four serial communications controllers (SCCs), two serial management channels (SMCs), one SPI, one I²C, four baud-rate generators, and a time-slot assigner for TDM routing. The system integration unit provides PIT, RTC, watchdog, JTAG debug, and clock synthesis - enabling full-system control from a single die.

Key Specifications

Pinout & Package

Package: 357-pin Plastic Ball Grid Array (PBGA), ZQ/VR case (5058, 25×25×1.2 mm, 1.27 mm pitch), RoHS-compliant, lead-free solder compatible.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860T and MPC855T, the MPC860DEVR80D4 uniquely combines native 10/100 Ethernet MAC, four SCCs, PCMCIA, and RTC in a single package - making it the only choice for multi-interface, carrier-grade embedded networking where integration density and protocol breadth are mandatory.

Availability

MPC860DEVR80D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, enterprise router control planes, and secure remote terminal units requiring stable component supply across extended lifecycle programs.

Supply support for MPC860DEVR80D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in Power Architecture™ microcontrollers.

The MPC860DEVR80D4 belongs to the PowerQUICC™ family - designed specifically for embedded communications infrastructure requiring real-time protocol processing, multi-interface integration, and long-term industrial reliability.

FAQ

What is the maximum operating frequency of the MPC860DEVR80D4 CPU core?

The MPC860DEVR80D4 CPU core operates at up to 80 MHz. To achieve this, the device must be configured in 2:1 mode where the CPU clock runs at twice the bus clock frequency - meaning the external bus clock must be 40 MHz. At 80 MHz CPU speed, the maximum supported bus speed remains 40 MHz, not 80 MHz, as confirmed in Section 9 of the hardware specification.

Does the MPC860DEVR80D4 support IEEE 802.3u 100 Mbps Ethernet natively?

Yes, the MPC860DEVR80D4 supports IEEE 802.3u 10/100 Mbps Ethernet natively through its four Serial Communications Controllers (SCCs). SCC1–SCC4 implement full Ethernet MAC functionality including MII interface signals (MII_TXD[0:3], MII_RXD[0:3], MII_MDC, MII_MDIO), enabling direct connection to external PHYs without additional logic.

What package type and pin count does the MPC860DEVR80D4 use?

The MPC860DEVR80D4 uses a 357-pin Plastic Ball Grid Array (PBGA) package with ZQ/VR case designation (5058, 25 mm × 25 mm, 1.27 mm pitch). This matches the mechanical data in Table 3 of the Freescale MPC860 Hardware Specifications Rev. 10 and is distinct from the ZP variant (5050) used in lower-power versions.

Can the MPC860DEVR80D4 operate in extended temperature ranges?

Yes, the MPC860DEVR80D4 is rated for extended temperature operation from –40°C to +95°C junction temperature (Tj), as specified in Table 2 (Maximum Tolerated Ratings) of the hardware specification. This makes it suitable for industrial and outdoor telecom equipment where ambient conditions exceed commercial grade limits.

What memory types does the MPC860DEVR80D4 memory controller support?

The MPC860DEVR80D4 memory controller supports DRAM, SRAM, EPROM, Flash EPROM, SIMMs, and PCMCIA memory devices - all via glueless interface. It features eight programmable banks, dynamic bus sizing (8/16/32-bit), up to 15 wait states per bank, and variable block sizes from 32 KB to 256 MB, as detailed in Section 2 Features and Table 1.