NXP Semiconductors MPC860DPVR80D4

Overview

MPC860DPVR80D4 from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ integrated communications controller combining a 32-bit Power Architecture™ CPU core with a dedicated RISC communications processor module (CPM), 16 KB instruction cache, 8 KB data cache, and integrated Ethernet, ATM, SCC, SMC, SPI, I²C, and PCMCIA interfaces. It operates at 80 MHz with 3.3 V supply and targets embedded networking and telecom control applications.

For engineers reviewing the MPC860DPVR80D4 datasheet, MPC860DPVR80D4 pinout, MPC860DPVR80D4 application, or MPC860DPVR80D4 equivalent, key selection criteria include its 80 MHz CPU frequency, dual-cache configuration, IEEE 802.3u-compliant 10/100 Mbps Ethernet support, UTOPIA-level ATM interface, and PBGA357 package compatibility with industrial temperature range (–40°C to +95°C junction).

Technical Context

The MPC860DPVR80D4 implements a split-processor architecture: a 32-bit Power Architecture CPU core with MMU, instruction/data caches, and memory management unit handles general-purpose tasks, while the independent CPM executes time-critical communication protocols-including HDLC, UART, IrDA, BISYNC, and AAL5-offloading the main CPU. Its bus interface supports dynamic 8/16/32-bit data width and up to 66 MHz bus clock (with 80 MHz CPU in 2:1 mode).

It integrates a system integration unit (SIU) with real-time clock, watchdog timer, periodic interrupt timer, JTAG debug interface, and clock synthesizer; the memory controller supports eight banks with DRAM, SRAM, Flash, and EPROM glueless interfacing, programmable wait states, and boot-selectable chip-width options (8/16/32-bit).

Key Specifications

Pinout & Package

Package: Plastic Ball Grid Array (PBGA), 357-ball, 25 mm × 25 mm footprint, 1.27 mm ball pitch, ZQ/VR package code per Freescale case number 5058 (1103D-02). Thermal pad on underside requires solder connection to PCB ground plane for optimal thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications controller applications.

Compared with MPC860DPVR80D4, MPC860PZQ80D4 delivers identical functionality with minor thermal profile variation, whereas MPC855TZQ80D4 trades communications breadth (ATM, dual Ethernet MACs, PCMCIA) for USB integration-making it a domain-specific alternative rather than a drop-in substitute.

Availability

MPC860DPVR80D4 is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, secure RTUs, and legacy telecom switch interfaces requiring stable component supply, long-lifecycle support, and verified industrial temperature operation.

Supply support for MPC860DPVR80D4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture™ microcontrollers.

The MPC860DPVR80D4 belongs to the PowerQUICC™ family-designed specifically for embedded communications infrastructure requiring integrated CPU, communications coprocessor, and multi-protocol networking peripherals in a single SoC.

FAQ

What is the maximum operating frequency of the MPC860DPVR80D4 CPU core?

The MPC860DPVR80D4 CPU core operates at a maximum frequency of 80 MHz. This requires configuration in 2:1 CPU-to-bus mode, limiting the external bus clock to 40 MHz. The device's DC specifications mandate 3.135–3.465 V supply voltage for stable operation at this speed, and thermal design must maintain junction temperature ≤95°C under full load. MPC860DPVR80D4 achieves this via its integrated PLL and clock synthesizer, which derive the core clock from EXTAL or EXTCLK inputs.

Does the MPC860DPVR80D4 support IEEE 802.3u 100 Mbps Ethernet?

Yes, the MPC860DPVR80D4 supports full IEEE 802.3u 10/100 Mbps Ethernet via its integrated Fast Ethernet Controller (FEC). It implements MII and RMII interfaces, supports auto-negotiation, full/half-duplex operation, and hardware checksum offload. However, 100 Mbps operation requires proper PCB layout (≤6 inch trace lengths), 50-pF load compliance, and stable 3.3 V supply-verified in the AC timing table B7–B19 for 40 MHz bus operation. MPC860DPVR80D4 does not support Gigabit Ethernet.

What package type and pin count does the MPC860DPVR80D4 use?

The MPC860DPVR80D4 uses a 357-ball Plastic Ball Grid Array (PBGA) package with 25 mm × 25 mm footprint and 1.27 mm ball pitch, designated ZQ/VR per Freescale case number 5058 (1103D-02). It features an exposed thermal pad on the underside requiring solder connection to a PCB ground plane for thermal management. The VR suffix confirms the 1.2 mm mold compound thickness variant, distinguishing it from the ZQ (1.15 mm) version. MPC860DPVR80D4 shares identical pinout and ball map with other MPC860D-series variants in the same package code.

Can the MPC860DPVR80D4 execute both CPU and CPM tasks simultaneously?

Yes, the MPC860DPVR80D4 features true hardware concurrency: its 32-bit Power Architecture™ CPU core and separate RISC Communications Processor Module (CPM) operate independently with dedicated buses, caches, and interrupt controllers. The CPM handles time-critical serial protocols (HDLC, UART, ATM cell processing) autonomously using its 8 KB dual-port RAM and 16 SDMA channels-freeing the CPU for application-layer tasks. This architecture is confirmed in the MPC860 Hardware Specifications Rev. 10, Section 1 (Overview) and Section 2 (Features), and is fundamental to MPC860DPVR80D4's suitability for real-time communications systems.

What is the industrial temperature range supported by the MPC860DPVR80D4?

The MPC860DPVR80D4 supports an extended industrial temperature range of –40°C to +85°C ambient, with junction temperature rated up to +95°C. This is specified in Table 2 (Maximum Tolerated Ratings) of the Freescale MPC860 Hardware Specifications Rev. 10. Operation within this range requires adherence to thermal design guidelines-including use of four-layer PCBs with power/ground planes, proper VDD/GND bypassing, and thermal pad soldering-especially at 80 MHz CPU frequency where power dissipation reaches 909 mW (max, 3.5 V). MPC860DPVR80D4's ZQ/VR package provides validated thermal resistance (RθJB = 14°C/W) for these conditions.