NXP Semiconductors MPC860DEZQ50D4

Overview

MPC860DEZQ50D4 from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture™ communications processor integrating a CPU core, CPM, Ethernet MAC, ATM interface, and system peripherals in a single PBGA357 package. It delivers 50 MHz CPU operation, 4 KB instruction/4 KB data cache, IEEE 802.3u 10/100 Mbps Ethernet support, and UTOPIA-level ATM cell processing for embedded networking control applications.

For engineers reviewing the MPC860DEZQ50D4 datasheet, MPC860DEZQ50D4 pinout, MPC860DEZQ50D4 application, or MPC860DEZQ50D4 equivalent, key selection considerations include its 50 MHz clock rating, 3.3 V supply with 5 V-tolerant I/O, 357-pin PBGA package, integrated real-time clock, and dual-mode (1:1/2:1) bus timing configuration.

Technical Context

The MPC860DEZQ50D4 implements a single-issue 32-bit Power Architecture core with MMU, 32 GPRs, and branch prediction logic. Its Communications Processor Module (CPM) includes an enhanced QUICC engine with four SCCs, two SMCs, one SPI, one I²C port, and time-slot assigner supporting T1/E1/ISDN framing.

It integrates a memory controller supporting DRAM, SRAM, Flash, and PCMCIA sockets; a system integration unit with PIT, watchdog, RTC, and JTAG debug; and dual Ethernet/ATM interfaces - with IEEE 802.3u compliance on SCC channels and UTOPIA 1.0–2.0 ATM support at up to 70 Mbps cell rate.

Key Specifications

Pinout & Package

Package: 357-ball plastic ball grid array (PBGA), ZQ designation (Freescale case 1103D-02), 25 mm × 25 mm footprint, 1.27 mm ball pitch, 1.2 mm height.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC860TZQ50D4 and MPC855TZQ50D4, the MPC860DEZQ50D4 provides optimized cost and power for Ethernet-centric embedded controllers - trading ATM and PCI for lower gate count, reduced thermal load (656 mW vs. 722 mW), and simplified layout with fewer high-speed interface constraints.

Availability

MPC860DEZQ50D4 is available at Aetrix Electronics and suitable for DSL access multiplexers, industrial protocol gateways, secure remote terminal units, and legacy telecom node controllers requiring stable component supply across extended product lifecycles.

Supply support for MPC860DEZQ50D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and communication markets.

The MPC860 family belongs to NXP's PowerQUICC™ line of integrated communications processors, designed specifically for cost-sensitive, low-power embedded networking applications requiring real-time serial protocol handling and Ethernet bridging.

FAQ

What is the maximum operating frequency of the MPC860DEZQ50D4?

The MPC860DEZQ50D4 is rated for a maximum CPU frequency of 50 MHz in 1:1 bus mode. It supports 2:1 mode operation up to 66 MHz CPU clock with a 33 MHz bus, but the 'D4' speed grade specifies 50 MHz as its guaranteed maximum. This is confirmed in Table 5 of the Freescale MPC860 Hardware Specifications Rev. 10, where die revision D.4 lists 50 MHz (1:1) with typical power dissipation of 656 mW. The MPC860DEZQ50D4 must be configured accordingly in software and hardware to meet timing margins at this speed.

Does the MPC860DEZQ50D4 support IEEE 802.3u 10/100 Mbps Ethernet?

Yes, the MPC860DEZQ50D4 supports full IEEE 802.3u 10/100 Mbps Ethernet operation via its SCC1–SCC4 serial controllers, as explicitly stated in Section 2 Features and Table 1 of the MPC860 Hardware Specifications. It implements the Media Independent Interface (MII) and supports both half- and full-duplex modes. However, this capability requires external PHY hardware and proper MII signal routing - the MPC860DEZQ50D4 itself contains only the MAC layer and associated DMA and buffer management logic.

What package type and pin count does the MPC860DEZQ50D4 use?

The MPC860DEZQ50D4 uses a 357-ball plastic ball grid array (PBGA) package with ZQ designation (Freescale case number 1103D-02), measuring 25 mm × 25 mm with 1.27 mm ball pitch and 1.2 mm height. This is documented in Table 3 ("Package Description") and Figure 1 of the MPC860 Hardware Specifications Rev. 10. The ZQ suffix in the part number directly maps to this PBGA357 mechanical form factor, distinguishing it from the ZP variant (same pin count, thinner 0.9 mm profile).

Is the MPC860DEZQ50D4 pin-compatible with other MPC860 variants like MPC860T or MPC860P?

No, the MPC860DEZQ50D4 is not fully pin-compatible with MPC860T or MPC860P despite sharing the same ZQ PBGA357 package. Differences in feature sets - such as ATM interface signals (present on MPC860T, absent on MPC860DE), PCMCIA control pins (present on MPC860P, omitted on MPC860DE), and cache size configuration - result in distinct pin assignments for functionally unused balls. Table 1 and Section 14 of the MPC860 Hardware Specifications confirm that MPC860DE lacks UTOPIA and PCMCIA signals present on other variants, making direct PCB substitution invalid without layout revision.

What is the recommended power supply configuration for the MPC860DEZQ50D4?

The MPC860DEZQ50D4 requires three independent 3.3 V supplies: VDDH for I/O (5 V-tolerant), VDDL for the core CPU/CPM, and VDDSYN for the PLL. Per Table 6, operating voltage must be 3.135–3.465 V at 50 MHz. Each VDD pin must be bypassed with ≥4 × 0.1 µF capacitors placed within 0.5 inch of the package, and a 4-layer PCB with dedicated VCC/GND planes is strongly recommended. KAPWR must be maintained at ≥2.0 V during power-down to retain RTC and register state, as specified in DC Characteristics section.